IP Library Granted Patent US 8,513,356
Granted Patent B1
US 8,513,356 · App. 13/370,571 · Granted Aug 20, 2013

Diblock copolymer blend composition

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Quick Facts
Patent No.
US 8,513,356
App. No.
13/370,571
Granted
Aug 20, 2013
Kind
B1
Abstract

A diblock copolymer blend containing a unique combination of an ordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer and a disordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer is provided. Also provided are substrates treated with the diblock copolymer blend.

Claims (118)

1. A diblock copolymer blend, comprising:

>50 wt % to 99 wt % (on a solids basis) of an ordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer, BCP1, having a polystyrene volume fraction, Vf BCP1-PS , of 0.65 to 0.87; and, wherein the following expression is true

χ

N

BCP

1

>

[

1.6

Vf

BCP

1

-

PS

*

(

1

-

VF

BCP

1

-

PS

)

-

0.098

]

wherein χN BCP1 is the product of the Flory-Huggins interaction parameter, χ BCP1 , of BCP1 at 225° C. and the degree of polymerization, N BCP1 , of BCP1;

and,

1 to <50 wt % (on a solids basis) of a disordered poly(styrene)-b-poly(methyl methacrylate) diblock copolymer, BCP2, having a polystyrene volume fraction, Vf BCP2-PS , of 0.5 to 0.99; and, wherein the following expression is true

χ

N

BCP

2

<

[

2.6

Vf

BCP

2

-

PS

*

(

1

-

VF

BCP

2

-

PS

)

]

wherein χN BCP2 is the product of the Flory-Huggins interaction parameter, χ BCP2 , of BCP2 at 225° C. and the degree of polymerization, N BCP2 , of BCP2;

wherein the number average molecular weight of BCP1, M N-BCP1 , is 30 to 500 kg/mol;

wherein the number average molecular weight of BCP2, M N-BCP2 is 0.1 to <500 kg/mol; and,

wherein M N-BCP1 >M N-BCP2 .

2. The diblock copolymer blend of claim 1 , wherein the BCP1 exhibits a number average molecular weight, M N-BCP1 , of 30 to 500 kg/mol with a polydispersity, PD BCP1 , of 1 to 2.

3. The diblock copolymer blend of claim 1 , wherein the BCP2 exhibits a number average molecular weight, M N-BCP2 , of 0.1 to <500 kg/mol with a polydispersity, PD BCP2 , of 1 to 2.

4. The diblock copolymer blend of claim 1 ,

wherein the BCP1 exhibits a number average molecular weight, M N-BCP1 , of 30 to 500 kg/mol with a polydispersity, PD BCP1 , of 1 to 2; and,

wherein the BCP2 exhibits a number average molecular weight, M N-BCP2 , of 0.1 to <500 kg/mol with a polydispersity, PD BCP2 , of 1 to 2.

5. The diblock copolymer blend of claim 1 , wherein the following equation is satisfied:

0.20

Vf

BCP

1

-

PS

-

Vf

BCP

2

-

PS

Vf

BCP

1

-

PS

.

6. The diblock copolymer blend of claim 1 , further comprising a solvent; wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethoxyethyl propionate, anisole, ethyl lactate, 2-heptanone, cyclohexanone, amyl acetate, γ-butyrolactone (GBL), n-methylpyrrolidone (NMP) and toluene.

7. The diblock copolymer blend of claim 1 , further comprising an additive; wherein the additive is selected from the group consisting of additional polymers (including homopolymers and random copolymers); surfactants; antioxidants; photoacid generators; thermal acid generators; quenchers; hardeners; adhesion promoters; dissolution rate modifiers; photocuring agents; photosensitizers; acid amplifiers; plasticizers; orientation control agents and cross linking agents.

8. The diblock copolymer blend of claim 1 , further comprising an orientation control agent.

9. A method comprising:

providing a substrate having a surface;

providing a diblock copolymer blend according to claim 1 ;

applying a film of the diblock copolymer blend to the surface of the substrate;

optionally, baking the film;

annealing the film;

treating the annealed film to remove the poly(methyl methacrylate), providing a product film with a plurality of perpendicular, cylindrical holes;

wherein each of the perpendicular, cylindrical holes exhibit an axis of symmetry that is perpendicular to the surface of the substrate.

10. The method of claim 9 , wherein the product film exhibits a degree of perpendicular, cylindrical hole orientation, D perp , of ≧0.95 to 1.

Assignments (6)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
CHANGE OF LEGAL ENTITY Recorded Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2013
From: SHARMA, RAHUL; GINZBURG, VALERIY V.; HUSTAD, PHILLIP D.; WEINHOLD, JEFFREY D.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 030690/0992 →