Patent Assignment
Reel/Frame 068971/0226
Assignment of Assignor's Interest
Recorded: 2024-09-17
Pages: 100
Assignor
DOW GLOBAL TECHNOLOGIES LLC
Executed: 2017-08-01
Assignee
THE DOW CHEMICAL COMPANY
2200 WEST SALZBURG ROAD PO BOX 994, AUBURN, MICHIGAN, 48611
Covered Properties
(86)
Planarized Microelectronic Substrates
Aqueous Developable Benzocyclobutene-Based Polymer Composition and Method of Use of Such Compositions
Method Of Forming Open-Network Polishing Pads
Method of Forming Layered-Open-Network Polishing Pads
Method of Forming Structured-Open-Network Polishing Pads
Underlayer Composition and Method of Imaging Underlayer Composition
Underlayer Composition and Method of Imaging Underlayer
Photoacid Generators
Diblock Copolymer Blend Composition
Thermal annealing process
Plating Bath and Method
Thermal annealing process
High temperature thermal annealing process
Compositions and Antireflective Coatings for Photolithography
Composition and method for preparing pattern on a substrate
Block copolymer composition and methods relating thereto
Block Coploymer Formulation and Methods Relating Thereto
Directed self assembly copolymer composition and related methods
Chemical Mechanical Polishing Pad with Broad Spectrum, Endpoint Detection Window and Method of Polishing Therewith
Multilayer Chemical Mechanical Polishing Pad
Broad Spectrum, Endpoint Detection Monophase Olefin Copolymer Window with Specific composition in Multilayer Chemical Mechanical Polishing Pad
Soft And Conditionable Chemical Mechanical Polishing Pad Stack
Soft and Conditionable Chemical Mechanical Window Polishing Pad
Multilayer Chemical Mechanical Polishing Pad Stack With Soft And Conditionable Polishing Layer
Orientation Control Layer Formed on a Free Top Surface of a First Block Copolymer from a Mixture of First and Second Block Copolymers
Photoresist Composition, Coated Substrate, and Method of Forming Electronic Device
Aromatic Polyacetals and Articles Comprising Them
Bis(Aryl)Acetal Compounds
Photoacid Generator Compound, Polymer Comprising End Groups Containing the Photoacid Generator Compound, and Method of Making
Polymer Comprising End Groups Containing Photoacid Generator, Photoresist Comprising the Polymer, and Method of Making a Device
Method of Chemical Mechanical Polishing a Substrate
Acid Generator Compounds and Photoresists Comprising Same
Ephemeral Bonding
Methods of Forming Patterns by Using a Brush Layer and Masks
Chemical Mechanical Polishing Pad with Endpoint Detection Window
Chemical Mechanical Polishing Pad with Polishing Layer and Window
Soft and Conditionable Chemical Mechanical Polishing Pad with Window
Patent:
9,064,806 →
Application:
14/228,744 →
Chemical Mechanical Polishing Pad with Endpoint Detection Window
Chemical Mechanical Polishing Pad with Clear Endpoint Detection Window
Neutral Layer Polymers, Methods of Manufacture Thereof and Articles Comprising the Same
Chemical Mechanical Polishing Layer Formulation with Conditioning Tolerance
Underlayer Composition and Method of Imaging Underlayer
Underlayer Composition and Method of Imaging Underlayer Composition
Polyurethane Polishing Pad
High-Stability Polyurethane Polishing Pad
Controlled-Viscosity Cmp Casting Method
Methods for Annealing Block Copolymers and Articles Manufactured Therefrom
Copolymer Formulations, Methods of Manufacture Thereof and Articles Comprising the Same
Method of Controlling Block Copolymer Characteristics and Articles Manufactured Therefrom
Gap-Fill Methods
Directed Self-Assembly Pattern Formation Methods and Compositions
Method of Releasably Attaching a Semiconductor Substrate to a Carrier
Polishing Pad Window
Methods for Manufacturing Block Copolymers and Articles Manufactured Therefrom
Methods for Manufacturing Block Copolymer Compositions and Articles Manufactured Therefrom
Controlled-Porosity Method for Forming Polishing Pad
Chemical Mechanical Polishing Pad Composite Polishing Layer Formulation
Method of Making Polishing Layer for Chemical Mechanical Polishing Pad
Contact Hole Formation Methods
Patent:
9,455,177 →
Application:
14/840,941 →
Methods of Forming Patterns with a Mask Formed Utilizing a Brush Layer
Chemical Mechanical Polishing Method
Patent:
9,484,212 →
Application:
14/927,704 →
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
Copolymer Formulation for Directed Self Assembly, Methods of Manufacture Thereof and Articles Comprising the Same
Ephemeral Bonding
Polymers Containing Benzimidazole Moieties as Levelers
Method of Making Polishing Layer for Chemical Mechanical Polishing Pad
Neutral Layer Polymers, Methods of Manufacture Thereof and Articles Comprising the Same
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Pyridyl Alkylamines and Bisepoxides
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Imidazole and Bisepoxide Compounds
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Alpha Amino Acids and Bisepoxides
Method of Electroplating Photoresist Defined Features from Copper Electroplating Baths Containing Reaction Products of Imidazole Compounds, Bisepoxides and Halobenzyl Compounds
High Planarization Efficiency Chemical Mechanical Polishing Pads and Methods of Making
Arylcyclobutenes
Aliphatic Polyurethane Optical Endpoint Detection Windows and Cmp Polishing Pads Containing Them
Methods for Manufacturing Block Copolymers and Articles Manufactured Therefrom
Fluorene Derivatives as Light Emitting Elements for Electroluminescent Devices
New Metal Plating Compositions
New Metal Plating Compositions
Methods of Making Chemical Mechanical Polishing Layers Having Improved Uniformity
Organic Electroluminescent Compound and Organic Electroluminescent Device Comprising the Same
Curable Resin System Containing Quantum Dots
Rheology Modifiers for Encapsulating Quantum Dots
New Metal Plating Compositions
Spiroacridine Derivatives
Reaction Products of Amine Monomers and Polymers Containing Saturated Heterocyclic Moieties as Additives for Electroplating Baths
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 26, 2013
From: SHARMA, RAHUL; GINZBURG, VALERIY V.; HUSTAD, PHILLIP D.; WEINHOLD, JEFFREY D.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 030690/0992 →
Assignment of Assignor's Interest
Jul 21, 2014
From: HUSTAD, PHILLIP D.; GU, XINYU; VOGEL, ERIN B.; GINZBURG, VALERIY V.
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 033354/0502 →
Assignment of Assignor's Interest
Jul 21, 2014
From: HUSTAD, PHILLIP D.; GU, XINYU; WEINHOLD, JEFFREY D.; CHANG, SHIH-WEI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 033352/0143 →
Assignment of Assignor's Interest
Jul 21, 2014
From: GU, XINYU; HUSTAD, PHILLIP D.; WEINHOLD, JEFFREY D.; CHANG, SHIH-WEI
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 033352/0546 →
Assignment of Assignor's Interest
Jul 22, 2014
From: HUSTAD, PHILLIP D; GU, XINYU; GINZBURG, VALERIY V.; VOGEL, ERIN B
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 033361/0323 →
Assignment of Assignor's Interest
Jan 12, 2015
From: CHANG, SHIH-WEI; TREFONAS, PETER; WEINHOLD, JEFFREY D; HUSTAD, PHILLIP D
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 034683/0327 →
Assignment of Assignor's Interest
Jan 29, 2015
From: IAGODKINE, ELISSEI; LEE, INHO
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 034837/0026 →
Assignment of Assignor's Interest
Jan 29, 2015
From: ROMER, DUANE R.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 034837/0033 →
Assignment of Assignor's Interest
Mar 16, 2015
From: GU, XINYU; CHANG, SHIH-WEI; SHARMA, RAHUL; TREFONAS, PETER
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 035169/0353 →
Assignment of Assignor's Interest
Mar 18, 2015
From: RAO, YUANQIAO; WEAVER, JOHN D; POPA, PAUL J; JENKINS, ROXANNE M
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 035188/0983 →
Assignment of Assignor's Interest
Mar 18, 2015
From: AUGER, ROBERT L; SULLIVAN, CHRISTOPHER P; KIARIE, CECILIA W
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 035189/0061 →
Assignment of Assignor's Interest
Oct 28, 2015
From: TREFONAS, PETER
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 036903/0376 →
Assignment of Assignor's Interest
Aug 28, 2017
From: FOSTER, KENNETH L.; RADLER, MICHAEL J.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 043422/0268 →
Change of Name
Aug 28, 2017
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 043688/0960 →
Assignment of Assignor's Interest
Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
Change of Legal Entity
Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →