Methods for establishing thermal joints between heat spreaders or lids and heat sources

1. A method of establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the method comprising:

using a solvent-based thermal interface material having an initial flowable state to form a thin bond line between the heat source and another component of the electronic device to thereby establish the thermal path without heating the solvent-based thermal interface material to a temperature within a range while under pressure; and

allowing evaporation of solvent from the solvent-based thermal interface material such that the remaining thermal interface material is in and remains in a resistant-to-flow state forming the thin bond line between the heat source and the another component, whereby the remaining thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.

2. The method of claim 1 , wherein the method includes applying the solvent-based thermal interface material as a grease or a dispensed material to the heat source or the another component.

3. The method of claim 1 , wherein after the evaporation of the solvent from the solvent-based thermal, the remaining thermal interface material is operable for establishing a restorable thermal joint between the another component and the heat source through which heat is flowable from the heat source during operation of the electronic device whereby temperature of the heat source is reduced to preclude the heat source from heating beyond the normal operating temperature range.

4. The method of claim 3 , wherein the remaining thermal interface material is configured such that if delamination of the remaining thermal interface material occurs during thermal cycling then interfacial contact resistance and thermal resistance of the restorable thermal joint will increase whereby heat from the heat source will cause the remaining thermal interface material to soften, reduce contact resistance, and reestablish the restorable thermal joint.

5. A method of establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the method comprising using a thermal interface material between the heat source and another component of the electronic device to form a thin bond line between the heat source and the another component to thereby establish the thermal path, the thermal interface material configured to be in and remain in a resistant-to-flow state after forming the thin bond line between the heat source and the another component absent heating of the thermal interface material to a temperature within a range while under pressure, whereby the thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.

6. The method of claim 5 , wherein:

the thermal interface material comprises a solvent-based thermal interface material; and

the method includes applying the solvent-based thermal interface material as a grease or a dispensed material to the heat source or the another component.

7. The method of claim 5 , wherein:

the thermal interface material comprises a solvent-based thermal interface material having an initial flowable state; and

the method includes using the solvent-based thermal interface material to form the thin bond line between the heat source and the another component to thereby establish the thermal path without heating the solvent-based thermal interface material to a temperature within a range while under pressure.

8. The method of claim 7 , wherein the method includes allowing evaporation of solvent from the solvent-based thermal interface material such that the remaining thermal interface material is in and remains in a resistant-to-flow state forming the thin bond line between the heat source and the another component.

9. The method of claim 8 , wherein after the evaporation of the solvent from the solvent-based thermal, the remaining thermal interface material is operable for establishing a restorable thermal joint between the another component and the heat source through which heat is flowable from the heat source during operation of the electronic device whereby temperature of the heat source is reduced to preclude the heat source from heating beyond the normal operating temperature range.

10. The method of claim 9 , wherein the remaining thermal interface material is configured such that if delamination of the remaining thermal interface material occurs during thermal cycling then interfacial contact resistance and thermal resistance of the restorable thermal joint will increase whereby heat from the heat source will cause the remaining thermal interface material to soften, reduce contact resistance, and reestablish the restorable thermal joint.

11. A thermal interface material for establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the thermal interface material comprises a solvent-based thermal interface material having an initial flowable state in which the solvent-based thermal interface material is flowable to form a thin bond line between the heat source and another component of the electronic device to thereby establish the thermal path without requiring heating of the solvent-based thermal interface material to a temperature within a range while under pressure, wherein after evaporation of solvent from the solvent-based thermal interface material, the remaining thermal interface material is configured to be in and remain in a resistant-to-flow state forming the thin bond line between the heat source and the another component, whereby the remaining thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.

12. The thermal interface material of claim 11 , wherein the solvent-based thermal interface material is configured to be applied as a grease or a dispensed material to the heat source or the another component.

13. The thermal interface material of claim 11 , wherein the thermal interface material is configured such that after evaporation of the solvent from the solvent-based thermal interface, the remaining thermal interface material is operable for establishing a restorable thermal joint between the another component and the heat source through which heat is flowable from the heat source during operation of the electronic device whereby temperature of the heat source is reduced to preclude the heat source from heating beyond the normal operating temperature range.

14. The thermal interface material of claim 13 , wherein the thermal interface material is configured such that if delamination of the remaining thermal interface material occurs during thermal cycling then interfacial contact resistance and thermal resistance of the restorable thermal joint will increase whereby heat from the heat source will cause the remaining thermal interface material to soften, reduce contact resistance, and reestablish the restorable thermal joint.

15. An electronic device comprising the heat source, the another component, and the thermal interface material of claim 11 positioned between the heat source and the another component, wherein:

the electronic device comprises a semiconductor device having the heat source;

the another component of the electronic device comprises a lid of the electronic device; and

the thermal interface material is positioned between the semiconductor device and the lid.

16. An electronic device comprising the heat source, the another component, and the thermal interface material of claim 11 positioned between the heat source and the another component, wherein the another component of the electronic device is a heat sink or a heat spreader.

17. A thermal interface material for establishing a thermal path for conducting heat from a heat source of an electronic device, the heat source having a normal operating temperature range, the thermal interface material is positionable between the heat source and another component of the electronic device and configured to form a thin bond line between the heat source and the another component to thereby establish the thermal path, the thermal interface material configured to be in an remain in a resistant-to-flow state after forming the thin bond line between the heat source and the another component absent heating of the thermal interface material to a temperature within a range while under pressure, whereby the thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.

18. The thermal interface material of claim 17 , wherein the thermal interface material comprises a solvent-based thermal interface material.

19. The thermal interface material of claim 18 , wherein the solvent-based thermal interface material is configured to be applied as a grease or a dispensed material to the heat source or the another component.

20. The thermal interface material of claim 18 , wherein the solvent-based thermal interface material is configured to have an initial flowable state in which the solvent-based thermal interface material is flowable to form the thin bond line between the heat source and the another component without requiring heating of the solvent-based thermal interface material to a temperature within a range while under pressure.

21. The thermal interface material of claim 20 , wherein the thermal interface material is configured to such that after evaporation of solvent from the solvent-based thermal interface material, the remaining thermal interface material is in a resistant-to-flow state.

22. The thermal interface material of claim 21 , wherein the thermal interface material is configured such that after evaporation of the solvent from the solvent-based thermal interface material, the remaining thermal interface material is configured to remain in the resistant-to-flow state forming the thin bond line between the heat source and the another component whereby the thermal interface material is operable to preclude the heat source from heating beyond the normal operating temperature range during operation of the electronic device and heat is flowable through the thermal path from the heat source during operation of the electronic device whereby temperature of the heat source is reduced.

23. The thermal interface material of claim 22 , wherein the solvent-based thermal interface material is configured to be applied as a grease or a dispensed material to the heat source or the another component.

24. The thermal interface material of claim 18 , wherein:

the solvent-based thermal interface material is configured to have an initial flowable state in which the solvent-based thermal interface material is flowable to form the thin bond line between the heat source and the another component without requiring heating of the solvent-based thermal interface material to a temperature within a range while under pressure; and

the thermal interface material is configured such that after evaporation of solvent from the solvent-based thermal interface material, the remaining thermal interface material is in and remains in a resistant-to-flow state forming the thin bond line between the heat source and the another component, whereby the remaining thermal interface material is operable for establishing a restorable thermal joint between the another component and the heat source.

25. The thermal interface material of claim 24 , wherein the thermal interface material is configured such that if delamination of the remaining thermal interface material occurs during thermal cycling then interfacial contact resistance and thermal resistance of the restorable thermal joint will increase whereby heat from the heat source will cause the remaining thermal interface material to soften, reduce contact resistance, and reestablish the restorable thermal joint.

26. An electronic device comprising the heat source, the another component, and the thermal interface material of claim 17 positioned between the heat source and the another component, wherein:

the electronic device comprises a semiconductor device having the heat source;

the another component of the electronic device comprises a lid of the electronic device; and

the thermal interface material is positioned between the semiconductor device and the lid.

27. An electronic device comprising the heat source, the another component, and the thermal interface material of claim 17 positioned between the heat source and the another component, wherein the another component of the electronic device is a heat sink or a heat spreader.