Patent Assignment
Reel/Frame 035080/0476
Assignment of Assignor's Interest
Recorded: 2015-03-04
Pages: 3
Assignor
BAI, ZHIFENG
Executed: 2015-02-23
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Property
(1)
Method of Releasably Attaching a Semiconductor Substrate to a Carrier
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 4, 2015
From: OLIVER, MARK S.; GALLAGHER, MICHAEL
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 035080/0467 →
Assignment of Assignor's Interest
Feb 20, 2017
From: BAI, ZHIFENG Z
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 041300/0260 →
Assignment of Assignor's Interest
Feb 20, 2017
From: OLIVER, MARK; GALLAGHER, MICHAEL K
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC
Reel/Frame 041300/0381 →
Assignment of Assignor's Interest
Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
Assignment of Assignor's Interest
Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
Change of Legal Entity
Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →