IP Library Granted Patent US 11,848,491
Granted Patent B2
US 11,848,491 · App. 17/490,831 · Granted Dec 19, 2023

Low dielectric, low loss radomes

Inventors: Hoang Dinh Do (Canton, MA); Richard N. Johnson (Encinitas, CA); Douglas S. McBain (Wadsworth, OH)
Assignee: Laird Technologies, Inc.
H01Q1/422B32B3/12B32B5/024B32B5/18B32B5/245B32B7/025B32B27/12B32B2250/03B32B2250/40B32B2260/021B32B2260/046B32B2262/0253B32B2262/0269B32B2264/107B32B2307/204B32B2307/3065B32B2307/54B32B2307/558B32B2307/706B32B2307/712
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,848,491
App. No.
17/490,831
Granted
Dec 19, 2023
Kind
B2
Abstract

A low dielectric, low loss radome comprising microspheres integrated into a matrix. The microspheres reduce overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome.

Claims (52)

1. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein:

the radome comprises first and second layers and a core between the first and second layers;

the first and second layers comprise the microspheres integrated into the matrix;

the first and second layers further comprise fibers integrated into the first and second layers for reinforcement and mechanical strength; and

the microspheres are integrated into the first and second layers and reduce the overall dielectric constant of the radome, whereby the first and second layers each have a dielectric constant of about 3.6 or less.

2. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome comprises first and second layers and a core between the first and second layers, wherein the first and second layers comprise the microspheres integrated into the matrix, and wherein the core comprises:

microspheres within a thermoset matrix and having a dielectric constant of about 1.7 or less; or

a thermoplastic honeycomb core having a dielectric constant of about 1.03 or less.

3. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome comprises first and second layers and a core between the first and second layers, wherein the first and second layers comprise the microspheres integrated into the matrix, and wherein:

the core comprises a thermoset core such that the radome is thermoformed and cured; or

the core comprises a thermoplastic foam core such that the radome is thermoformable.

4. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome comprises first and second layers and a core between the first and second layers, wherein the first and second layers comprise the microspheres integrated into the matrix, and wherein the radome comprises:

a partially cured B-stage material configured to be formed or shaped in three dimensions and fully cured; and/or

a B-staged epoxy resin including fabric and/or fibers embedded therein.

5. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome comprises first and second thermoplastic layers and a thermoplastic core between the first and second thermoplastic layers, whereby the radome is thermoformable, wherein:

the thermoplastic core comprises a thermoplastic foam or a thermoplastic honeycomb; and

the first and second thermoplastic layers comprise the microspheres integrated into the matrix.

6. The radome of claim 5 , wherein:

the first and second thermoplastic layers further comprise fibers integrated into the first and second thermoplastic layers for reinforcement and mechanical strength; and

the microspheres are integrated into the first and second thermoplastic layers and reduce the overall dielectric constant of the radome, whereby the first and second thermoplastic layers each have a dielectric constant of about 2.8 or less.

7. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein:

the matrix comprises an injection moldable resin; and

the radome is an injection molded radome configured to have an overall dielectric constant within a range from about 1.5 to about 2.5 and an overall low loss tangent or dissipation factor (Df) less than about .01 at frequencies from about 20 GHz to about 90 GHz and/or from about 20 GHz to about 50 GHz and/or from about 24 GHz to about 40 GHz.

8. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein:

the matrix comprises an injection moldable resin; and/or

the matrix comprises polypropylene; and/or

the matrix comprises a blend of polycarbonate and polybutylene terephthalate.

9. The radome of claim 8 , further comprising fibers, and wherein the fibers and the microspheres are integrated into the matrix such that the radome has a homogenous and/or unitary structure that is thermoformable prior to cure.

10. The radome of claim 9 , wherein the homogenous and/or unitary structure is a single layer structure.

11. The radome of claim 8 , wherein the radome comprises first and second layers and a core between the first and second layers, wherein the first and second layers comprise the microspheres integrated into the matrix.

12. The radome of claim 8 , further comprising fibers within the matrix for reinforcement and mechanical strength.

13. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome further comprises fibers within the matrix, wherein:

the fibers comprise one or more of flame-resistant meta-aramid material, open weave polymeric fabric, high-density polyethylene, ultra-high molecular weight polyethylene, high density plastic fibers with a low dielectric constant, and/or high density polypropylene fibers; and

the microspheres comprise one or more of hollow glass microspheres, hollow plastic microspheres, and/or hollow ceramic microspheres.

14. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome further comprises fibers, and wherein the fibers and the microspheres are integrated into the matrix such that the radome does not have outer and inner skin layers disposed on opposite sides of a core that define a three-layer A-sandwich structure.

15. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome further comprises flame retardant applied to and/or integrated into at least a portion of the radome such that the radome has a UL94 flame rating of V0.

16. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome is configured to be anisotropic and/or configured to reduce cross polarization differences between horizontal and vertical polarizations.

17. A low dielectric, low loss radome comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the radome has a dielectric constant less than 2.5 through a thickness of the radome, wherein the radome is configured to have:

a dielectric constant of about 2 or less at frequencies from about 20 GHz to about 90 GHz; and/or

a dielectric constant of about 1.85 or less at frequencies from about 20 GHz to about 50 GHz; and/or

a dielectric constant of about 1.7 or less at frequencies from about 24 GHz to about 40 GHz.

18. A material for a low dielectric, low loss radome, the material comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the material has a dielectric constant less than 2.5 through a thickness of the material, wherein the microspheres comprise one or more of hollow glass microspheres, hollow plastic microspheres, and/or hollow ceramic micro spheres; and wherein:

the matrix comprises an injection moldable resin, polypropylene, and/or a blend of polycarbonate and polybutylene terephthalate; and/or

the material comprises fibers within the matrix, the fibers comprising one or more of flame-resistant meta-aramid material, open weave polymeric fabric, high-density polyethylene, ultra-high molecular weight polyethylene, high density plastic fibers with a low dielectric constant, and/or high density polypropylene fibers.

19. A material for a low dielectric, low loss radome, the material comprising microspheres integrated into a matrix, the microspheres reducing overall dielectric constant, whereby the material has a dielectric constant less than 2.5 through a thickness of the material, wherein the material further comprises flame retardant applied to and/or integrated into the material such that the material has a UL94 flame rating of V0, and wherein the material is configured to have:

a dielectric constant of about 2 or less at frequencies from about 20 GHz to about 90 GHz; and/or

a dielectric constant of about 1.85 or less at frequencies from about 20 GHz to about 50 GHz; and/or

a dielectric constant of about 1.7 or less at frequencies from about 24 GHz to about 40 GHz.

20. A method of making a low dielectric, low loss radome having a dielectric constant of about 2.5 or less, the method comprising integrating microspheres into a matrix for reducing overall dielectric constant such that a dielectric constant is less than 2.5 through a thickness of the radome, wherein the microspheres comprise one or more of hollow glass microspheres, hollow plastic microspheres, and/or hollow ceramic microspheres, and wherein the method includes:

thermoforming a thermoplastic core between first and second thermoplastic layers to thereby provide a thermoformed radome; the thermoplastic core comprises a thermoplastic foam or a thermoplastic honeycomb; and the first and second thermoplastic layers comprise the microspheres integrated into the matrix; or

injection molding a composite material including the microspheres integrated into the matrix to thereby provide an injection molded radome; or

integrating fibers into the matrix, the fibers comprising one or more of flame-resistant meta-aramid material, open weave polymeric fabric, high-density polyethylene, ultra-high molecular weight polyethylene, high density plastic fibers with a low dielectric constant, and/or high density polypropylene fibers.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2021
From: DO, HOANG DINH; JOHNSON, RICHARD N.; MCBAIN, DOUGLAS S.
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 057660/0309 →