Patent Assignment
Reel/Frame 042911/0638
Assignment of Assignor's Interest
Recorded: 2017-07-05
Pages: 5
Assignors
WEIS, JONATHAN G.
Executed: 2017-06-19
CHIOU, NAN-RONG
Executed: 2017-06-19
QIAN, BAINIAN
Executed: 2017-07-05
JACOB, GEORGE C.
Executed: 2017-06-20
Assignees
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 27, 2025
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 071765/0928 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →