IP Library › Patent Application 18163467
Patent Application
App. No. 18/163,467

SILVER ELECTROPLATING COMPOSITIONS AND METHODS FOR ELECTROPLATING ROUGH MATT SILVER

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Quick Facts
Patent No.
US None
App. No.
18/163,467
Abstract

Silver electroplating compositions deposit rough, matt silver having needle-like grain structures. The rough, matt, silver deposits enable good adhesion with dielectric materials, even in environments of high relative humidity.

Claims (3)

1 .- 15 . (canceled)

16 . An article comprising a rough, matt silver layer adjacent a surface of a substrate, wherein the rough, matt silver layer has a Sa of 0.1-0.4 μm and an Sdr of 5-50%.

17 . The article of claim 16 , wherein the surface of the substrate is copper or copper alloy.

Assignments (1)
CHANGE OF NAME Recorded Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS LLC
To: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC
Reel/Frame 069272/0383 →