Thermal interface materials including memory foam cores

1. A thermal interface material comprising:

a memory foam core including a plurality of sides defining a perimeter; and

a heat spreader disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core;

wherein the memory foam core is configured to be compressible such that the thermal interface material is slidably insertableable within an enclosure to align the heat spreader for thermal contact with the enclosure while the memory foam core remains compressed to thereby avoid sliding contact of the heat spreader with the enclosure, and expansion of the compressed memory foam core will force the heat spreader into thermal contact with the enclosure whereby the heat spreader will define at least a portion of a thermally-conductive conductive heat path at least partially around the perimeter defined by the plurality of sides of the memory foam core to the enclosure.

2. The thermal interface material of claim 1 , wherein:

the memory foam core comprises a viscoelastic polyurethane foam, a low-resilience polyurethane foam, a gel-infused memory foam; and/or

the heat spreader comprises natural graphite and/or synthetic graphite.

3. The thermal interface material of claim 1 , claim wherein the memory foam core is configured to be compressible into a compressed shape having a reduced thickness and to thereafter retain the compressed shape having the reduced thickness for a predetermined minimum amount of time and/or with less than twenty percent rebound for at least two minutes.

4. The thermal interface material of claim 1 , wherein the heat spreader comprises a graphite sheet wrapped entirely around the perimeter defined by the plurality of sides of the memory foam core.

5. The thermal interface material of claim 1 , wherein a portion of the memory foam core is disposed between upper and lower portions of the heat spreader along a leading edge of the thermal interface material, whereby the portion of the memory foam core intervenes between the upper and lower portions of the heat spreader along the leading edge of the thermal interface material and thereby inhibits direct abutting contact between the upper and lower portions of the heat spreader along the leading edge of the thermal interface material.

6. The thermal interface material of claim 1 , wherein the heat spreader comprises graphite, such that the thermal interface material comprise a graphite over memory foam gasket.

7. The thermal interface material of claim 1 , wherein the heat spreader comprises one or more of a graphite sheet, aluminum foil, and/or copper foil.

8. A thermal interface material comprising:

a memory foam core including a plurality of sides defining a perimeter; and

a heat spreader disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core;

wherein the thermal interface material comprises:

a first portion with a generally rectangular cross-section or profile; and

a second opposite portion with a generally triangular cross-section or profile including a downwardly slanted top surface that provides the thermal interface material with a tapering leading edge.

9. The thermal interface material of claim 8 , wherein the memory foam core is compressible such that a portion of the heat spreader is alignable with a corresponding portion of a heat removal/dissipation structure while the memory foam core remains compressed to thereby avoid sliding contact of the heat spreader with the heat removal/dissipation structure, and expansion of the compressed memory foam core will force the aligned portion of the heat spreader into thermal contact with the corresponding portion of the heat removal/dissipation structure whereby the heat spreader will define at least a portion of a thermally-conductive heat path at least partially around the perimeter defined by the plurality of sides of the memory foam core to the heat removal/dissipation structure.

10. A device including a heat source, a thermal interface disposed along the heat source, and an enclosure, wherein the thermal interface material comprises:

a memory foam core including a plurality of sides defining a perimeter, and

a heat spreader disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core;

wherein the heat source and the thermal interface material are slidably insertable together within the enclosure while the memory foam core is at least partially compressed to thereby avoid sliding contact of the heat spreader with the enclosure, and expansion of the compressed memory foam core will force the heat spreader into thermal contact with the enclosure whereby the heat spreader will define at least a portion of a thermally-conductive heat path from the heat source at least partially around the perimeter defined by the plurality of sides of the memory foam core to the enclosure.

11. A thermal interface material comprising:

a resilient core including a plurality of sides defining a perimeter; and

a heat spreader disposed at least partially around the perimeter defined by the plurality of sides of the resilient core;

wherein the thermal interface material comprises:

a first portion with a generally rectangular cross-section or profile; and

a second opposite portion with a generally triangular cross-section or profile including a downwardly slanted top surface that provides the thermal interface material with a tapering leading edge portion that reduces in height along a direction from the first portion to the leading edge.

12. The thermal interface material of claim 11 , wherein:

the resilient core comprises a memory foam core; and

the heat spreader comprises natural graphite and/or synthetic graphite.

13. The thermal interface material of claim 12 , wherein the memory foam core is configured to be compressible into a compressed shape having a reduced thickness and to thereafter retain the compressed shape having the reduced thickness for a predetermined minimum amount of time and/or with less than twenty percent rebound for at least two minutes.

14. The thermal interface material of claim 12 , wherein the memory foam core is compressible such that a portion of the graphite is alignable with a corresponding portion of a heat removal/dissipation structure while the memory foam core remains compressed to thereby avoid sliding contact of the graphite with the heat removal/dissipation structure, and expansion of the compressed memory foam core will force the aligned portion of the graphite into thermal contact with the corresponding portion of the heat removal/dissipation structure whereafter the graphite will define at least a portion of a thermally- conductive heat path at least partially around the perimeter defined by the plurality of sides of the memory foam core to the heat removal/dissipation structure.

15. A device including a heat source, a thermal interface material disposed along the heat source, and an enclosure, wherein the thermal interface material comprises:

a resilient core including a plurality of sides defining a perimeter; and

graphite disposed at least partially around the perimeter defined by the plurality of sides of the resilient core;

wherein the heat source and the thermal interface material are slidably insertable together within the enclosure while the resilient core is at least partially compressed to thereby avoid sliding contact of the graphite with the enclosure, and expansion of the resilient core will force the graphite into thermal contact with the enclosure whereafter the graphite will define at least a portion of a thermally-conductive heat path from the heat source at least partially around the perimeter defined by the plurality of sides of the resilient core to the enclosure.

16. A method comprising:

compressing a memory foam core of a thermal interface material that is disposed along a heat source, the thermal interface material further including a heat spreader disposed at least partially around a perimeter defined by a plurality of sides of the memory foam core;

aligning a portion of the heat spreader for thermal contact with a corresponding portion of a heat removal/dissipation structure while the memory foam core remains at least partially compressed to thereby avoid sliding contact of the thermal interface material with the heat removal/dissipation structure; and

allowing the memory foam core to expand such that expansion of the compressed memory foam core thermally contacts the aligned portion of the heat spreader with the corresponding portion of the heat removal/dissipation structure, whereby the heat spreader defines at least a portion of a thermally-conductive heat path at least partially around the perimeter defined by the plurality of sides of the memory foam core to the heat removal/dissipation structure;

wherein:

the heat spreader comprises graphite;

the heat source comprises a component mounted on a printed circuit board;

the heat removal/dissipation structure comprises an enclosure;

aligning the portion of the heat spreader for thermal contact with the corresponding portion of the heat removal/dissipation structure includes slidably positioning the component and the thermal interface material together within the enclosure while the memory foam core remains at least partially compressed to thereby align a portion of the graphite with the corresponding portion of the enclosure while avoiding sliding contact of the graphite with the enclosure; and

allowing the memory foam core to expand includes allowing the memory foam core to expand such that expansion of the compressed memory foam core thermally contacts the aligned portion of the graphite with the corresponding portion of the enclosure, whereby the graphite defines at least a portion of a thermally-conductive heat path at least partially around the perimeter defined by the plurality of sides of the memory foam core to the enclosure.

17. The method of claim 16 , wherein:

the method further comprising adhesively attaching the thermal interface material to the heat source; and/or

the memory foam core is configured to retain a compressed shape and reduced thickness for a predetermined minimum amount of time and/or with less than twenty percent rebound for at least two minutes; and/or

the heat spreader comprises graphite; and/or

the memory foam core comprises a viscoelastic polyurethane foam, a low-resilience polyurethane foam, a gel-infused memory foam.

18. The thermal interface material of claim 1 , wherein the memory foam core comprises a viscoelastic polyurethane foam configured to be compressible into a compressed shape having a reduced thickness and to thereafter retain the compressed shape having the reduced thickness for a predetermined minimum amount of time and with less than twenty percent rebound for at least two minutes.

19. The device of claim 10 , wherein the memory foam core comprises a viscoelastic polyurethane foam configured to be compressible into a compressed shape having a reduced thickness and to thereafter retain the compressed shape having the reduced thickness for a predetermined minimum amount of time and with less than twenty percent rebound for at least two minutes.

20. The thermal interface material of claim 11 , wherein the resilient core comprises a viscoelastic polyurethane foam configured to be compressible into a compressed shape having a reduced thickness and to thereafter retain the compressed shape having the reduced thickness for a predetermined minimum amount of time and with less than twenty percent rebound for at least two minutes.