Surface treatment solutions for gold and gold alloys

1. A surface treatment method for gold or gold alloy comprising: a) providing a copper or copper alloy-made electronic component, b) nickel plating the copper or copper alloy-made electronic component, c) gold or gold alloy plating the nickel, and d) contacting a surface of the gold or the gold alloy with an aqueous solution consisting of a cationic polymer, wherein the cationic polymer comprises a reaction product of a nitrogen-containing heterocyclic compound and epihalohydrin, a phosphorus compound, water, and optionally a pH adjuster and a wetting agent, to seal pinholes in the gold or gold alloy.

2. The surface treatment method of claim 1 , wherein the phosphorus compound is selected from the group consisting of phosphoric acids, polyphosphoric acids and salts thereof and phosphate esters.

3. The surface treatment method of claim 1 , wherein the cationic polymer is in amounts of 0.01 to 70 g/L, and the phosphorus compound is in amounts of 0.01 to 50 g/L.

4. The surface treatment method of claim 3 , wherein the cationic polymer is in amounts of 1 to 20 g/L.

5. The surface treatment method of claim 3 , wherein the phosphorus compound is in amounts of 10 to 30 g/L.

6. The surface treatment method of claim 1 , wherein a pH of the aqueous solution is from 6-12.

7. The surface treatment method of claim 6 , wherein the pH of the aqueous solution is from 8-12.

8. The surface treatment method of claim 1 , wherein the nitrogen-containing heterocyclic compound is chosen from imidazole or pyridine.

9. The surface treatment method of claim 1 , wherein the epihalohydrin is chosen from epihalohydrin or epibromohydrin.

10. The surface treatment method of claim 1 , wherein the surface treatment with the aqueous solution is done without performing electrolysis.