Method of forming structured-open-network polishing pads

1. A method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates comprising:

a) providing a first and second polymer sheet or film of a photocurable polymer, the first and second polymer sheet or film having a thickness;

b) exposing the first and second polymer sheets or films to a collimated light energy source to create an exposure pattern in the first and second polymer sheet or film with light exposure, the exposure pattern having elongated sections exposed to the collimated light energy source, the light exposure being of an exposure time sufficient to cure the photocurable polymer, the exposure time being insufficient to cure adjacent elongated sections together;

c) removing polymer from the exposed first and second polymer sheets or films adjacent the exposure pattern to form elongated channels through the first and second polymer sheets or films in a channel pattern that corresponds to the exposure pattern, the elongated channels extending through the thickness of the first and second polymer;

d) attaching the first and second polymer sheets or films to form a polishing pad, the patterns of the first and second polymer sheets or films crossing wherein the first polymer sheet or film supports the second polymer sheet or film and the elongated channels from the first and second polymer sheets or films connect in parallel planes to form the layered-open-network polishing pad with one of the polymer sheets or films forming a polishing surface; and

e) curing the layered-open-network polishing pad to secure the layered-open-network polishing pad with the first and second sheets or films having sufficient stiffness to reduce sagging and maintain an orthogonal relationship between the elongated channels and the parallel planes of the polymer sheets or films and the layered-open-network pad having perpendicular channel side walls and horizontal top and bottom surfaces.

2. The method of claim 1 wherein the elongated channels of adjacent parallel planes are attached in, an orthogonal relationship.

3. The method of claim 1 wherein the exposing the first and second sheets or films to the collimated light energy source includes collimated light sent through a photomask or sent in a direct pattern to form the exposure pattern with either curved or linear elongated channels.

4. The method of claim 3 wherein the exposing forms the exposure pattern with the exposure pattern having parallel channels.

5. The method of claim 1 including a partial curing step of the first and second polymer sheet or film before attaching the first and second polymer sheet or film.

6. A method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates comprising:

a) providing a first and second polymer sheet or film of a photocurable polymer, the first and second polymer sheet or film having a thickness;

b) exposing the first and second polymer sheets or films to a collimated light energy source to create an exposure pattern in the first and second polymer sheet or film with light exposure, the exposure pattern having elongated sections exposed to the collimated light energy source, the light exposure being of an exposure time sufficient to cross-link the photocurable polymer, the exposure time being insufficient to cross-link adjacent elongated sections together;

c) removing polymer from the exposed first and second polymer sheets or films adjacent the exposure pattern with an aqueous solution to form elongated channels through the first and second polymer sheets or films in a channel pattern that corresponds to the exposure pattern, the elongated channels extending through the thickness of the first and second polymer;

d) drying the first and second sheets or films to remove the aqueous solution and provide a partial cure for the first and second sheets or films;

e) attaching the first and second polymer sheets or films to form a polishing pad, the patterns of the first and second polymer sheets or films crossing wherein the first polymer sheet or film supports the second polymer sheet or film and the elongated channels from the first and second polymer sheets or films connect in parallel planes to form the layered-open-network polishing pad with one of the polymer sheets or films forming a polishing surface and the layered-open-network pad having perpendicular channel side walls and horizontal top and bottom surfaces; and

f) curing the layered-open-network polishing pad to secure the layered-open-network polishing pad with the first and second sheets or films having sufficient stiffness to reduce sagging and maintain an orthogonal relationship between the elongated channels and the parallel planes of the polymer sheets or films, the orthogonal relationship being an angle between 80 and 100 degrees.

7. The method of claim 6 wherein the elongated channels of adjacent parallel planes are attached in an orthogonal relationship.

8. The method of claim 6 wherein the exposing the first and second sheets or films to the collimated light energy source includes collimated light sent through a photomask or sent in a direct pattern to form the exposure pattern with either curved or linear elongated channels.

9. The method of claim 8 wherein the exposing forms the exposure pattern with the exposure pattern having parallel channels.

10. The method of claim 6 including the partial curing step of the first and second polymer sheet or film before attaching the first and second polymer sheet or film.