IP Library Granted Patent US 8,580,386
Granted Patent B2
US 8,580,386 · App. 13/168,062 · Granted Nov 12, 2013

Laminate comprising curable epoxy film layer comprising a di-isoimide and process for preparing same

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Quick Facts
Patent No.
US 8,580,386
App. No.
13/168,062
Granted
Nov 12, 2013
Kind
B2
Abstract

The present invention deals with a laminate useful for forming fully encapsulated flexible printed wiring boards. The laminate comprises a dielectric substrate coated with a curable composition comprising an epoxy and a novel aromatic di-isoimide chemical compound. The curable composition provides the benefit of thermal latency, improving shelf-life, and reducing premature curing during processing. Fully encapsulated printed wiring boards are also disclosed.

Claims (19)

1. A laminated article comprising a dielectric substrate and a coating adheringly deposited thereupon wherein said dielectric substrate is a polymeric sheet or film, and said coating comprises a curable composition comprising a solvent having mixed therewithin an epoxy and a di-isoimide represented by Structure I

wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.

2. The laminated article of claim 1 wherein R 1 is NH 2 .

3. The laminated article of claim 1 wherein said solvent of said curable composition is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof.

4. The laminated article of claim 1 wherein, R 1 of said curable composition is NH 2 ; the solvent of said curable composition is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy of said curable composition is a bisphenol A diglycidyl ether.

5. The laminated article of claim 1 wherein said curable composition further comprises an elastomer, a thermoplastic polymer, or a combination thereof.

6. The laminated article of claim 1 wherein said dielectric substrate is a fully aromatic polyimide film or sheet.

7. The laminated article of claim 6 wherein said aromatic polyimide film or sheet is characterized by a thickness in the range of 10 to 50 micrometers.

8. The laminated article of claim 6 wherein said fully aromatic polyimide film or sheet comprises a polyimide that is the condensation product polymellitic dianhydride and 4,4′-oxydianiline.

9. The laminated article of claim 1 wherein said coating is characterized by a thickness in the range of 10 to 75 micrometers.

10. The laminated article of claim 1 wherein said substrate further comprises a first surface and a second surface, wherein said first surface comprises a first coating adheringly disposed thereon; and, wherein said second surface comprises a second coating adheringly disposed thereon.

11. The laminated article of claim 10 wherein each of said first and second coatings comprises the curable composition comprising the solvent having mixed therewithin the epoxy and the di-isoimide represented by Structure I

wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.

12. A laminated article comprising a substrate and a coating adheringly deposited thereupon wherein said substrate is a polymeric sheet or film and said coating comprises a curable composition consisting essentially of a solvent having mixed therewithin an epoxy and a di-isoimide represented by Structure I

wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.

13. The laminated article of claim 12 wherein R 1 is NH 2 ; the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy is a bisphenol A diglycidyl ether.

14. A laminated article comprising a substrate and a coating adheringly deposited thereupon wherein said substrate is a polymeric sheet or film and said coating comprises a curable composition comprising a solvent having mixed therewithin an epoxy; an elastomer, a thermoplastic polymer or combination thereof; and a di-isoimide represented by Structure I

wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.

15. The laminated article of claim 14 wherein R 1 is NH 2 ; the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy is a bisphenol A diglycidyl ether.

Assignments (4)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2011
From: ZAHR, GEORGE ELIAS
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 026676/0757 →