IP Library Granted Patent US 1,101,702
Granted Patent S1
US 1,101,702 · App. 29/901,768 · Granted Nov 11, 2025

Edging for materials

Inventors: Michael S. Wladyka (Brocksville, OH); Keith David Johnson (Westlake, OH); Jason L. Strader (Cleveland, OH); Mark D. Kittel (Berea, OH); Jingting Yang (Fremont, CA)
Assignee: Laird Technologies, Inc.
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Quick Facts
Patent No.
US 1,101,702
App. No.
29/901,768
Granted
Nov 11, 2025
Kind
S1
Claims (1)

The ornamental design for edging for materials as shown and described.

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2023
From: WLADYKA, MICHAEL S.; JOHNSON, KEITH DAVID; STRADER, JASON L.; KITTEL, MARK D.; YANG, JINGTING
To: LAIRD TECHNOLOGIES, INC.
Reel/Frame 064800/0139 →
Continuity (2)
Division 29728991 · Mar 23, 2020
Continuation In Part 29621364 · Oct 6, 2017
References Cited (94)
US D114239S · Ryan · 1939 [cited by applicant]
US 3707762A · Bochinski et al. · 1973 [cited by applicant]
US 4058537A · Mueller · 1977 [cited by applicant]
US 4199490A · Kamiya et al. · 1980 [cited by applicant]
US 4678115A · Weisert · 1987 [cited by applicant]
US 4732631A · Shimizu · 1988 [cited by applicant]
US 4863551A · Ogura · 1989 [cited by applicant]
US 4872258A · Ragard · 1989 [cited by applicant]
US D344489S · Webb · 1994 [cited by applicant]
US D348387S · Sullivan · 1994 [cited by applicant]
US 5700340A · Johnson et al. · 1997 [cited by applicant]
US 5943557A · Moden · 1999 [cited by applicant]
US 6294729B1 · Kaplo · 2001 [cited by applicant]
US 6391686B1 · Shiozawa · 2002 [cited by applicant]
US 6566763B2 · Shiozawa · 2003 [cited by applicant]
US 6987671B2 · Houle · 2006 [cited by applicant]
US 7004244B2 · Rauch · 2006 [cited by applicant]
US 7229683B2 · Fischer et al. · 2007 [cited by applicant]
US 7821126B2 · Houle et al. · 2010 [cited by applicant]
US 7892882B2 · Leal et al. · 2011 [cited by applicant]
US 7906845B1 · Galloway et al. · 2011 [cited by applicant]
US D644757S · Vappula · 2011 [cited by applicant]
US 8445102B2 · Strader et al. · 2013 [cited by applicant]
US 8545987B2 · Strader et al. · 2013 [cited by applicant]
US 8916419B2 · Chen et al. · 2014 [cited by applicant]
US 8920919B2 · Arora et al. · 2014 [cited by applicant]
US 9016629B1 · Svartstrom · 2015 [cited by applicant]
US D729163S · Meyer · 2015 [cited by examiner]
US D731078S · Frenette · 2015 [cited by applicant]
US D734732S · Nakabayashi · 2015 [cited by applicant]
US 9257364B2 · Ahuja et al. · 2016 [cited by applicant]
US 9316447B2 · Fleskens et al. · 2016 [cited by applicant]
US 9330998B2 · Strader et al. · 2016 [cited by applicant]
US 9418912B2 · Nardi et al. · 2016 [cited by applicant]
US 9472485B2 · Saeidi et al. · 2016 [cited by applicant]
US D779997S · King · 2017 [cited by applicant]
US D807531S · Manning · 2018 [cited by applicant]
US D836186S · Takahashi · 2018 [cited by examiner]
US D862404S · Murata et al. · 2019 [cited by applicant]
US D865920S · Takahashi · 2019 [cited by examiner]
US D879046S · Wladyka et al. · 2020 [cited by applicant]
US D881822S · Wladyka et al. · 2020 [cited by applicant]
US D895623S · Pille et al. · 2020 [cited by applicant]
US D909322S · Yoshida et al. · 2021 [cited by applicant]
US D917028S · Yoshida et al. · 2021 [cited by applicant]
US D919626S · Pille et al. · 2021 [cited by applicant]
US D998827S · Wladyka · 2023 [cited by examiner]
US D999405S · Wladyka et al. · 2023 [cited by applicant]
US 20030037866A1 · Aoki et al. · 2003 [cited by applicant]
US 20030234322A1 · Bladt · 2003 [cited by applicant]
US 20040180474A1 · Oman · 2004 [cited by applicant]
US 20040188814A1 · Houle et al. · 2004 [cited by applicant]
US 20040261980A1 · Dani et al. · 2004 [cited by applicant]
US 20040262372A1 · Houle et al. · 2004 [cited by applicant]
US 20040262743A1 · Houle et al. · 2004 [cited by applicant]
US 20050236107A1 · Doi et al. · 2005 [cited by applicant]
US 20050264677A1 · Uchida · 2005 [cited by applicant]
US 20060021710A1 · Nitta · 2006 [cited by applicant]
US 20070193672A1 · Yamamoto · 2007 [cited by applicant]
US 20090207579A1 · Boetto et al. · 2009 [cited by applicant]
US 20090223638A1 · Nonaka et al. · 2009 [cited by applicant]
US 20090229732A1 · Determan et al. · 2009 [cited by applicant]
US 20090263938A1 · Ino · 2009 [cited by applicant]
US 20100252191A1 · Nakata et al. · 2010 [cited by applicant]
US 20110117706A1 · Nishio et al. · 2011 [cited by applicant]
US 20110135911A1 · Maenaka et al. · 2011 [cited by applicant]
US 20140199790A1 · Abe et al. · 2014 [cited by applicant]
US 20140367847A1 · Strader et al. · 2014 [cited by applicant]
US 20160160104A1 · Bruzda et al. · 2016 [cited by applicant]
US 20160185074A1 · Kagawa · 2016 [cited by applicant]
US 20160315030A1 · Strader et al. · 2016 [cited by applicant]
US 20160326419A1 · Balandin · 2016 [cited by applicant]
US 20160355249A1 · Joussellin · 2016 [cited by applicant]
US 20160362169A1 · Busscher · 2016 [cited by applicant]
EP 2814057A2 · 2014 [cited by applicant]
JP 2005327923A · 2005 [cited by applicant]
JP 2009277935A · 2009 [cited by applicant]
JP 2012084688A · 2012 [cited by applicant]
KR 100827725B1 · 2008 [cited by applicant]
WO WO9741599A1 · 1997 [cited by applicant]
WO WO2016182996A1 · 2016 [cited by applicant]
Nguyen et al., “An Investigation of the Ink-Transfer Mechanism During the Printing Phase of High-Resolution Roll-to-Roll Gravure Printing,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol… [cited by applicant]
USPTO Nonfinal Office Action for U.S. Appl. No. 16/988,919, filed Aug. 10, 2020 that names 5 of the same inventors and the same assignee, but is not related through a priority claim.; dated Apr. 12, 2023; 14 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/207,444 which names two of the same inventors and same assignee but is not related through a priority claim; dated Mar. 13, 2020, 17 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 16/114,687 which names two of the same inventors and same assignee but is not related through a priority claim; dated May 14, 2020, 13 pages. [cited by applicant]
Non-final Office Action for U.S. Appl. No. 15/207,444 which names two of the same inventors and assignee but is not related through a priority claim; dated Sep. 21, 2020; 13 pages. [cited by applicant]
Hirschi, David; Dow Corning Case Study; Understanding Differences Between Thermal Interface Materials: Improve your ability to specify the optimum TIM; Copyright 2008, 4 pages. [cited by applicant]
Types of Fabricated Films and Pad Thermal Interface Materials—Dow Corning; Thermal Interface—Wet Dispensed; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial5.asp>; accessed Jul. 11, 2016. [cited by applicant]
Basics of Processing for Fabricated Films and Pads—Dow Corning; Thermal Interface—Wet Dispensed; http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial13.asp> accessed Jul. 11, 2016; 1 page. [cited by applicant]
Packaging and Storage Considerations—Dow Corning; <http://www.dowcorning.com/content/etronics/etronicswet/newtim_tutorial14.asp> accessed Jul. 11, 2016. [cited by applicant]
European Search Report for EP17178138.8 filed Jun. 27, 2017 which claims priority to the instant application, dated Dec. 13, 2017, 6 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/207,444, filed Jul. 11, 2016 which names to of the same inventors, and the same assignee, but is no related through a priority claim, dated Apr. 19, 2019, 13 pages. [cited by applicant]
Non-Final Office Action dated Sep. 24, 2018 issued by the United States Patent and Trademark Office for U.S. Appl. No. 15/207,444 which has an inventor and assignee in common with the instant application but is not rela… [cited by applicant]
Korean Office Action dated Oct. 22, 2018 issued in Application No. 10-2017-0085269 which has an inventor and assignee in common with the instant application but is not related through a priority claim, 15 pages. An Engl… [cited by applicant]