IP Library Granted Patent US 10,889,675
Granted Patent B2
US 10,889,675 · App. 16/078,878 · Granted Jan 12, 2021

Rheology modifiers for encapsulating quantum dots

Inventors: Zhifeng Bai (Midland, MI); Jake Joo (Somerville, MA); James C. Taylor (Grafton, MA); Liang Chen (Midland, MI); Valeriy V. Ginzburg (Midland, MI); Jessica Ye Huang (Midland, MI); Christopher J. Tucker (Midland, MI)
Assignees: Rohm and Haas Electronic Materials LLC; Dow Global Technologies LLC
C08F287/00B82Y20/00C08F292/00C08K3/08C08K5/10C09K11/02B82Y30/00B82Y40/00C08K2201/001
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Quick Facts
Patent No.
US 10,889,675
App. No.
16/078,878
Granted
Jan 12, 2021
Kind
B2
Abstract

A polymer resin comprising: (a) quantum dots, (b) a compound of formula (I) (I) wherein R 1 is hydrogen or methyl and R 2 is a C 6 -C 20 aliphatic polycyclic substituent, and (c) a block or graft copolymer having Mn from 50,000 to 400,000 and comprising from 10 to 100 wt % polymerized units of styrene and from 0 to 90 wt % of a non-styrene block; wherein the non-styrene block has a van Krevelen solubility parameter from 15.0 to 17.5 (J/cm 3 ) 1/2 .

Claims (18)

1. A polymer resin comprising:

(a) quantum dots,

(b) a compound of formula (I)

wherein R 1 is hydrogen or methyl and R 2 is a C 6 -C 20 aliphatic polycyclic substituent, and

(c) a block or graft copolymer having M n from 50,000 to 400,000 and comprising from 10 to 100 wt % polymerized units of styrene and from 0 to 90 wt % of a non-styrene block; wherein the non-styrene block has a van Krevelen solubility parameter from 15.0 to 17.5 (J/cm 3 ) 1/2 .

2. The polymer resin of claim 1 in which R 2 is a C 7 -C 17 bridged polycyclic substituent.

3. The polymer resin of claim 2 in which the block or graft copolymer is a hydrocarbon polymer which comprises at least 20 wt % polymerized units of styrene and at least 20% polymerized units of alkenes, dienes or a combination thereof.

4. The polymer resin of claim 3 comprising from 70 to 95 wt % of the compound of formula (I), from 1 to 20 wt % of the block or graft copolymer, 0.01 to 5 wt % of quantum dots and from 0.3 to 5 wt % curing agents.

5. The polymer resin of claim 4 in which R 2 has a bicyclo[2,2,1]alkane or tricyclodecane ring system.

6. The polymer resin of claim 5 in which the block or graft copolymer has M n from 60,000 to 300,000.

7. The polymer resin of claim 6 in which the block or graft copolymer has at least 20% polymerized units of styrene and no more than 80 wt % polymerized units of monomers selected from the group consisting of C 2 -C 8 alkenes and C 2 -C 8 dienes.

8. The polymer resin of claim 7 in which the C 2 -C 8 alkenes and dienes are selected from the group consisting of ethylene, propylene, butylene, isoprene and butadiene.

9. The polymer resin of claim 8 in which the hydrocarbon polymer has M n from 70,000 to 250,000.

10. A polymer resin comprising:

(a) quantum dots,

(b) a compound of formula (I)

wherein R 1 is hydrogen or methyl and R 2 is a C 6 -C 20 aliphatic polycyclic substituent, and

(c) a homopolymer or random copolymer with M n greater than polymer critical molecular weight, M c and with a van Krevelen solubility parameter from 16.5 to 20.0 (J/cm 3 ) 1/2 .

Assignments (5)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
CHANGE OF LEGAL ENTITY Recorded Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →