Copper electroplating baths containing compounds of reaction products of amines, polyacrylamides and sultones
Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
1. An electroplating bath comprising one or more sources of copper ions, one or more accelerators, one or more suppressors, one or more electrolytes and one or more compounds comprising a reaction product of one or more compounds having the formula:
wherein R 24 -R 27 are independently chosen from hydrogen, (C 1 -C 3 )alkyl, hydroxyl, and acetate moiety, an amine and an acrylamide, wherein the amine has a formula:
wherein R′ is hydrogen; R comprises H 2 N(CH 2 ) m —, HO—(CH 2 ) m —, Q-(CH 2 ) m —, a moiety having a structure:
a moiety having a structure:
or
a moiety having a structure:
where R 1 -R 14 are independently chosen from hydrogen and (C 1 -C 3 )alkyl; m is an integer from 2-12, n is an integer from 2-10, p is an integer from 1-10, q is an integer from 2-10 and r, s and t are numbers from 1 to 10; Q is a 5-6 membered heterocyclic ring having one or two nitrogen atoms in the ring or Q is a benzene sulfonamide moiety; and the acrylamide has a formula:
wherein R″ is a moiety having a structure:
a moiety having a structure:
a moiety having a structure:
or
a substituted or unsubstituted triazinane ring or a piperizine ring, wherein R 15 comprises hydrogen or hydroxyl; u is an integer from 1 to 2 and v, x and y are independently integers of 1 to 10; R 16 and R 17 are independently chosen from hydrogen and carbonyl moiety, and with the proviso that when R 16 and R 17 are carbonyl moieties, the carbonyl moieties form a covalent bond with the carbons of the vinyl groups of formula (VI) displacing a hydrogen to form the covalent bond with the carbons of the vinyl groups to form a five membered heterocyclic ring.
2. The electroplating bath of claim 1 , further comprising one or more sources of tin ions.
3. The electroplating bath of claim 1 , wherein the one or more compounds are in amounts of 0.01 ppm to 1000 ppm.
4. A method of electroplating comprising:
a) providing a substrate;
b) immersing the substrate in the electroplating bath of claim 1 ;
c) applying a current to the substrate and the electroplating bath; and
d) electroplating copper on the substrate.
5. The method of claim 4 , wherein the substrate comprises a plurality of one or more of through-holes, trenches and vias.