Polyamic acid solutions, polyimide films and electronic devices
A polyamic acid solution includes a dianhydride and a diamine. The dianhydride includes pyromellitic dianhydride, the diamine includes a benzimidazole, the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1, and the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
1. A polyamic acid solution comprising a dianhydride and a diamine, wherein:
the dianhydride comprises pyromellitic dianhydride;
the diamine comprises a benzimidazole;
the molar ratio of dianhydride monomer to diamine monomer is in a range of from 0.85:1 to 0.99:1; and
the polyamic acid solution has a solids content in a range of from 10 to 25 weight percent and a viscosity in a range of from 300 to 3000 poise.
2. The polyamic acid solution of claim 1 , wherein the dianhydride further comprises up to 70 mole percent of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, 2,3,3′,4′-biphenyltetracarboxylic dianhydride, or a mixture thereof, based on the total dianhydride content of the polyimide.
3. The polyamic acid solution of claim 1 , wherein the benzimidazole is selected from the group consisting of 5-amino-2-(4-aminophenyl)benzimidazole, 5-amino-2-(3-aminophenyl)benzimidazole, 6,6′-bis[2-(4-aminobenzene)benzimidazole], [2,2′-bi-1H-benzimidazole]-6,6′-diamine and mixtures thereof.
4. The polyamic acid solution of claim 1 , wherein the diamine further comprises a benzoxazole.
5. The polyamic acid solution of claim 4 , wherein the benzoxazole is selected from the group consisting of 5-amino-2-(4-aminophenyl)benzoxazole, 2,2′-p-phenylenebis[5-aminobenzoxazole], [2,2′-bibenzoxazole]-5,5′-diamine, 2,6-(4,4′-aminophenyl)benzobisoxazole and mixtures thereof.
6. The polyamic acid solution of claim 1 , wherein the diamine further comprises up to 50 mole percent of p-phenylenediamine, m-phenylenediamine, m-tolidine, or a mixture thereof, based on the total diamine content of the polyimide.
7. The polyamic acid solution of claim 1 , further comprising a crosslinking agent, a colorant, a matting agent, submicron particles or a mixture thereof.
8. A polyimide film formed from the polyamic acid solution of claim 1 .
9. The polyimide of claim 1 , wherein the polyimide film has a thickness in a range of from 4 to 150 μm.
10. An electronic device comprising the polyimide film of claim 9 .
11. The electronic device of claim 10 , wherein the polyimide film is used in device components selected from the group consisting of thin-film transistor substrates, substrates for color filter sheets, cover films and metal-clad laminates.