IP Library Granted Patent US 9,452,507
Granted Patent B2
US 9,452,507 · App. 14/576,896 · Granted Sep 27, 2016

Controlled-viscosity CMP casting method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,452,507
App. No.
14/576,896
Granted
Sep 27, 2016
Kind
B2
Abstract

The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material contains 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The liquid polyurethane material contains a blend of preexpanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity μ μ 0 of 1.1 to 7. Then the liquid polyurethane material solidifies into a polyurethane matrix that contains preexpanded and expanded fluid-filled polymeric microsphere for forming the polishing pad.

Claims (78)

1. A method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates, the method comprising the following:

obtaining a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent, the liquid polyurethane material having a

T gel temperature and containing 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule, the fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres, the preexpanded and unexpanded fluid-filled polymeric microspheres each having a T start temperature where diameter of the preexpanded and unexpanded fluid-filled polymeric microspheres increases at temperatures equal to or above the T start temperature, with the T start temperature of the unexpanded fluid-filled polymeric microspheres being at least 5° C. less than the T gel temperature of the liquid polyurethane material;

casting the liquid polyurethane material containing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres, the liquid polyurethane material containing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity

μ

μ

0

of 1.1 to 7, wherein

μ

μ

0

=

1

+

2.5

ϕ

+

10.05

ϕ

2

+

0.00273

16.6

ϕ

where μ is the viscosity of the filled system, μ 0 the viscosity of the unfilled material,

μ

μ

0

the relative viscosity, and Φ the volume fraction of the filler;

heating and curing the liquid polyurethane material and the blend of prexpanded and unexpanded fluid-filled polymeric microspheres to a temperature of at least T start of the unexpanded fluid-filled polymeric microspheres to increase the diameter of the unexpanded fluid-filled polymeric microspheres and to form a blend of preexpanded and expanded fluid-filled polymeric microspheres in the liquid polyurethane material and then solidify the liquid polyurethane material into a polyurethane matrix containing the preexpanded and expanded fluid-filled polymeric microspheres; and

forming the polishing pad from the polyurethane matrix containing the preexpanded and expanded fluid-filled polymeric microspheres.

2. The method of claim 1 including the additional step of mixing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres in the liquid polyurethane material before casting.

3. The method of claim 1 wherein the casting is into a cake mold to form a polyurethane cake structure; and including the additional steps of removing the polyurethane cake structure from the mold and skiving the cake structure into multiple polyurethane sheets; and the forming the polishing pads is from the polyurethane sheets.

4. The method of claim 1 wherein the casting includes pouring the liquid polyurethane material and the blend of preexpanded and expanded fluid-filled polymeric microspheres around a transparent block and the forming the polishing pad includes a transparent window in the polishing pad.

5. A method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates, the method comprising the following:

obtaining a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent, the liquid polyurethane material having a

T gel temperature and containing 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule, the fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres filled with isobutane, isopentane or a mixture of isobutane and isopentane, the preexpanded and unexpanded fluid-filled polymeric microspheres each having a T start temperature where diameter of the preexpanded and unexpanded fluid-filled polymeric microspheres increases at temperatures equal to or above the T start temperature, with the T start temperature of the unexpanded fluid-filled polymeric microspheres being at least 5° C. less than the T gel temperature of the liquid polyurethane material;

casting the liquid polyurethane material containing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres, the liquid polyurethane material containing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity

μ

μ

0

of 1.1 to 7, wherein

μ

μ

0

=

1

+

2.5

ϕ

+

10.05

ϕ

2

+

0.00273

16.6

ϕ

where μ is the viscosity of the filled system, μ 0 the viscosity of the unfilled material,

μ

μ

0

the relative viscosity, and Φ the volume fraction of the filler;

heating and curing the liquid polyurethane material and the blend of prexpanded and unexpanded fluid-filled polymeric microspheres to a temperature of at least T start of the unexpanded fluid-filled polymeric microspheres to increase the diameter of the unexpanded fluid-filled polymeric microspheres and to form a blend of preexpanded and expanded fluid-filled polymeric microspheres in the liquid polyurethane material and then solidify the liquid polyurethane material into a polyurethane matrix containing the preexpanded and expanded fluid-filled polymeric microspheres; and

forming the polishing pad from the polyurethane matrix containing the preexpanded and expanded fluid-filled polymeric microspheres.

6. The method of claim 5 including the additional step of mixing the blend of preexpanded and unexpanded fluid-filled polymeric microspheres in the liquid polyurethane material before casting.

7. The method of claim 5 wherein the casting is into a cake mold to form a polyurethane cake structure; and including the additional steps of removing the polyurethane cake structure from the mold and skiving the cake structure into multiple polyurethane sheets; and the forming the polishing pads is from the polyurethane sheets.

8. The method of claim 5 wherein the casting includes pouring the liquid polyurethane material and the blend of preexpanded and expanded fluid-filled polymeric microspheres around a transparent block and the forming the polishing pad includes a transparent window in the polishing pad.

Assignments (6)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
CHANGE OF LEGAL ENTITY Recorded Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2016
From: QIAN, BAINIAN; SHIDNER, DAVID; JACOB, GEORGE C.
To: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 038899/0397 →