IP Library Granted Patent US 12,049,542
Granted Patent B2
US 12,049,542 · App. 17/265,905 · Granted Jul 30, 2024

Polymers for use in electronic devices

Inventors: Brian C. Auman (Avondale, PA); Michael Henry Howard, Jr. (Montchanin, DE)
Assignee: DUPONT ELECTRONICS, INC.
C08G73/1078C08G73/1042C08G73/1067G02F1/133305H05K1/0346C09K2323/06G02B5/223G06F3/041
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Quick Facts
Patent No.
US 12,049,542
App. No.
17/265,905
Granted
Jul 30, 2024
Kind
B2
Abstract

Disclosed is a polyimide having a repeat unit structure of Formula IV In Formula IV: R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and R b is the same or different at each occurrence and represents one or more aromatic diamine residues. 30-100 mol % of R b has Formula II In Formula II: R 1 and R 2 are the same or different at each occurrence and are halogen, alkyl, fluoroalkyl, silyl, alkoxy, fluoroalkoxy, or siloxy; a and b are the same or different and are an integer from 0-4; c and d are the same or different and are 1 or 2; and * indicates a point of attachment.

Claims (36)

1. A liquid medium in which a material is uniformly dissolved to form a solution, a liquid medium in which a material is uniformly dispersed to form a dispersion, or a liquid medium in which a material is uniformly suspended to form a suspension or an emulsion comprising

(a) a polyamic acid having a repeat unit structure of Formula I

where:

R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and

R b is the same or different at each occurrence and represents one or more aromatic diamine residues;

wherein 30-100 mol % of R b has Formula II

where:

R 1 and R 2 are the same or different at each occurrence and are selected from the group consisting of fluoroalkyl, silyl, alkoxy, fluoroalkoxy, and siloxy;

a and b are the same or different and are an integer from 1-4;

c and d are the same or different and are 1 or 2; and

* indicates a point of attachment;

(b) a high-boiling aprotic solvent with a boiling point that is greater than 130° C.; and

(c) an imidization conversion catalyst.

2. The liquid medium of claim 1 , wherein 30-100 mol % of R b has a formula selected from the group consisting of Formula IIA, Formula IIB, Formula IIC, Formula IID, Formula IIE, and Formula IIF

3. The liquid medium of claim 1 , wherein 30-100 mol % of R b has a formula selected from the group consisting of Formula IIA-1, Formula IIB-1, Formula IIC-1, Formula IID-1, Formula IIE-1, and Formula IIF-1

where:

R 3 and R 4 are the same or different and are selected from the group consisting of fluoroalkyl, silyl, alkoxy, fluoroalkoxy, and siloxy.

4. A polyimide having a repeat unit structure of Formula IV

where

R a is the same or different at each occurrence and represents one or more tetracarboxylic acid component residues; and

R b is the same or different at each occurrence and represents one or more aromatic diamine residues;

wherein 30-100 mol % of R b has Formula II

where:

R 1 and R 2 are the same or different at each occurrence and are selected from the group consisting of fluoroalkyl, silyl, alkoxy, fluoroalkoxy, and siloxy;

a and b are the same or different and are an integer from 1-4;

c and d are the same or different and are 1 or 2; and

* indicates a point of attachment;

wherein the polyimide has a glass transition temperature (Tg) of greater than 250° C. an elongation to break of greater than 10% in accordance with ASTM Method D882, a linear coefficient of thermal expansion (CTE) of less than 20 ppm/° C. between 50° C. and 200° C., and an isothermal weight loss of less than 1% at 350° C. for 3 hours in nitrogen.

5. The polyimide of claim 4 , wherein 30-100 mol % of R b has a formula selected from the group consisting of Formula IIA, Formula IIB, Formula IIC, Formula IID, Formula IIE, and Formula IIF

6. The polyimide of claim 4 , wherein 30-100 mol % of R b has a formula selected from the group consisting of Formula IIA-1, Formula IIB-1, Formula IIC-1, Formula IID-1, Formula IIE-1, and Formula IIF-1

where:

R 3 and R 4 are the same or different and are selected from the group consisting of fluoroalkyl, silyl, alkoxy, fluoroalkoxy, and siloxy.

7. A polyimide film comprising the polyimide having the repeat unit structure of

Formula IV, according to claim 4 .

8. An organic electronic device having at least one layer comprising a polyimide film comprising the polyimide having the repeat unit structure of Formula IV, according to claim 4 .

9. The organic electronic device according to claim 8 , wherein the layer is used in device components selected from the group consisting of device substrates, substrates for color filter sheets, cover films, and touch screen panels.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2022
From: HOWARD, MICHAEL HENRY, JR; AUMAN, BRIAN C
To: DUPONT ELECTRONICS, INC.
Reel/Frame 059237/0993 →
Continuity (1)
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