Patent Assignment
Reel/Frame 040082/0523
Assignment of Assignor's Interest
Recorded: 2016-10-21
Pages: 4
Assignee
DOW CORNING TORAY CO., LTD.
5-1, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Reactive Silicone Composition, Hotmelt Material Made Therefrom, and Curable Hotmelt Composition
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 21, 2016
From: JO, GUNN; YOOK, JU YOUNG
To: DOW CORNING KOREA LTD.
Reel/Frame 040082/0438 →
Assignment of Assignor's Interest
Oct 21, 2016
From: DOW CORNING KOREA LTD.
To: DOW CORNING CORPORATION
Reel/Frame 040082/0555 →
Change of Name
Mar 7, 2018
From: DOW CORNING CORPORATION
To: DOW SILICONES CORPORATION
Reel/Frame 045515/0548 →
Assignment of Assignor's Interest
Sep 10, 2024
From: DOW SILICONES CORPORATION
To: DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC
Reel/Frame 068909/0240 →
Change of Name
May 12, 2025
From: DOW CORNING TORAY COMPANY, LTD.
To: DUPONT TORAY SPECIALTY MATERIALS KABUSHIKI KAISHA
Reel/Frame 071080/0537 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
Security Interest
Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →