Compliant multilayered thermally-conductive interface assemblies
View Patent ↗According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
1. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which comprises non-phase change gap filler that is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet, wherein the thermal interface material comprises thermally-conductive polymer that encapsulates the perforated thermally-conductive sheet, covers the one or more perforations, and forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the perforated thermally-conductive sheet and helps provide heat conduction between the first and second layers.
2. The thermally-conductive interface assembly of claim 1 , wherein the perforated thermally-conductive sheet is a perforated graphite, metal, or metallic sheet.
3. The thermally-conductive interface assembly of claim 2 , wherein the perforated thermally-conductive sheet is a perforated aluminum or copper sheet.
4. The thermally-conductive interface assembly of claim 1 , wherein the perforations allow the thermal interface material to flow through the perforations whereby the thermal interface material fills the perforations and establishes a mechanical bond between the first and second layers through the perforations, and wherein the thermal interface material is softer and/or more conformable than the perforated thermally-conductive sheet.
5. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which comprises non-phase change gap filler that is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet, wherein the perforations allow the thermal interface material to flow through the perforations whereby the thermal interface material fills the perforations and establishes a mechanical bond between the first and second layers through the perforations, and wherein the thermal interface material is softer and/or more conformable than the perforated thermally-conductive sheet.
6. The thermally-conductive interface assembly of claim 5 , wherein the perforated thermally-conductive sheet is a perforated graphite, metal, or metallic sheet.
7. The thermally-conductive interface assembly of claim 6 , wherein the perforated thermally-conductive sheet is a perforated aluminum or copper sheet.
8. The thermally-conductive interface assembly of claim 5 , wherein the thermal interface material comprises thermally-conductive polymer that encapsulates the perforated thermally-conductive sheet, covers the one or more perforations, and forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the perforated thermally-conductive sheet and helps provide heat conduction between the first and second layers.
9. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein the thermal interface material encapsulates the perforated thermally-conductive sheet, covers the one or more perforations, and forms a bond through the one or more perforations, whereby the bond helps mechanically bond the first and second layers to the perforated thermally-conductive sheet and helps provide heat conduction between the first and second layers.
10. The thermally-conductive interface assembly of claim 9 , wherein the perforated thermally-conductive sheet is a perforated graphite, metal, or metallic sheet.
11. The thermally-conductive interface assembly of claim 10 , wherein the perforated thermally-conductive sheet is a perforated aluminum or copper sheet.
12. The thermally-conductive interface assembly of claim 9 , wherein the thermal interface material comprises non-phase change gap filler.
13. The thermally-conductive interface assembly of claim 9 , wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet.
14. The thermally-conductive interface assembly of claim 9 , wherein the thermal interface material comprises thermally-conductive polymer that forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the perforated thermally-conductive sheet and helps provide heat conduction between the first and second layers.
15. The thermally-conductive interface assembly of claim 9 , wherein the perforations allow the thermal interface material to flow through the perforations whereby the thermal interface material fills the perforations and establishes a mechanical bond between the first and second layers through the perforations, and wherein the thermal interface material is softer and/or more conformable than the perforated thermally-conductive sheet.
16. A thermally-conductive interface assembly comprising a perforated thermally-conductive sheet having first and second sides and one or more perforations extending through the perforated thermally-conductive sheet from the first side to the second side, the perforated thermally-conductive sheet sandwiched between first and second layers of thermal interface material, which is conformable to mating surfaces such that the first and second layers of thermal interface material are respectively conformable to one of the mating surfaces of at least one heat generating component of an electronic device and one of the mating surfaces of a heat dissipating member, wherein the perforations allow the thermal interface material to flow through the perforations whereby the thermal interface material fills the perforations and establishes a mechanical bond between the first and second layers through the perforations, and wherein the thermal interface material is softer and/or more conformable than the perforated thermally-conductive sheet.
17. The thermally-conductive interface assembly of claim 16 , wherein the perforated thermally-conductive sheet is a perforated graphite, metal, or metallic sheet.
18. The thermally-conductive interface assembly of claim 17 , wherein the perforated thermally-conductive sheet is a perforated aluminum or copper sheet.
19. The thermally-conductive interface assembly of claim 16 , wherein the thermal interface material comprises non-phase change gap filler.
20. The thermally-conductive interface assembly of claim 16 , wherein each of the first and second layers of thermal interface material has a layer thickness greater than a thickness of the perforated thermally-conductive sheet.
21. The thermally-conductive interface assembly of claim 16 , wherein the thermal interface material comprises thermally-conductive polymer that encapsulates the perforated thermally-conductive sheet, covers the one or more perforations, and forms a polymer-to-polymer bond through the one or more perforations, whereby the polymer-to-polymer bond helps mechanically bond the first and second layers to the perforated thermally-conductive sheet and helps provide heat conduction between the first and second layers.