Thermally-Conductive Electromagnetic Interference (EMI) Absorbers
Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 5 Watts per meter per Kelvin (W/mK). The thermally-conductive EMI absorber may have an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher. Or the thermally-conductive EMI absorber may have an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
1 . A thermally-conductive electromagnetic interference (EMI) absorber comprising a matrix and at least one functional filler in the matrix, wherein the thermally-conductive EMI absorber has a thermal conductivity of at least about 5 Watts per meter per Kelvin (W/mK), and wherein:
the thermally-conductive EMI absorber has an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher; or
the thermally-conductive EMI absorber has an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
2 . The thermally-conductive EMI absorber of claim 1 , wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least 70% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 30% by volume of the matrix.
3 . The thermally-conductive EMI absorber of claim 1 , wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least 80% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 20% by volume of the matrix.
4 . The thermally-conductive EMI absorber of claim 1 , wherein the thermally-conductive EMI absorber includes at least 70% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 30% by volume of the matrix.
5 . The thermally-conductive EMI absorber of claim 1 , wherein:
the at least one functional filler comprises stainless steel; and
the thermally-conductive EMI absorber has a thermal conductivity of about 5 W/mK and an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
6 . The thermally-conductive EMI absorber of claim 1 , wherein the at least one functional filler comprises stainless steel.
7 . The thermally-conductive EMI absorber of claim 6 , wherein the at least one functional filler further comprises one or more of zinc oxide, silicon carbide, carbonyl iron, aluminum oxide, aluminum nitride, aluminum, boron nitride, silicon nitride, iron, graphite, ferrite, alumina trihydrate, silica, iron silicide, manganese zinc ferrite, nickel zinc ferrite, and/or SENDUST magnetic metal powder.
8 . The thermally-conductive EMI absorber of claim 1 , wherein:
the thermally-conductive EMI absorber includes at least about 96% by weight of the at least one functional filler and no more than about 4% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least about 82% by volume of the at least one functional filler and no more than about 16% by volume of the matrix.
9 . The thermally-conductive EMI absorber of claim 8 , wherein:
the at least one functional filler comprises stainless steel and at least one or more of zinc oxide, silicon carbide, carbonyl iron, aluminum oxide, aluminum nitride, aluminum, boron nitride, silicon nitride, iron, graphite, ferrite, alumina trihydrate, silica, iron silicide, and/or SENDUST magnetic metal powder; and
the thermally-conductive EMI absorber has a thermal conductivity of about 5 W/mK and an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
10 . The thermally-conductive EMI absorber of claim 1 , wherein the thermally-conductive EMI absorber does not include silicone, is substantially entirely silicone free, and/or is usable with no occurrence of silicone migration.
11 . The thermally-conductive EMI absorber of claim 1 , wherein:
the thermally-conductive EMI absorber has a UL flammability rating of UL V-0; and
the thermally-conductive EMI absorber is dielectric and not electrically conductive.
12 . The thermally-conductive EMI absorber of claim 1 , wherein the matrix comprises a non-silicone polymer matrix.
13 . The thermally-conductive EMI absorber of claim 1 , wherein the matrix comprises a silicone matrix.
14 . The thermally-conductive EMI absorber of claim 1 , wherein:
the at least one functional filler includes stainless steel, alumina, iron silicide, and manganese zinc ferrite;
the matrix comprises a silicone matrix; and
the thermally-conductive EMI absorber includes about 53% by weight of the stainless steel, about 33% by weight of the alumina, about 10% by weight of the iron silicide/manganese zinc ferrite, and about 4% by weight of the silicone matrix.
15 . The thermally-conductive EMI absorber of claim 14 , wherein the thermally-conductive EMI absorber has an attenuation of at least about 1 dB/cm at 1 MHz, at least about 5 dB/cm at 1 GHz, at least about 10 dB/cm at 2 MHz, and at least about 20 dB/cm at 4 GHz.
16 . A thermally-conductive electromagnetic interference (EMI) absorber comprising a matrix and at least one functional filler in the matrix;
wherein the at least one functional filler comprises stainless steel;
wherein the thermally-conductive EMI absorber has a thermal conductivity of at least about 5 Watts per meter per Kelvin (W/mK);
wherein the thermally-conductive EMI absorber has an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher, or the thermally-conductive EMI absorber has an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz; and
wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least 70% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 30% by volume of the matrix.
17 . The thermally-conductive EMI absorber of claim 16 , wherein the at least one functional filler further comprises one or more of zinc oxide, silicon carbide, carbonyl iron, aluminum oxide, aluminum nitride, aluminum, boron nitride, silicon nitride, iron, graphite, ferrite, alumina trihydrate, silica, iron silicide, manganese zinc ferrite, nickel zinc ferrite, and/or SENDUST magnetic metal powder.
18 . The thermally-conductive EMI absorber of claim 16 , wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and
the thermally-conductive EMI absorber includes at least 80% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 20% by volume of the matrix.
19 . The thermally-conductive EMI absorber of claim 16 , wherein:
the thermally-conductive EMI absorber includes at least about 96% by weight of the at least one functional filler and no more than about 4% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least about 82% by volume of the at least one functional filler and no more than about 16% by volume of the matrix.
20 . The thermally-conductive EMI absorber of claim 16 , wherein:
the at least one functional filler further includes alumina, iron silicide, and manganese zinc ferrite;
the matrix comprises a silicone matrix; and
the thermally-conductive EMI absorber includes about 53% by weight of the stainless steel, about 33% by weight of the alumina, about 10% by weight of the iron silicide/manganese zinc ferrite, and about 4% by weight of the silicone matrix.
21 . The thermally-conductive EMI absorber of claim 20 , wherein the thermally-conductive EMI absorber has an attenuation of at least about 1 dB/cm at 1 MHZ, at least about 5 dB/cm at 1 GHz, at least about 10 dB/cm at 2 MHZ, and at least about 20 dB/cm at 4 GHz.
22 . A thermally-conductive electromagnetic interference (EMI) absorber comprising a matrix and at least one functional filler in the matrix, wherein the at least one functional filler comprises stainless steel, and wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least 70% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 30% by volume of the matrix.
23 . The thermally-conductive EMI absorber of claim 22 , wherein the thermally-conductive EMI absorber has a thermal conductivity of at least about 5 Watts per meter per Kelvin (W/mK) and an attenuation within a range from about 1 dB/cm to about 15 dB/cm for frequencies within a range from 1 MHz to 2 GHz.
24 . The thermally-conductive EMI absorber of claim 22 , wherein the thermally-conductive EMI absorber has a thermal conductivity of greater than 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.
25 . The thermally-conductive EMI absorber of claim 22 , wherein the at least one functional filler further comprises one or more of zinc oxide, silicon carbide, carbonyl iron, aluminum oxide, aluminum nitride, aluminum, boron nitride, silicon nitride, iron, graphite, ferrite, alumina trihydrate, silica, iron silicide, manganese zinc ferrite, nickel zinc ferrite, and/or SENDUST magnetic metal powder.
26 . The thermally-conductive EMI absorber of claim 22 , wherein:
the thermally-conductive EMI absorber includes at least 90% by weight of the at least one functional filler; and the thermally-conductive EMI absorber includes less than 10% by weight of the matrix; and
the thermally-conductive EMI absorber includes at least 80% by volume of the at least one functional filler, and the thermally-conductive EMI absorber includes less than 20% by volume of the matrix.
27 . The thermally-conductive EMI absorber of claim 22 , wherein:
the thermally-conductive EMI absorber includes at least about 96% by weight of the at least one functional filler and no more than about 4% by weight of the matrix; and/or
the thermally-conductive EMI absorber includes at least about 82% by volume of the at least one functional filler and no more than about 16% by volume of the matrix.
28 . The thermally-conductive EMI absorber of claim 22 , wherein:
the at least one functional filler includes stainless steel, alumina, iron silicide, and manganese zinc ferrite;
the matrix comprises a silicone matrix; and
the thermally-conductive EMI absorber includes about 53% by weight of the stainless steel, about 33% by weight of the alumina, about 10% by weight of the iron silicide/manganese zinc ferrite, and about 4% by weight of the silicone matrix.
29 . The thermally-conductive EMI absorber of claim 28 , wherein the thermally-conductive EMI absorber has an attenuation of at least about 1 dB/cm at 1 MHz, at least about 5 dB/cm at 1 GHz, at least about 10 dB/cm at 2 MHz, and at least about 20 dB/cm at 4 GHz.