Method of forming layered-open-network polishing pads

1. A method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates comprising:

a) providing a first and second polymer sheet or film of a curable polymer, the first and second polymer sheet or film having a thickness, a peelable backing layer attached to the first and second polymer sheet or film;

b) exposing the first and second polymer sheets or films to an energy source to create an exposure pattern in the first and second polymer sheet or film, the exposure pattern having elongated sections exposed to the energy source, the energy source being collimated light;

c) removing polymer from the exposed first and second polymer sheets or films to form elongated channels through the first and second polymer sheets or films in a channel pattern that corresponds to the exposure pattern, the elongated channels extending through the thickness of the first and second polymer sheet or film without the first and second polymer sheet or film bridging the elongated channels from excessive exposure of the collimated light; and

d) attaching the first and second polymer sheets or films and peeling away the peelable backing layer of the first and second polymer sheets or films to form a polishing pad, the patterns of the first and second polymer sheets or films crossing wherein the first polymer sheet or film supports the second polymer sheet or film and the elongated channels from the first and second polymer sheets or films connect and to form the layered-open-network polishing pad with the first layer forming a base layer for attachment to a polishing platen and the layered-open-network pad having perpendicular channel side walls and horizontal top and bottom surfaces.

2. The method of claim 1 wherein the exposing the energy source to the first and second sheet or film cures the first and second sheet or film in the exposure pattern and the removing step includes a solvent to remove the polymer of the first and second sheets or films adjacent the exposure pattern.

3. The method of claim 1 wherein the exposing the first and second sheets or films to the energy source includes the collimated light sent through a photomask to form the exposure pattern.

4. The method of claim 1 wherein the exposing forms the exposure pattern with the exposure pattern having parallel channels.

5. The method of claim 1 wherein the removing polymer from the exposed first and second polymer sheets or films occurs before the attaching the first and second polymer sheets or films and including a step of drying the first and second polymer sheets or films before attaching the first and second polymer sheets or films.

6. A method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates comprising:

a) providing a first and second sheet or film of a photocurable polymer, the first and second polymer sheet or film having a thickness, a peelable backing layer attached to the first and second polymer sheet or film;

b) exposing the first and second polymer sheet or film to a collimated light source to create an exposure pattern in the first and second polymer sheet or film, the exposure pattern having elongated sections exposed to and cured from the collimated light source;

c) rinsing the exposed first and second polymer sheet or film with a solvent to remove polymer from the exposed first and second polymer sheets or films to form elongated channels through the sheets or films in a channel pattern that corresponds to the exposure pattern, the elongated channels extending through the thickness of the first and second polymer without the first and second polymer sheet or film bridging the elongated channels from excessive exposure of the collimated light; and

d) curing the first and second polymer sheets or films to attach the first and second polymer sheets or films and to form a polishing pad and peeling away the peelable backing layer of the first and second polymer sheets or films, the patterns of the first and second polymer sheets or films crossing wherein the first polymer sheet or film supports the second polymer sheet or film and the elongated channels from the first and second sheets or films connect to form the layered-open-network polishing pad with the first layer forming a base layer for attachment to a polishing platen and the layered-open-network pad having perpendicular channel side walls and horizontal top and bottom surfaces.

7. The method of claim 6 wherein the exposing the first and second sheets or films to the collimated light source includes collimated UV or laser light sent through a photomask to form the exposure pattern.

8. The method of claim 6 wherein the exposing forms the exposure pattern with the exposure pattern having parallel channels and the polishing pad includes layers having parallel channels in registration.

9. The method of claim 6 wherein the exposing forms the exposure pattern with, the exposure pattern having parallel channels and the polishing pad includes spaced layers having parallel channels in registration and perpendicular channels between adjacent layers.

10. The method of claim 6 wherein the removing polymer from the exposed first and second polymer sheets or films occurs before the attaching the first and second polymer sheets or films and including a step of drying the first and second polymer sheets or films before attaching the first and second polymer sheets or films.