IP Library Granted Patent US 10,336,045
Granted Patent B2
US 10,336,045 · App. 15/453,114 · Granted Jul 2, 2019

Matte finish polyimide films and methods relating thereto

Inventors: Thomas Edward Carney (Orient, OH); Jeffrey Michael Bartolin (Westerville, OH); Meredith L Dunbar (Canal Winchester, OH); Scott John Herrmann (Gahanna, OH)
Assignee: E I DU PONT DE NEMOURS AND COMPANY
B32B27/281C08G73/105C08G73/1075C08J5/18C08K3/04C09J7/25C09J163/00B32B5/16B32B2307/408C08G73/1071C08J2379/08C09J2205/106C09J2463/00C09J2479/086Y10T428/254Y10T428/28Y10T428/287Y10T428/2982Y10T428/31721
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,336,045
App. No.
15/453,114
Granted
Jul 2, 2019
Kind
B2
Abstract

The present disclosure is directed to a base film having a chemically converted polyimide, a particulate polyimide matting agent and a low conductivity carbon black. The particulate polyimide matting agent is present in an amount from 1.6 to 9 weight percent of the base film.

Claims (38)

1. A base film comprising:

A. a chemically converted polyimide present in an amount from 75 to 96 weight percent of the base film, the chemically converted polyimide being derived from:

a. 100 mole percent pyromellitic dianhydride, based upon a total dianhydride content of the chemically converted polyimide;

b. 20-80 mole percent 4,4′-oxydianiline based upon a total diamine content of the chemically converted polyimide; and

c. 80-20 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide;

B. a low conductivity carbon black present in an amount from 2 to 9 weight percent of the base film; and

C. a particulate polyimide matting agent present in an amount from 1.6 to 9 weight percent of the base film and having a median particle size from 1.3 to 10 microns.

2. The base film in accordance with claim 1 , wherein the chemically converted polyimide is derived from 50-70 mole percent 4,4′-oxydianiline and 50-30 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide.

3. The base film in accordance with claim 1 wherein the particulate polyimide matting agent has a refractive index from 1.65 to 1.85.

4. The base film in accordance with claim 1 , wherein the particulate polyimide matting agent and the chemically converted polyimide have a refractive index within and including 0.1 unit of each other.

5. The base film in accordance with claim 1 wherein the particulate polyimide matting agent is derived from at least 50 mole percent of an aromatic dianhydride and at least 50 mole percent of an aromatic diamine.

6. A multilayer film comprising the base film of claim 1 and an adhesive layer.

7. The multilayer film in accordance with claim 6 , wherein the adhesive layer is an epoxy resin selected from the group consisting of: bisphenol A type epoxy resin, cresol novolac type epoxy resin, phosphorus containing epoxy resin, and mixtures thereof.

8. The base film in accordance with claim 1 additionally comprising a dye present in an amount from 0.1 to 10 weight percent.

9. The base film in accordance with claim 1 , wherein the base film has a thickness of from 8 to 152 microns.

10. The base film in accordance with claim 9 , wherein the base film has a thickness of from 10 to 40 microns.

11. A base film comprising:

A. a chemically converted polyimide present in an amount from 75 to 96 weight percent of the base film, the chemically converted polyimide being derived from:

a. 100 mole percent pyromellitic dianhydride, based upon a total dianhydride content of the chemically converted polyimide;

b. 20-80 mole percent 4,4′-oxydianiline based upon a total diamine content of the chemically converted polyimide; and

c. 80-20 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide;

B. a low conductivity carbon black present in an amount from 2 to 9 weight percent of the base film; and

C. a particulate polyimide matting agent present in an amount from 1.6 to 9 weight percent of the base film, having a median particle size from 1.3 to 10 microns and having a refractive index from 1.65 to 1.85; and

wherein the base film has a 60 degree gloss value from 2 to 35 on both sides.

12. The base film in accordance with claim 11 , wherein the chemically converted polyimide is derived from 50-70 mole percent 4,4′-oxydianiline and 30-50 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide.

13. The base film in accordance with claim 11 , wherein the base film has a thickness of from 8 to 152 microns.

14. The base film in accordance with claim 13 , wherein the base film has a thickness of from 10 to 40 microns.

15. A base film comprising:

A. a chemically converted polyimide present in an amount from 75 to 96 weight percent of the base film, the chemically converted polyimide being derived from:

a. 100 mole percent pyromellitic dianhydride, based upon a total dianhydride content of the chemically converted polyimide;

b. 20-80 mole percent 4,4′-oxydianiline based upon a total diamine content of the chemically converted polyimide; and

c. 80-20 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide;

B. a low conductivity carbon black present in an amount from 2 to 9 weight percent of the base film; and

C. a particulate polyimide matting agent present in an amount from 1.6 to 9 weight percent of the base film and having a median particle size from 1.3 to 10 microns, the particulate polyimide matting agent and the chemically converted polyimide have a refractive index within and including 0.1 unit of each other; and

wherein the base film has a 60 degree gloss value from 2 to 35 on both sides.

16. The base film in accordance with claim 15 , wherein the chemically converted polyimide is derived from 50-70 mole percent 4,4′-oxydianiline and 30-50 mole percent p-phenylenediamine based upon the total diamine content of the chemically converted polyimide.

17. The base film in accordance with claim 15 , wherein the base film has a thickness of from 8 to 152 microns.

18. The base film in accordance with claim 17 , wherein the base film has a thickness of from 10 to 40 microns.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 049583/0269 →
Continuity (4)
Continuation 13625167 · Sep 24, 2012
Continuation In Part 12842174 · Jul 23, 2010
Provisional Application 61230934 · Aug 3, 2009
Related Publication 20170174950A1 · Jun 22, 2017