Polyimide films and electronic devices
View Patent ↗In a first aspect, a polyimide film includes a dianhydride, a fluorinated aromatic diamine and an aliphatic diamine. The polyimide film has a b* of less than one for a film thickness of at least 30 microns and a glass transition temperature of less than 300° C. In a second aspect, an electronic device includes the polyimide film of the first aspect.
1. A polyimide film comprising a polyimide derived from:
a dianhydride;
a fluorinated aromatic diamine; and
an aliphatic diamine, wherein the polyimide film has:
a b* of less than one for a film thickness of at least 30 microns; and
a glass transition temperature of less than 300° C.
2. The polyimide film of claim 1 , wherein the dianhydride comprises 4,4′-(hexafluoroisopropylidene)diphthalic anhydride.
3. The polyimide film of claim 2 , wherein the dianhydride further comprises an alicyclic dianhydride.
4. The polyimide film of claim 3 , wherein the alicyclic dianhydride is selected from the group consisting of cyclobutane dianhydride, cyclohexane dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, hexahydro-4,8-ethano-1H,3H-benzo[1,2-c:4,5-c]difuran-1,3,5,7-tetrone, 3-(carboxymethyl)-1,2,4-cyclopentanetricarboxylic acid 1,4:2,3-dianhydride and meso-butane-1,2,3,4-tetracarboxylic acid dianhydride.
5. The polyimide film of claim 1 , wherein the fluorinated aromatic diamine comprises 2,2′-bis(trifluoromethyl) benzidine.
6. The polyimide film of claim 1 , wherein the aliphatic diamine is selected from the group consisting of 1,2-diaminoethane, 1,6-diaminohexane, 1,4-diaminobutane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane (DMD), 1,11-diaminoundecane, 1,12-diaminododecane (DDD), 1,16-hexadecamethylenediamine, 1,3-bis(3-aminopropyl)-tetramethyldisiloxane, isophoronediamine, bicyclo[2.2.2]octane-1,4-diamine and mixtures thereof.
7. The polyimide film of claim 1 , wherein the fluorinated aromatic diamine is present in a range of from 40 to 95 mole percent, based on the total diamine content of the polyimide.
8. The polyimide film of claim 7 , wherein the fluorinated aromatic diamine is present in a range of from 50 to 75 mole percent, based on the total diamine content of the polyimide.
9. The polyimide film of claim 1 , wherein the polyimide film has a thickness in the range of from 10 to 80 μm.
10. The polyimide film of claim 9 , wherein the polyimide film has a thickness in the range of from 10 to 25 μm.
11. The polyimide film of claim 1 , wherein the polyimide film has a transmittance of at least 90 percent, when measured using ASTM D1003 over the wavelength range of 400-700 nm.
12. The polyimide film of claim 1 , wherein the polyimide film has a haze of less than 1%.
13. The polyimide film of claim 1 , wherein the polyimide film has an R th of less than 60 nm.
14. An electronic device comprising the polyimide film of claim 1 .
15. The electronic device of claim 14 , wherein the polyimide film is used in device components selected from the group consisting of substrates for color filter sheets, cover sheets, and touch sensor panels.
16. The polyimide film of claim 1 , wherein the polyimide film has a glass transition temperature of less than 275° C.
17. The polyimide film of claim 16 , wherein the polyimide film has a glass transition temperature of less than 250° C.
18. The polyimide film of claim 13 , wherein the polyimide film has an R th of less than 50 nm.
19. The polyimide film of claim 18 , wherein the polyimide film has an R th of less than 40 nm.