ELECTRODEPOSITED COPPER FOIL WITH A PREFFERED ORIENTATION OF (200) CRYSTAL PLANE AND APPLICATIONS THEREOF

1 . An electrodeposited copper foil with a preferred orientation of (200) crystal plane after heat treatment, wherein

the electrodeposited copper foil prior to heat treatment has a grain orientation ratio of 20% or less on the (200) crystal plane as determined by XRD analysis, and a grain orientation ratio of less than 20% on the {001} crystal plane family as determined by EBSD analysis;

the electrodeposited copper foil after heat treatment has a grain orientation ratio of 50% or more on the (200) crystal plane as determined by XRD analysis, and a grain orientation ratio of 20% or more on the {001} crystal plane family as determined by EBSD analysis; and

the heat treatment is conducted by heating at 200° C. for 2 hours.

2 . The electrodeposited copper foil of claim 1 , wherein

the electrodeposited copper foil prior to heat treatment has an average grain size of less than 1.0 μm, and a twin grain boundary ratio of 30% or less;

the electrodeposited copper foil after heat treatment has an average grain size of 2.0 μm or more and a twin grain boundary ratio of 50% or more; and

the average grain size and twin grain boundary ratio are determined by EBSD analysis.

3 . The electrodeposited copper foil of claim 1 , wherein the electrodeposited copper foil has a thickness of 3.0 μm to 300 μm.

4 . The electrodeposited copper foil of claim 1 , wherein the electrodeposited copper foil prior to heat treatment has a surface roughness (Sz) of 3.0 μm or less on the M side.

5 . The electrodeposited copper foil of claim 1 , wherein the electrolytic copper foil after heat treatment has an electrical conductivity of 57.0×10 6 S/m or more.

6 . The electrodeposited copper foil of claim 1 , wherein

the electrodeposited copper foil prior to heat treatment has an elongation of less than 5%; and

the electrodeposited copper foil after heat treatment has an elongation of 5% or more, and a tensile strength of 15 Kgf/mm 2 to 25 Kgf/mm 2 .

7 . A method for manufacturing an electrodeposited copper foil of claim 1 , comprising:

i) providing an electrolytic solution at a temperature of 20° C. to 55° C. in an electrolytic cell;

ii) applying an electric current at a current density of 30 A/dm 2 to 100 A/dm 2 to an anode plate and a rotating cathode drum that are spaced apart from each other in the electrolytic solution;

iii) obtaining a copper foil on the rotating cathode drum by electrodeposition; and

iv) separating the copper foil obtained from step iii);

wherein

the electrolytic solution comprises:

120 g/L to 450 g/L of copper sulfate;

30 g/L to 140 g/L of sulfuric acid;

0.01 ppm to 5.00 ppm of chloride ion; and

0.01 ppm to 2.50 ppm of at least one additive.

8 . The method of claim 7 , wherein the additive comprises gelatin, animal glue, cellulose, nitrogen-containing cationic polymer, or a combination thereof.

9 . The method of claim 7 , wherein the additive is a nitrogen-containing cationic polymer, and the nitrogen-containing cationic polymer has a weight-average molecular weight of from 500 g/mole to 12,000 g/mole.

10 . The method of claim 9 , wherein the nitrogen-containing cationic polymer is a reaction product of a diamine of formula (I) or an imidazole of Formula (II) with an epoxide of Formula (III) or a diepoxide of Formula (IV) in 1:1 molar ratio:

wherein

each of R 1 , R 2 , R 3 , and R 4 is independently H or C 1 -C 3 alkyl;

each of R 5 , R 6 , R 7 , and R 8 is independently H or C 1 -C 6 alkyl, and R 7 and R 8 are optionally linked to each other to form a saturated ring;

R 9 and R 10 are each independently H or C 1 -C 4 alkyl;

R 11 is a divalent linking group selected from C 2 -C 8 alkylene, C 5 -C 10 cycloalkylene, and C 1 -C 4 alkylene-C 5 -C 10 cycloalkylene, where R 11 is optionally substituted with C 1 -C 4 alkyl or —OH;

A is a divalent linking group selected from C 2 -C 8 alkylene, C 5 -C 10 cycloalkylene, C 1 -C 4 alkylene-C 5 -C 10 cycloalkylene-C 1 -C 4 alkylene, C 6 -C 20 arylene, and C 1 -C 4 alkylene-C 6 -C 20 arylene-C 1 -C 4 alkylene, and where A is optionally substituted with C 1 -C 4 alkyl or —OH;

Y is H or C 1 -C 4 alkyl;

X is halogen;

each of p, q, and r is independently an integer of 0 to 10; and

n is an integer from 1 to 20.

11 . A flexible copper-clad laminate, comprising:

the electrodeposited copper foil of claim 1 , and

a dielectric layer provided on at least one surface of the electrodeposited copper foil,

wherein

the electrodeposited copper foil has a grain orientation ratio of 50% or more on the (200) crystal plane as determined by XRD analysis, and a grain orientation ratio of 20% or more on the {001} crystal plane family as determined by EBSD analysis;

the dielectric layer has a thickness of 5 μm to 100 μm; and

the dielectric layer is composed of at least one layer of a polymeric material having a thermal decomposition temperature (1%) of 260° C. or higher.

12 . The flexible copper-clad laminate of claim 11 , wherein the polymeric material is polyimide, liquid crystal polymer, or fluorine-based polymer.

13 . A method for manufacturing the flexible copper-clad laminate of claim 11 , comprising:

providing the electrodeposited copper foil of claim 1 , and

coating or laminating at least one layer of a polymeric material or a precursor thereof to form a dielectric layer on at least one surface of the electrodeposited copper foil.

14 . A printed circuit board, that is manufactured from the flexible copper-clad laminate of claim 11 , wherein the printed circuit board is a flexible printed circuit board (FPCB) or a flexible-rigid printed circuit board (FRPCB).

15 . An electronic device, comprising the printed circuit of claim 14 .