Polymers containing benzimidazole moieties as levelers
View Patent ↗Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
1. A copper electroplating composition comprises: one or more sources of copper ions, an acid electrolyte, wherein the acid electrolyte comprises one or more acids and, optionally, one or more sources of halide ions, and one or more polymers, the polymers comprise a reaction product of one or more dihalogens having a formula:
X—R—X (X)
and one or more compounds having formula:
where R 1 , R 2 and R 3 of rings A and B may be the same or different and are hydrogen, thiol, linear or branched thio(C 1 -C 12 )alkyl, hydroxyl, linear or branched hydroxy(C 1 -C 12 )alkyl, amine, linear or branched alkyl(C 1 -C 12 )amine, linear or branched (C 1 -C 12 )alkyl, alkoxy, linear or branched alkoxy(C 1 -C 12 )alkyl or substituted or unsubstituted aryl, with the proviso that at least one of the compounds of formula (I) reacts with the one or more dihalogens to form the reaction product, R 2 and R 3 of ring A or B are taken together with their carbon atoms to form a fused substituted or unsubstituted six membered aromatic ring; and R is (C 1 -C 12 )alkyl, and X is a halide selected from the group consisting of fluoride, chloride, bromide and iodide.
2. The copper electroplating composition of claim 1 , wherein the one or more polymers are included in the composition in amounts from 0.01 ppm to 5,000 ppm.
3. The copper electroplating composition of claim 1 , further comprising one or more accelerators and suppressors.