Chemical mechanical polishing pads for improved removal rate and planarization

1. A chemical mechanical (CMP) polishing pad having a low damping component for polishing a substrate chosen from at least one of a memory and a semiconductor substrate comprising: a polishing layer adapted for polishing the substrate which is a polyurethane reaction product of a thermosetting reaction mixture comprising a curative of 4,4′-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4′-methylene-bis-o-(2-chloroaniline) (MbOCA) in a weight ratio of MCDEA to MbOCA of from 3:7 to 1:0, and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. % and formed from one or two aromatic diisocyanates or a mixture of an aromatic diisocyanate and up to 67 wt. % of an alicyclic diisocyanate, based on the total weight of the aromatic and alicyclic diisocyanates, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG as reactants, wherein the polyurethane reaction product in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 60 to 90, further wherein the polyurethane reaction product in the polishing layer has a shear storage modulus (G′) at 65° C. of from 125 to 500 MPa, and, still further wherein the polishing layer has a damping component (G″/G′ measured by shear dynamic mechanical analysis (DMA), ASTM D5279-08 (2008)) at 50° C. of from 0.06 to 0.13.

2. The CMP polishing pad as claimed in claim 1 , wherein the curative comprises a mixture of MCDEA and 4,4′-methylene-bis-o-(2-chloroaniline) (MbOCA) in a weight ratio of MCDEA to MbOCA of from 4:6 to 1:0.

3. The CMP polishing pad as claimed in claim 1 , wherein the aromatic diisocyanate or mixture thereof with an alicyclic diisocyanate is chosen from toluene diisocyanate (TDI), TDI mixed with up to 20 wt. %, based on the total weight of the aromatic diisocyanate, of methylene diphenyl diisocyanate (MDI), or a mixture of TDI and up to 67 wt. % of H 12 MDI, based on the total weight of the aromatic and alicyclic diisocyanates.

4. The CMP polishing pad as claimed in claim 1 , wherein the polyisocyanate prepolymer has an unreacted isocyanate (NCO) concentration of from 8.6 to 10.3 wt. % of the polyisocyanate prepolymer,

wherein the polyol used to form the polyisocyanate prepolymer is chosen from (i) PTMEG, (ii) PPG or (iii) a polyol blend of PTMEG and PPG in a ratio of PTMEG to PPG of from 1:0 to 1:4, or, for example, from 12:1 to 1:1.

5. The CMP polishing pad as claimed in claim 1 , wherein the stoichiometric ratio of the sum of the total moles of amine (NH 2 ) groups and the total moles of hydroxyl (OH) groups in the reaction mixture to the total moles of unreacted isocyanate (NCO) groups in the reaction mixture ranges from 0.90:1 to 1.20:1.

6. The CMP polishing pad as claimed in claim 1 , wherein the polishing layer of the CMP polishing pad further comprises microelements chosen from entrapped gas bubbles, hollow core polymeric materials, liquid filled hollow core polymeric materials, and fillers.

7. The CMP polishing pad as claimed in claim 6 , wherein the polishing pad or polishing layer has a porosity of from 0.01 to 53%.

8. The CMP polishing pad as claimed in claim 1 , wherein the polishing pad or polishing layer has a density of 0.55 to 1.17 g/cm 3 .

9. The CMP polishing pad as claimed in claim 1 , wherein the polishing layer comprises a polyurethane reaction product having a hard segment of from 45 to 70%, based on the total weight of the thermosetting reaction mixture.

10. A method of chemical mechanical (CMP) polishing a substrate, comprising: Providing a substrate selected from at least one of a three dimensional semiconductor or memory substrate; providing a chemical mechanical (CMP) polishing pad as claimed in claim 1 ; providing an abrasive polishing medium; and creating dynamic contact between a polishing surface of the polishing layer of the CMP polishing pad, the abrasive polishing medium and the substrate to polish a surface of the substrate at a downforce (DF) of from 103 to 550 hPa (1.5 to 8 psi); and, conditioning of the polishing surface of the polishing pad with an abrasive conditioner.