Granted Patent B2

US 9,644,118 · App. 14/636,981 · Granted May 9, 2017

Abstract

Claims (16)

1. A method of releasably attaching a semiconductor substrate to a carrier substrate comprising:

(a) providing a semiconductor substrate having a front side and a back side, the front side having a copper surface;

(b) providing a carrier substrate having an attachment surface;

(c) disposing a temporary bonding composition comprising a curable adhesive material, a release additive, and a copper passivation agent between the front side of the semiconductor substrate and the attachment surface of the carrier substrate, wherein the release additive is chosen from polyether compounds, polyetheramine compounds, and mixtures thereof;

(d) curing the curable adhesive material to provide a temporary bonding layer disposed between the front side of the semiconductor substrate and the attachment surface of the carrier substrate; wherein the temporary bonding layer adjacent to the attachment surface of the carrier substrate comprises a relatively lower amount of the release additive and the temporary bonding layer adjacent to the front side of the semiconductor substrate comprises a relatively higher amount of the release additive;

(e) performing an operation on the back side of the semiconductor substrate; and

(f) separating the front side of the semiconductor substrate from the temporary bonding layer.

2. The method of claim 1 wherein the curable adhesive material is chosen from polyarylene oligomers, cyclic-olefin oligomers, arylcyclobutene oligomers, vinyl aromatic oligomers, and mixtures thereof.

3. The method of claim 1 wherein the polyether compounds are chosen from polyalkylene oxide homopolymers, polyalkylene oxide copolymers, and mixtures thereof.

4. The method of claim 1 wherein the copper passivation agent contains a nitrogen-containing heteroaromatic ring moiety.

5. The method of claim 4 wherein the copper passivation agent is a nitrogen-containing heteroaromatic compound having one or more hydrogens on an aromatic ring replaced with one or more substituents chosen from C 1-10 alkyl, C 6-10 aryl, C 7-20 aralkyl, C 2-10 alkenyl, C 1-10 alkoxy, carboxy, C 1-10 alkoxycarbonyl, carb-C 1-10 -alkoxy, sulfoxy, hydroxy, thiol, C 1-10 alkylmercaptan, C 6-10 arylmercaptan, amino, C 1-10 alkyl amino, di-C 1-10 -alkylamino, C 6-10 aryl amino, di-C 6-10 -arylamino, C 1-10 amido, C 2-50 alkylamido, C 3-50 dialkylamido, and halogen.

6. The method of claim 1 further comprising the step of treating the attachment surface of the carrier substrate with an adhesion promoter prior to contact with the temporary bonding composition.

7. The method of claim 1 wherein the polyether compound is a poly C 1-4 alkyleneoxide compound.

8. The method of claim 1 wherein the release additive is chosen from polyethylene glycol, polypropylene glycol, poly(1,3-propanediol), poly(tetrahydrofuran), ethylene oxide (EO)-propylene oxide (PO) copolymers, EO-butylene oxide (BO) copolymers, amine terminated polypropylene oxide, polyalkylene oxide functionalized polyamines, and mixtures thereof.

9. The method of claim 1 wherein the copper passivation agent does not react with the adhesive material under conditions of storage and use, and does not cure under the conditions employed to cure the adhesive material.

10. The method of claim 1 wherein the copper passivation agent is chosen from C 1-10 alkylbenzimidazole, aminobenzimidazole, C 1-10 alkylaminobenzimidazole, di-C 1-10 -alkylbenzimidazole, C 6-10 arylbenzimidazole, carboxybenzimidazole, C 1-10 alkoxycarbonylbenzimidazole, halobenzimidazole, C 1-10 alkylbenzotriazole, aminobenzotriazole, C 1-10 alkylaminobenzotriazole, di-C 1-10 -alkylbenzotriazole, C 6-10 arylbenzotriazole, carboxybenzotriazole, C 1-10 alkoxycarbonylbenzotriazole, C 1-10 amidobenzotriazole, C 2-50 alkylamidobenzotriazole, C 3-50 dialkylamidobenzotriazole and halobenzotriazole.

Assignments (9)