Patent Assignment
Reel/Frame 045564/0086
Assignment of Assignor's Interest
Recorded: 2018-04-17
Pages: 6
Assignors
WEIS, JONATHAN G.
Executed: 2018-03-15
CHIOU, NAN-RONG
Executed: 2018-03-19
JACOB, GEORGE C.
Executed: 2018-03-14
QIAN, BAINIAN
Executed: 2018-03-14
Assignee
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.
451 BELLEVUE ROAD, NEWARK, DELAWARE, 19713
Covered Property
(1)
Chemical Mechanical Polishing Pads for Improved Removal Rate and Planarization
Application:
15/924,606 →
Publication:
US 2018/0345449
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 29, 2024
From: ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC.
To: DUPONT ELECTRONIC MATERIALS HOLDING, INC.
Reel/Frame 069274/0160 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →