IP Library Granted Patent US 11,940,731
Granted Patent B2
US 11,940,731 · App. 16/449,955 · Granted Mar 26, 2024

Photoresist topcoat compositions and methods of processing photoresist compositions

Inventors: Irvinder Kaur (Northborough, MA); Cong Liu (Shrewsbury, MA); Doris Kang (Shrewsbury, MA); Chunyi Wu (Shrewsbury, MA)
Assignee: Rohm and Haas Electronic Materials LLC
G03F7/11C09D133/14C09D133/16C08F220/281C08F220/283C08F220/382C08F220/387G03F7/162G03F7/168G03F7/2041G03F7/322G03F7/38
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Quick Facts
Patent No.
US 11,940,731
App. No.
16/449,955
Granted
Mar 26, 2024
Kind
B2
Abstract

Photoresist topcoat compositions comprise: a matrix polymer and a surface active polymer, wherein the surface active polymer comprises polymerized units of the following general formula (I): wherein: R 1 represents a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 haloalkyl group; R 2 independently represents a hydrogen atom or an optionally substituted alkyl group, wherein at least one R 2 is not a hydrogen atom, wherein the R 2 groups taken together optionally form a cyclic structure, and wherein the total number of carbon atoms for the R 2 groups taken together is from 2 to 20; R 3 represents an optionally substituted C1-C4 alkylene group, wherein an R 2 group optionally forms a cyclic structure with R 3 ; and R 4 independently represents C1-C4 fluoroalkyl groups; wherein the total polymerized units of general formula (I) are present in the surface active polymer in an amount of 95 wt % or more based on total polymerized units of the surface active polymer; and wherein the surface active polymer is present in the composition in an amount of from 0.1 to 30 wt % based on total solids of the composition; and an organic-based solvent system comprising a plurality of organic solvents. The invention finds particular applicability in the manufacture of semiconductor devices.

Claims (34)

1. A photoresist topcoat composition, comprising:

a matrix polymer;

a surface active polymer, wherein the surface active polymer comprises polymerized units of the following general formula (I):

wherein: R 1 represents a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 haloalkyl group; R 2 independently represents a hydrogen atom or an optionally substituted alkyl group, wherein at least one R 2 is not a hydrogen atom, wherein the R 2 groups taken together optionally form a cyclic structure, and wherein the total number of carbon atoms for the R 2 groups taken together is from 2 to 20; R 3 represents an optionally substituted C1-C4 alkylene group, and an R 2 group optionally forms a cyclic structure with R 3 ; and R 4 independently represents C1-C4 fluoroalkyl groups;

wherein the total polymerized units of general formula (I) are present in the surface active polymer in an amount of 95 wt % or more based on total polymerized units of the surface active polymer; and wherein the surface active polymer is present in the composition in an amount of from 0.1 to 30 wt % based on total solids of the composition;

an acid generator compound; and

an organic-based solvent system comprising a plurality of organic solvents.

2. The photoresist topcoat composition of claim 1 , wherein total polymerized units of general formula (I) are present in the surface active polymer in an amount of 100 wt % based on total polymerized units of the surface active polymer.

3. The photoresist topcoat composition of claim 1 , wherein the surface active polymer is a homopolymer.

4. The photoresist topcoat composition of claim 1 , wherein at least one R 2 is an optionally substituted branched C3-C12 alkyl group.

5. The photoresist topcoat composition of claim 1 , wherein the R 2 groups taken together form a cyclic structure.

6. The photoresist topcoat composition of claim 1 , wherein R 4 is a trifluoromethyl group.

7. The photoresist topcoat composition of claim 1 , further comprising an additive polymer that is different from the matrix polymer and the surface active polymer.

8. A coated substrate, comprising:

a photoresist layer on a substrate; and

a topcoat layer formed from a photoresist topcoat composition of claim 1 on the photoresist layer.

9. A method of processing a photoresist composition, comprising:

(a) applying a photoresist composition over a substrate to form a photoresist layer;

(b) applying over the photoresist layer a photoresist topcoat composition to form a topcoat layer, wherein the photoresist topcoat composition, comprises:

a matrix polymer;

a surface active polymer, wherein the surface active polymer comprises:

polymerized units of the following general formula (I):

wherein: R 1 represents a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 haloalkyl group; R 2 independently represents a hydrogen atom or an optionally substituted alkyl group, wherein at least one R 2 is not a hydrogen atom, wherein the R 2 groups taken together optionally form a cyclic structure, and wherein the total number of carbon atoms for the R 2 groups taken together is from 2 to 20; R 3 represents an optionally substituted C1-C4 alkylene group, and an R 2 group optionally forms a cyclic structure with R 3 ; and R 4 independently represents C1-C4 fluoroalkyl groups;

wherein the total polymerized units of general formula (I) are present in the surface active polymer in an amount of 95 wt % or more based on total polymerized units of the surface active polymer; and wherein the surface active polymer is present in the composition in an amount of from 0.1 to 30 wt % based on total solids of the composition; and

an organic-based solvent system comprising a plurality of organic solvents;

(c) exposing the topcoat layer and the photoresist layer to activating radiation; and

(d) contacting the exposed topcoat layer and photoresist layer with an aqueous base developer to form a resist pattern.

10. The method of claim 9 , wherein the topcoat layer is formed by spin-coating, and the surface active polymer migrates to an upper surface of the topcoat layer during the spin-coating, wherein an upper surface of the topcoat layer consists essentially of the surface active polymer.

11. The method of claim 9 , wherein total polymerized units of general formula (I) are present in the surface active polymer in an amount of 100 wt % based on total polymerized units of the surface active polymer.

12. The method of claim 9 , wherein the surface active polymer is a homopolymer.

13. The method of claim 9 , wherein at least one R 2 is an optionally substituted branched C3-C12 alkyl group.

14. The method of claim 9 , wherein the R 2 groups taken together form a cyclic structure.

15. The method of claim 9 , wherein R 4 is a trifluoromethyl group.

16. The method of claim 9 , further comprising an additive polymer that is different from the matrix polymer and the surface active polymer.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2024
From: KAUR, IRVINDER; KANG, DORIS; LIU, CONG; WU, CHUNYI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 066389/0371 →