IP Library Granted Patent US 8,142,637
Granted Patent B2
US 8,142,637 · App. 13/197,173 · Granted Mar 27, 2012

Gold alloy electrolytes

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Quick Facts
Patent No.
US 8,142,637
App. No.
13/197,173
Granted
Mar 27, 2012
Kind
B2
Abstract

Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Claims (6)

1. A method of making an article comprising:

a) providing a composition comprising one or more sources of gold ions, one or more sources of silver ions, one or more sources of copper ions, one or more dithiocarboxylic acids having a non-protic carbon atom in alpha position to the dithiocarboxyl functionality, salts and esters thereof, and one or more mercapto-tetrazoles, mercapto-triazoles and salts thereof;

b) immersing a substrate into the composition; and

c) electroplating at a current density of 0.05 ASD to 10 ASD and by repeated cycles ranging from 25 ms with current turned on followed by 100 ms with the current turned off to 100 ms with the current turned on followed by 25 ms with the current turned off to form a gold-silver-copper alloy on the substrate of 18 karats and 2N or 18 karats and 3N.

2. The method of claim 1 , wherein the current density is 0.1 ASD to 4 ASD.

3. The method of claim 1 , wherein the gold-silver-copper alloy on the substrate is 0.5 to 25 microns thick.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →