Highly compliant non-silicone putties and thermal interface materials including the same
Disclosed are exemplary embodiments of highly compliant non-silicone putties and thermal interface materials including the same. In an exemplary embodiment, a non-silicone putty includes at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix. The non-silicone putty may have a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or may have a hardness of less than about 30 Shore 00.
1. A thermal interface material comprising at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix, wherein the thermal interface material has a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or a hardness of less than about 30 Shore 00 at three seconds.
2. The thermal interface material of claim 1 , wherein the hollow polymeric particles of the at least one other filler comprise hollow polymeric spheres.
3. The thermal interface material of claim 1 , wherein the hollow polymeric particles of the at least one other filler comprise expandable microspheres.
4. The thermal interface material of claim 1 , wherein the hollow polymeric particles of the at least one other filler comprise a thermoplastic shell encapsulating a low boiling point liquid hydrocarbon.
5. The thermal interface material of claim 1 , wherein the non-silicone polymer base or matrix comprises a non-silicone oil gel resin.
6. The thermal interface material of claim 1 , wherein the non-silicone polymer base or matrix comprises:
a styrene and ethylene/butylene copolymers; and/or
a styrene and ethylene/propylene copolymers.
7. The thermal interface material of claim 1 , wherein the at least one thermally-conductive filler comprises aluminum and/or metal oxide powder.
8. The thermal interface material of claim 1 , wherein the thermal interface material includes:
at least about 90 percent by weight of the at least one thermally-conductive filler and the at least one other filler; and
at least about 0.3 percent by weight of the at least one other filler.
9. The thermal interface material of claim 1 , wherein the thermal interface material includes about 92 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.3 percent by weight of the at least one other filler.
10. The thermal interface material of claim 9 , wherein the thermal interface material has a thermal conductivity of at least about 3.9 Watts per meter-Kelvin and a hardness of less than about 28 Shore 00 at three seconds.
11. The thermal interface material of claim 1 , wherein the thermal interface material includes about 92 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.5 percent by weight of the at least one other filler.
12. The thermal interface material of claim 11 , wherein the thermal interface material has a thermal conductivity of at least about 3.6 Watts per meter-Kelvin and a hardness of less than about 28 Shore 00 at three seconds.
13. The thermal interface material claim 1 , wherein the thermal interface material includes about 93.5 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.3 percent by weight of the at least one other filler.
14. The thermal interface material of claim 13 , wherein the thermal interface material has a thermal conductivity of at least about 5 Watts per meter-Kelvin.
15. The thermal interface material of claim 1 , wherein
the thermal interface material is a non-silicone putty that does not include silicone.
16. A non-silicone putty comprising at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix, wherein the non-silicone putty has a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or a hardness of less than about 30 Shore 00 at three seconds.
17. The non-silicone putty of claim 16 , wherein:
the hollow polymeric particles of the at least one other filler comprise hollow polymeric spheres and/or expandable microspheres; and
the non-silicone polymer base or matrix comprises a non-silicone oil gel resin including a styrene and ethylene/butylene copolymers and/or a styrene and ethylene/propylene copolymers.
18. The non-silicone putty of claim 16 , wherein:
the non-silicone putty includes at least about 90 percent by weight of the at least one thermally-conductive filler and the at least one other filler; and at least about 0.3 percent by weight of the at least one other filler.
19. The non-silicone putty of claim 16 , wherein the non-silicone putty includes:
about 92 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.3 percent by weight of the at least one other filler, and the non-silicone putty has a thermal conductivity of at least about 3.9 Watts per meter-Kelvin and a hardness of less than about 28 Shore 00 at three seconds; or
about 92 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.5 percent by weight of the at least one other filler, and the non-silicone putty has a thermal conductivity of at least about 3.6 Watts per meter-Kelvin and a hardness of less than about 28 Shore 00 at three seconds; or
about 93.5 percent by weight of the at least one thermally-conductive filler and the at least one other filler, and about 0.3 percent by weight of the at least one other filler, and the non-silicone putty has a thermal conductivity of at least about 5 Watts per meter-Kelvin.
20. A method comprising using a thermal interface material within a gap between two opposing heat transfer surfaces within an electronic device, the thermal interface material including at least one thermally-conductive filler and at least one other filler including hollow polymeric particles in a non-silicone polymer base or matrix, wherein the thermal interface material has a thermal conductivity of at least about 3 Watts per meter-Kelvin and/or a hardness of less than about 30 Shore 00 at three seconds.
21. The method of claim 20 , wherein the hollow polymeric particles of the at least one other filler comprise expandable microspheres having thermoplastic shells and liquid hydrocarbon within the thermoplastic shells, whereby during operation of the electronic device, the thermoplastic shells of the expandable microspheres are heated by heat from a heat source of the electronic device to a temperature high enough to soften the thermoplastic shells, such that increasing pressure of the liquid hydrocarbon within the thermoplastic shells causes the expandable microspheres to expand and increase in volume.