IP Library Granted Patent US 8,961,918
Granted Patent B2
US 8,961,918 · App. 13/370,907 · Granted Feb 24, 2015

Thermal annealing process

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Quick Facts
Patent No.
US 8,961,918
App. No.
13/370,907
Granted
Feb 24, 2015
Kind
B2
Abstract

A method for processing a substrate is provided; wherein the method comprises applying a film of a copolymer composition, comprising a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component to a surface of the substrate; optionally, baking the film; subjecting the film to a high temperature annealing process under particularized atmospheric conditions for a specified period of time; followed by a treatment of the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(dimethylsiloxane) in the annealed film to SiO x .

Claims (31)

1. A method for processing a substrate, comprising:

providing a substrate having a surface;

providing a copolymer composition, comprising a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component, wherein the number average molecular weight of the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component is 25 to 1,000 kg/mol, and, an optional solvent;

applying a film of the copolymer composition to the surface of the substrate;

baking the film to remove any solvent;

heating the film at 300 to 350° C. under a gaseous atmosphere having an oxygen concentration of ≦7.5 ppm for a period of 1 second to 4 hours to form an annealed film; and,

treating the annealed film to remove the poly(styrene) from the annealed film and to convert the poly(dimethylsiloxane) in the annealed film to SiO x .

2. The method of claim 1 , wherein the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component provided is a single poly(styrene)-b-poly(dimethylsiloxane) diblock copolymer having a number average molecular weight, Ms, of 25 to 1,000 kg/mol; a polydispersity, PD, of 1 to 3; and a poly(dimethylsiloxane) weight fraction, Wf PDMS , of 0.19 to 0.33.

3. The method of claim 2 , wherein the copolymer composition provided further comprises a solvent; wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethoxyethyl propionate, anisole, ethyl lactate, 2-heptanone, cyclohexanone, amyl acetate, γ-butyrolactone (GBL), n-methylpyrrolidone (NMP) and toluene.

4. The method of claim 2 , wherein the copolymer composition provided further comprises an additive; wherein the additive is selected from the group consisting of additional polymers (including homopolymers and random copolymers); surfactants; antioxidants; photoacid generators; thermal acid generators; quenchers; hardeners; adhesion promoters; dissolution rate modifiers; photocuring agents; photosensitizers; acid amplifiers; plasticizers; orientation control agents and cross linking agents.

5. The method of claim 1 , wherein the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component is a blend of at least two different poly(styrene)-b-poly(dimethylsiloxane) block copolymers;

wherein the at least two different poly(styrene)-b-poly(dimethylsiloxane) block copolymers are selected from the group of poly(styrene)-b-poly(dimethylsiloxane) block copolymers having a number average molecular weight, M N , of 1 to 1,000 kg/mol and a polydispersity, PD, of 1 to 3; and,

wherein the blend exhibits a blend number average molecular weight, M N-Blend , of 25 to 1,000 kg/mol.

6. The method of claim 5 , wherein the blend exhibits a blend poly(dimethylsiloxane) weight fraction, Wf PDMS-Blend , of 0.19 to 0.33.

7. The method of claim 6 , wherein the copolymer composition provided further comprises a solvent; wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethoxyethyl propionate, anisole, ethyl lactate, 2-heptanone, cyclohexanone, amyl acetate, γ-butyrolactone (GBL), n-methylpyrrolidone (NMP) and toluene.

8. The method of claim 6 , wherein the copolymer composition provided further comprises a solvent; wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA) and toluene.

9. The method of claim 6 , wherein the copolymer composition provided further comprises an additive; wherein the additive is selected from the group consisting of additional polymers (including homopolymers and random copolymers); surfactants; antioxidants; photoacid generators; thermal acid generators; quenchers; hardeners; adhesion promoters; dissolution rate modifiers; photocuring agents; photosensitizers; acid amplifiers; plasticizers; orientation control agents and cross linking agents.

10. The method of claim 1 , wherein the gaseous atmosphere is selected from the group consisting of nitrogen and argon.

11. The method of claim 1 , wherein the copolymer composition, consists of:

a poly(styrene)-b-poly(dimethylsiloxane) block copolymer component, wherein the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component is selected from the group consisting of (a) a single poly(styrene)-b-poly(dimethylsiloxane) block copolymer; and, (b) a blend of at least two different poly(styrene)-b-poly(dimethylsiloxane) block copolymers; wherein the number average molecular weight of the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component is 25 to 1,000 kg/mol;

an optional solvent; wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA), ethoxyethyl propionate, anisole, ethyl lactate, 2-heptanone, cyclohexanone, amyl acetate, γ-butyrolactone (GBL), n-methylpyrrolidone (NMP) and toluene; and,

an optional additive; wherein the additive is selected from the group consisting of a surfactant and an antioxidant.

12. The method of claim 11 , wherein the gaseous atmosphere is selected from the group consisting of nitrogen and argon.

13. The method of claim 11 , wherein the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component provided is a single poly(styrene)-b-poly(dimethylsiloxane) diblock copolymer having a number average molecular weight, M N , of 25 to 1,000 kg/mol; a polydispersity, PD, of 1 to 3; and a poly(dimethylsiloxane) weight fraction, Wf PDMS , of 0.19 to 0.33.

14. The method of claim 13 , wherein the copolymer composition contains the optional solvent.

15. The method of claim 11 , wherein the poly(styrene)-b-poly(dimethylsiloxane) block copolymer component is a blend of at least two different poly(styrene)-b-poly(dimethylsiloxane) block copolymers;

wherein the at least two different poly(styrene)-b-poly(dimethylsiloxane) block copolymers are selected from the group of poly(styrene)-h-poly(dimethylsiloxane) block copolymers having a number average molecular weight, M N , of 1 to 1,000 kg/mol and a polydispersity, PD, of 1 to 3; and,

wherein the blend exhibits a blend number average molecular weight, M N-Blend , of 25 to 1,000 kg/mol.

16. The method of claim 15 , wherein the blend exhibits a blend poly(dimethylsiloxane) weight fraction, Wf PDMS-Blend , of 0.19 to 0.33.

17. The method of claim 16 , wherein the copolymer composition provided contains the optional solvent.

18. The method of claim 17 , wherein the solvent is selected from the group consisting of propylene glycol monomethyl ether acetate (PGMEA) and toluene.

Assignments (6)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 068971/0226 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2024
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
Reel/Frame 068971/0362 →
CHANGE OF LEGAL ENTITY Recorded Sep 17, 2024
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC
Reel/Frame 068972/0210 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2015
From: CHANG, SHIH-WEI; TREFONAS, PETER; WEINHOLD, JEFFREY D; HUSTAD, PHILLIP D
To: ROHM AND HAAS ELECTRONIC MATERIALS LLC; DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 034683/0327 →