IP Library Granted Patent US 11,254,094
Granted Patent B2
US 11,254,094 · App. 17/080,668 · Granted Feb 22, 2022

Multilayer polymer film

Inventors: Kostantinos Kourtakis (Media, PA); Gene M Rossi (Wilmington, DE); Leopoldo Alejandro Carbajal (Newark, DE); Mark Allan Lamontia (Landenberg, PA); Mobin Yahyazadehfar (Garnet Valley, PA); Ross S Johnson (Wilmington, DE); Weiying Gao (Landenberg, PA); Aref Samadidooki (Wilmington, DE)
Assignee: DUPONT ELECTRONICS, INC.
B32B7/022B32B27/08B32B27/18B32B27/281B32B27/34B32B2250/24B32B2255/10B32B2255/26B32B2264/1021B32B2264/301B32B2307/10B32B2307/412B32B2457/206
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Quick Facts
Patent No.
US 11,254,094
App. No.
17/080,668
Granted
Feb 22, 2022
Kind
B2
Abstract

In a first aspect, a multilayer polymer film includes a first polymer layer having a first elastic modulus and a second polymer layer having a second elastic modulus. The first polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The second polymer layer includes a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof. The first elastic modulus is different from the second elastic modulus. The first and second polymer layers are bonded by consolidation. In a second aspect, a cover window for a display includes a hard coat layer and the multilayer polymer film of the first aspect. The first polymer layer of the multilayer polymer film is the layer farthest from the display and is adhered to the hard coat layer.

Claims (17)

1. A multilayer polymer film comprising:

a first polymer layer having a first elastic modulus, wherein the first polymer layer comprises a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof; and

a second polymer layer having a second elastic modulus, wherein the second polymer layer comprises a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof, wherein:

the polymers of both the first and second polymer layers are cross-linked;

the first elastic modulus is different from the second elastic modulus; and

the first and second polymer layers are bonded by consolidation and cross-linking.

2. The multilayer polymer film of claim 1 , wherein the first polymer layer, the second polymer layer, or both the first and second polymer layers further comprise nanoparticles.

3. The multilayer polymer film of claim 1 , wherein: (i) the first polymer layer further comprises an imidization catalyst, or (ii) the second polymer layer further comprises an imidization catalyst, or (iii) both the first and second polymer layers further comprise an imidization catalyst.

4. The multilayer polymer film of claim 1 , wherein a Mode I interlaminar fracture toughness (Gig) between the first and second polymer layers is at least 500 J/m 2 .

5. The multilayer polymer film of claim 1 , wherein a difference between the elastic moduli of the first and second polymer layers is at least 5%.

6. The multilayer polymer film of claim 1 , further comprising a third polymer layer having a third elastic modulus, wherein the third polymer layer comprises a polyimide, a polyamide imide, a block copolymer of a polyimide or a polyamide imide or a mixture thereof, wherein the second polymer layer is positioned between the first and third polymer layers and the second and third polymer layers are bonded by consolidation.

7. The multilayer polymer film of claim 6 , wherein a difference between the elastic moduli of the second and third polymer layers is at least 5%.

8. The multilayer polymer film of claim 6 , wherein: (i) the second elastic modulus is smaller than the first elastic modulus and the third elastic modulus is greater than the second elastic modulus, or (ii) the second elastic modulus is greater than the first elastic modulus and the third elastic modulus is greater than the second elastic modulus, or (iii) the second elastic modulus is smaller than the first elastic modulus and third elastic modulus smaller than the second elastic modulus, or (iv) the second elastic modulus is smaller than the first elastic modulus and third elastic modulus greater than the second elastic modulus.

9. The multilayer polymer film of claim 6 , wherein: (i) the first elastic modulus and the third elastic modulus are essentially the same, or (ii) the first elastic modulus is greater than the third elastic modulus, or (iii) the third elastic modulus is greater than the first elastic modulus.

10. The multilayer polymer film of claim 6 , wherein the third polymer layer is cross-linked.

11. The multilayer polymer film of claim 10 , wherein the second and third polymer layers are further bonded by cross-linking.

12. The multilayer polymer film of claim 6 , wherein a Mode I interlaminar fracture toughness (Gig) between the second and third polymer layers is at least 500 J/m 2 .

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 29, 2021
From: KOURTAKIS, KOSTANTINOS; ROSSI, GENE M; CARBAJAL, LEOPOLDO ALEJANDO; LAMONTIA, MARK ALLAN; YAHYAZADEHFAR, MOBIN; JOHNSON, ROSS S; GAO, WEIYING; SAMADIDOOKI, AREF
To: DUPONT ELECTRONICS, INC.
Reel/Frame 057963/0501 →