Soft and/or flexible EMI shields and related methods

1. A shield suitable for use in providing electromagnetic interference (EMI) shielding for one or more components on a substrate, the shield comprising:

one or more contacts configured for installation on the substrate; and

a soft and/or flexible electrically-conductive cover configured for installation on the one or more contacts, wherein the cover comprises a stretchable woven or non-woven fabric configured to allow the cover to bend or flex along with the substrate and/or the cover is capable of having a radius of curvature of 100 millimeters.

2. A shield suitable for use in providing electromagnetic interference (EMI) shielding for one or more components on a substrate, the shield comprising:

one or more contacts configured for installation on the substrate; and

a soft and/or flexible electrically-conductive cover configured for installation on the one or more contacts, wherein the cover comprises a fabric configured to allow the cover to bend or flex along with the substrate and/or the cover is capable of having a radius of curvature of 100 millimeters;

wherein the one or more contacts comprise one or more resonators coupled to the cover that are configured to be operable for virtually connecting the cover to a ground plane without any intervening physical components that create a physically existing electrical pathway directly between the ground plane and the cover.

3. A shield suitable for use in providing electromagnetic interference (EMI) shielding for one or more components on a substrate, the shield comprising:

one or more contacts configured for installation on the substrate; and

a soft and/or flexible electrically-conductive cover configured for installation on the one or more contacts, wherein the cover comprises a fabric configured to allow the cover to bend or flex along with the substrate and/or the cover is capable of having a radius of curvature of 100 millimeters;

wherein each of the one or more contacts includes an L-C resonator comprising an inductor and a capacitor configured to be operable for virtually connecting the cover to a ground plane.

4. The shield of claim 3 , wherein:

the inductor is attached to the cover; and

the capacitor is configured to be attached to the substrate.

5. The shield of claim 3 , wherein:

the inductor is an inductive pin; and

the capacitor is a capacitive patch.

6. The shield of claim 1 , wherein:

the one or more contacts comprise one or more metal spring contacts; and

the one or more contacts are solderable onto the substrate.

7. The shield of claim 1 , wherein:

the one or more contacts are soldered as one or more bosses onto the substrate; and

the cover is bonded onto the one or more bosses.

8. The shield of claim 1 , wherein:

the cover overhangs or drapes over a perimeter defined by outside dimensions of the contacts when the cover is connected to the one or more contacts; or

the shield further comprises one or more sidewalls depending from the cover that are configured to electrically contact the one or more contacts for establishing grounding contact between the cover and the one or more contacts.

9. The shield of claim 1 , wherein:

the cover comprises an electrically-conductive layer between inner and outer non-conductive layers, the inner non-conductive layer having openings through which the electrically-conductive layer is connected with the one or more contacts; and

the inner non-conductive layer inhibits the electrically-conductive layer from directly contacting and electrically shorting one or more components when the one or more components are under the shield.

10. The shield of claim 1 , wherein the stretchable woven or non-woven fabric of the cover comprises a metallized or metal plated stretchable woven fabric.

11. The shield of claim 2 , wherein each of the one or more resonators includes an L-C resonator comprising an inductor and a capacitor.

12. The shield of claim 11 , wherein:

the inductor is attached to the cover; and

the capacitor is configured to be attached to the substrate.

13. The shield of claim 11 , wherein:

the inductor is an inductive pin; and

the capacitor is a capacitive patch.

14. The shield of claim 2 , wherein the cover comprises a metallized or metal plated stretchable fabric.

15. A method relating to providing shielding for one or more components on a substrate using the shield of claim 1 , the method comprising:

Installing the one or more contacts on the substrate; and

installing the soft and/or flexible cover on the one or more contacts.

16. The method of claim 15 , wherein:

the substrate is flexible; and

the one or more electrically-conductive contacts comprise one or more of an SMD or surface-mount contact and/or metal spring contact; and

the cover comprises a metallized or metal plated stretchable fabric.

17. The method of claim 15 , wherein:

installing the one or more electrically-conductive contacts comprises soldering the one or more electrically-conductive contacts onto the substrate; and

installing the cover comprises:

positioning an electrically-conductive layer of the cover onto the one or more electrically-conductive contacts through one or more openings in a non-conductive inner layer of the cover; and/or

positioning the cover relative to the one or more electrically-conductive contacts such that the cover overhangs or drapes over a perimeter defined by outside dimensions of the one or more electrically-conductive contacts.

18. The method of claim 15 , wherein the electrically-conductive contacts comprise one or more resonators configured to be operable for virtually connecting the cover to a ground plane without any physical electrical connection directly between the ground plane and the cover.

19. The method of claim 18 , wherein each of the one or more resonators includes an L-C resonator comprising an inductor and a capacitor.