IP Library Granted Patent US 9,751,988
Granted Patent B2
US 9,751,988 · App. 15/115,923 · Granted Sep 5, 2017

Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

Inventors: Gunn Jo (Chungcheongbuk-do, KR); Haruna Yamazaki (Ichihara-shi, KR); Ju Young Yook (Gwanghyewon-Myeon, KR); Makoto Yoshitake (Ichihara-shi, KR)
Assignees: DOW CORNING TORAY CO., LTD.; DOW CORNING CORPORATION
C08G77/38C08G77/20C08L83/04C08G77/08C08G2170/20C08K2201/00H01L23/296
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Quick Facts
Patent No.
US 9,751,988
App. No.
15/115,923
Granted
Sep 5, 2017
Kind
B2
Abstract

This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

Claims (20)

1. A reactive silicone composition for forming a hotmelt material, comprising:

(A) an organopolysiloxane resin represented by the following average unit formula:

(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (R 2 O 1/2 ) e

 wherein each R 1 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms, with the proviso that 4 to 12 mol % of all R 1 in a molecule are alkenyl groups; R 2 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers that satisfy: 0.35≦a≦0.60; 0≦b≦0.1; 0≦c≦0.1; 0.40≦d≦0.65; 0≦e≦0.05; and a+b+c+d=1, in an amount of 15 to 50% by mass of total amount of components (A) to (C);

(B) an organopolysiloxane resin represented by the following average unit formula:

(R 3 3 SiO 1/2 ) f (R 3 2 SiO 2/2 ) g (R 3 SiO 3/2 ) h (SiO 4/2 ) i (R 4 O 1/2 ) j

 wherein each R 3 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms except for an alkenyl group; R 4 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and f, g, h, i, and j are numbers that satisfy: 0.35≦f≦0.55; 0≦g≦0.2; 0≦h≦0.2; 0.45≦i≦0.65; 0≦j≦0.05; and

f+g+h+i=1, in an amount of 20 to 45% by mass of total amount of components (A) to (C);

(C) a diorganopolysiloxane represented by the following average formula:

R 5 3 SiO(SiR 5 2 O) k SiR 5 3

 wherein each R 5 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms, with the proviso that at least two R 5 in a molecule are alkenyl groups; and

k is a number of 20 to 5,000, in an amount of 10 to 40% by mass of total amount of components (A) to (C);

(D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule, in an amount that component (D) gives 0.1 to 0.6 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C);

(E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in an amount that component (E) gives 0.1 to 0.5 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C); and

(F) a hydrosilylation catalyst in a sufficient amount to conduct a hydrosilylation of the composition.

2. The reactive silicone composition according to claim 1 , further comprising (G) a phosphor, in an amount of 10 to 400 parts by mass per 100 parts by mass of the sum of components (A) to (F).

3. A hotmelt material obtained by conducting a hydrosilylation reaction of the composition according to claim 1 .

4. A curable hotmelt composition comprising: the hotmelt material obtained by conducting a hydrosilylation reaction of the reactive silicone composition according to claim 1 , and (H) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount that component (H) gives 0.1 to 0.8 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C) in the reactive silicone composition.

5. A hotmelt material obtained by conducting a hydrosilylation reaction of the composition according to claim 2 .

6. A curable hotmelt composition comprising: the hotmelt material obtained by conducting a hydrosilylation reaction of the reactive silicone composition according to claim 2 , and (H) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount that component (H) gives 0.1 to 0.8 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C) in the reactive silicone composition.

Assignments (8)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
CHANGE OF NAME Recorded May 12, 2025
From: DOW CORNING TORAY COMPANY, LTD.
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 071080/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2024
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 068909/0240 →
CHANGE OF NAME Recorded Mar 7, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045515/0548 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2016
From: JO, GUNN; YOOK, JU YOUNG
To: DOW CORNING KOREA LTD.
Reel/Frame 040082/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2016
From: YAMAZAKI, HARUNA; YOSHITAKE, MAKOTO
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 040082/0523 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2016
From: DOW CORNING KOREA LTD.
To: DOW CORNING CORPORATION
Reel/Frame 040082/0555 →
Priority Claims (1)
KR 10-2014-0018842 · Feb 19, 2014 · national
Continuity (1)
Related Publication 20170166701A1 · Jun 15, 2017