Contact hole formation methods
View Patent ↗Methods of forming contact holes comprising: (a) providing a substrate comprising a plurality of post patterns over a layer to be patterned; (b) forming a hardmask layer over the post patterns and the layer to be patterned; (c) coating a pattern treatment composition over the hardmask layer, wherein the pattern treatment composition comprises a polymer comprising a reactive surface attachment group and a solvent; and optionally baking the substrate; wherein the polymer becomes bonded to the hardmask layer to form a polymer layer over the hardmask layer; and (d) treating the substrate with a rinsing agent comprising a solvent to remove residual, unbound said polymer, thereby forming a first hole disposed between a plurality of surrounding post patterns. The method is free of exposing the polymer to activating radiation from coating the pattern treatment composition to treating the substrate with the solvent. Also provided are pattern treatment compositions and electronic devices formed by the methods. The inventions find particular applicability in the manufacture of semiconductor devices for providing high resolution contact hole patterns.
1. A contact hole formation method, comprising:
(a) providing a substrate comprising a plurality of post patterns over a layer to be patterned;
(b) forming a hardmask layer over the post patterns and the layer to be patterned;
(c) coating a pattern treatment composition over the hardmask layer, wherein the pattern treatment composition comprises a polymer comprising a reactive surface attachment group and a solvent; and optionally baking the substrate;
wherein the polymer becomes bonded to the hardmask layer to form a polymer layer over the hardmask layer; and
(d) treating the substrate with a rinsing agent comprising a solvent to remove residual, unbound said polymer, thereby forming a first hole disposed between a plurality of surrounding post patterns;
wherein the method is free of exposing the polymer to activating radiation from coating the pattern treatment composition to treating the substrate with the solvent.
2. The method of claim 1 , wherein the post patterns comprise an organic material.
3. The method of claim 1 , wherein the hardmask material is a silicon oxide, a silicon nitride or a silicon oxynitride.
4. The method of claim 1 , wherein the polymer is covalently bonded to the hardmask material.
5. The method of claim 1 , wherein the polymer is hydrogen bonded to the hardmask material.
6. The method of claim 1 , wherein the polymer is an organosilicon polymer.
7. The method of claim 1 , wherein the polymer is an organic polymer.
8. The method of claim 1 , wherein the reactive surface attachment group is chosen from one or more of hydroxyl, sulfhydryl, carboxyl, epoxide, amine, amide, imine, diazine, diazole, optionally substituted pyridine, pyridinium and optionally substituted pyrrolidone groups.
9. The method of claim 1 , further comprising baking the substrate after coating the pattern treatment composition and before treating the substrate with the solvent.
10. The method of claim 1 , further comprising, after treating the substrate with the solvent, selectively removing the posts to form second holes and transferring a pattern of the first hole and the second holes to the substrate.