Granted Patent B2

US 12,429,769 · App. 17/590,026 · Granted Sep 30, 2025

Inventors: Tsung-Han Tsai (Hsinchu, TW); Liyen Lin (Hsinchu, TW)

Assignee: DUPONT ELECTRONICS, INC.

G03F7/033C08F212/08H01L21/4846H05K3/064H05K3/18

Abstract

Claims (35)

1. A photosensitive composition, comprising:

(a) a polymeric binder consisting of:

10-70% by weight of a structural unit represented by Formula 1,

15-35% by weight of a structural unit represented by Formula 2, and

5-60% by weight of at least one structural unit represented by Formula 3,

wherein

R 1, R 3, and R 4 each independently is H or CH 3;

R 2 is C 1 -C 3 alkyl, C 1 -C 3 alkoxy, —NH 2, or halogen;

m is an integer of 0-5, and when m is 2-5, the multiple R 2 groups may be the same or different;

R 5 is C 1 -C 5 , alkyl, benzyl, or C(O)CH 2 C(O)CH 3; and

n is an integer of 0-12;

wherein the at least one structural unit represented by Formula 3 comprises a structural unit represented by Formula 3 where n is other than 0;

the weight ratio of each structural unit is based on the total weight of the polymerizable precursors for constituting the polymeric binder;

(b) a polymerizable compound;

(c) a photoinitiator; and

(d) a photosensitizer.

2. The photosensitive composition according to claim 1 , wherein the photoinitiator (c) comprises a hexaarylbiimidazole compound.

3. The photosensitive composition according to claim 1 , further comprising a hydrogen donor (e).

4. The photosensitive composition according to claim 1 , wherein the polymeric binder (a) has a weight-average molecular weight (M w ) in the range of 25,000-100,000.

5. The photosensitive composition according to claim 1 , comprising:

(a) 30-70% by weight of at least one polymeric binder;

(b) 10-70% by weight of at least one polymerizable compound;

(c) 0.1-20% by weight of at least one photoinitiator;

(d) 0.01-1% by weight of at least one photosensitizer;

(e) 0-2% by weight of at least one hydrogen donor; and

(f) 0-10% by weight of other additives;

wherein the % is based on the total weight of the photosensitive composition.

6. A photosensitive dry film comprising a support film and a photosensitive layer formed on the support film, wherein the photosensitive layer comprises the photosensitive composition according to claim 1 or claim 5 .

7. A method for forming a resist pattern on a substrate comprising:

i) forming an imageable layer comprising the photosensitive composition according to claim 1 or claim 5 on a substrate;

ii) imagewise exposing to active light rays to produce exposed and non-exposed areas in the imageable layer; and

iii) developing the resist pattern by removing the unexposed sections of the imageable layer.

8. A method for producing a printed wiring board comprising: etching or plating a substrate having a resist pattern formed according to the method of claim 7 to form a conductor pattern.

9. A method for producing a semiconductor package comprising: plating the substrate having a resist pattern formed according to the method of claim 7 .

10. A method for producing a bump comprising: plating the substrate having a resist pattern formed according to the method of claim 7 .

Assignments (3)

Continuity (2)

References Cited (19)