IP Library Granted Patent US 10,458,032
Granted Patent B2
US 10,458,032 · App. 15/947,949 · Granted Oct 29, 2019

Environmentally friendly nickel electroplating compositions and methods

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Quick Facts
Patent No.
US 10,458,032
App. No.
15/947,949
Granted
Oct 29, 2019
Kind
B2
Abstract

Environmentally friendly nickel electroplating compositions enable the electroplating of nickel deposits which are bright and uniform and inhibit corrosion of gold layers deposited on the bright and uniform nickel deposits. The environmentally friendly nickel electroplating compositions can be used to electroplate bright and uniform nickel deposits on various substrates over a wide current density range.

Claims (19)

1. A nickel electroplating composition comprising one or more sources of nickel ions, one or more sources of acetate ions, sodium saccharinate and one or more N-benzylpyridinium sulfonate compounds having formula:

wherein R 1 and R 2 are independently chosen from hydrogen, hydroxyl and (C 1 -C 4 ) alkyl.

2. The nickel electroplating composition of claim 1 , wherein the one or more N-benzylpyridinium sulfonate compounds is in amounts of at least 0.5 ppm.

3. The nickel electroplating composition of claim 1 , wherein the N-benzylpyridinium sulfonate compound is N-benzylpyridinium-3-sulfonate.

4. The nickel electroplating composition of claim 1 , further comprising one or more sources of chloride.

5. The nickel electroplating composition of claim 1 , further comprising one or more surfactants.

6. The nickel electroplating composition of claim 1 , wherein the nickel electroplating composition has a pH of 2 to 6.

7. A method of electroplating nickel metal on a substrate comprising:

a) providing the substrate;

b) contacting the substrate with a nickel electroplating composition comprising one or more sources of nickel ions, one or more sources of acetate ions, sodium saccharinate and one or more N-benzylpyridinium sulfonate compounds having formula:

wherein R 1 and R 2 are independently chosen from hydrogen, hydroxyl and (C 1 -C 4 ) alkyl; and

c) applying an electric current to the nickel electroplating composition and substrate to electroplate a bright and uniform nickel deposit adjacent the substrate.

8. The method of claim 7 , wherein the electric current has a current density of at least 0.1 ASD.

9. The method of claim 7 , wherein the one or more N-benzylpyridinium sulfonate compounds are in amounts of at least 0.5 ppm.

10. The method of claim 7 , wherein the N-benzylpyridinium sulfonate compound is N-benzylpyridinium-3-sulfonate.

11. The method of claim 7 , wherein the nickel electroplating composition further comprises one or more sources of chloride.

12. The method of claim 7 , wherein the nickel electroplating composition further comprises one or more surfactants.

13. The method of claim 7 , wherein the nickel electroplating composition has a pH of 2 to 6.

14. The method of claim 7 , further comprising depositing a gold or gold alloy layer adjacent the bright and uniform nickel deposit.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2019
From: LIPSCHUTZ, MICHAEL
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 051005/0013 →