IP Library Granted Patent US 12,409,643
Granted Patent B2
US 12,409,643 · App. 17/903,762 · Granted Sep 9, 2025

Articles having inorganic substrates and polymer film layers

Inventors: Kostantinos Kourtakis (Media, PA); Benjamin Samson (Wilmington, DE); Kenneth Hernandez (Stoneham, MA); Ross S Johnson (Wilmington, DE); Dennis Walls (Wilmington, DE); Neng Xiao (Bear, DE); Lei Zhang (Hockessin, DE); Joseph Casey Johnson (Pickerington, OH)
Assignee: DUPONT ELECTRONICS, INC.
B32B27/281B32B17/10018B32B17/1055B32B2250/03B32B2307/102B32B2307/412B32B2307/558B32B2571/02
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Quick Facts
Patent No.
US 12,409,643
App. No.
17/903,762
Granted
Sep 9, 2025
Kind
B2
Abstract

In a first aspect, an article includes an inorganic substrate and a polymer film layer. The inorganic substrate includes a material including a ceramic, a glass, a glass-ceramic or a mixture thereof. The material includes a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof and oxygen. The polymer film layer includes a polymer including an imide group. From an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO− signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer.

Claims (35)

1. An article comprising:

an inorganic substrate comprising a material comprising a ceramic, a glass, a glass-ceramic or a mixture thereof, wherein the material comprises:

a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof; and

oxygen;

a polymer film layer comprising a polymer comprising an imide group, wherein, from an interface where the inorganic substrate contacts the polymer film layer, a line-profile of a CNO − signal from negative secondary ion mass spectroscopy decreases as it moves away from the interface and into the bulk of the polymer film layer; and

a hard coat layer adhered to the polymer film layer on a side opposite the inorganic substrate, wherein the hard coat layer is formed from a curable resin coating composition.

2. The article of claim 1 , wherein the polymer comprising an imide group is selected from the group consisting of polyimides, poly(amide-imides), poly(ether-imides), poly(ester-imides), copolymers comprising amide, ester or ether groups, and mixtures thereof.

3. The article of claim 2 , wherein the polyimide is derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine.

4. The article of claim 3 , wherein the dianhydride comprises an alicyclic dianhydride.

5. The article of claim 1 , wherein the inorganic substrate comprises glass.

6. The article of claim 1 , wherein the metal cation comprises silicon.

7. The article of claim 1 , wherein a Mode I Interlaminar Fracture Toughness (G Ic ) between the inorganic substrate and the polymer film layer is 9 J/m 2 or more.

8. The article of claim 1 , wherein the polymer film layer has a T g of 300° C. or less.

9. The article of claim 1 , wherein the article has a b* of 1.25 or less and a yellowness index of 2.25 or less when measured using the procedure described by ASTM E313 at a thickness of 25 μm.

10. The article of claim 1 , wherein the article has a haze of 15% or less and an L* of 93 or more when measured at a thickness of 25 μm.

11. An impact-resistant article comprising the article of claim 1 .

12. A penetration-resistant article comprising the article of claim 1 .

13. A sound-reducing article comprising the article of claim 1 .

14. An article comprising:

an inorganic substrate comprising a material comprising a ceramic, a glass, a glass-ceramic or a mixture thereof, wherein the material comprises:

a metal cation selected from the group consisting of silicon, aluminum, titanium, zirconium, tantalum, niobium and mixtures thereof; and

oxygen;

a polymer film layer comprising a polymer comprising an imide group, wherein, a Mode I Interlaminar Fracture Toughness (G Ic ) between the polymer film layer and the inorganic substrate layer is 9 J/m 2 or more; and

a hard coat layer adhered to the polymer film layer on a side opposite the inorganic substrate, wherein the hard coat layer is formed from a curable resin coating composition.

15. The article of claim 14 , wherein the polymer comprising an imide group is selected from the group consisting of polyimides, poly(amide-imides), poly(ether-imides), poly(ester-imides), copolymers comprising amide, ester or ether groups, and mixtures thereof.

16. The article of claim 15 , wherein the polyimide is derived from a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine.

17. The article of claim 16 , wherein the dianhydride comprises an alicyclic dianhydride.

18. The article of claim 14 , wherein the inorganic substrate comprises glass.

19. The article of claim 14 , wherein the metal cation comprises silicon.

20. The article of claim 14 , wherein the article has a b* of 1.25 or less and a yellowness index of 2.25 or less when measured using the procedure described by ASTM E313 at a thickness of 25 μm.

21. The article of claim 14 , wherein the article has a haze of 15% or less and an L* of 93 or more when measured at a thickness of 25 μm.

22. An impact-resistant article comprising the article of claim 14 .

23. A penetration-resistant article comprising the article of claim 14 .

24. A sound-reducing article comprising the article of claim 14 .

25. The article of claim 14 , wherein the polymer film layer has a T g of 300° C. or less.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2022
From: KOURTAKIS, KOSTANTINOS; SAMSON, BENJAMIN; HERNANDEZ, KENNETH; JOHNSON, ROSS; WALLS, DENNIS; XIAO, NENG; ZHANG, LEI; JOHNSON, JOSEPH CASEY
To: DUPONT ELECTRONICS, INC.
Reel/Frame 061912/0433 →
Continuity (3)
Provisional Application 63253364 · Oct 7, 2021
Provisional Application 63244585 · Sep 15, 2021
Related Publication 20230082265A1 · Mar 16, 2023
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