Thermal interface materials with low secant modulus of elasticity and high thermal conductivity

1. An interface material comprising a matrix or base resin loaded with a filler, wherein:

the interface material has a secant modulus of elasticity of no more than 620 kilopascals (kPa) at 50% strain for 1.5 millimeter (mm) initial thickness material;

a ratio of the interface material's secant modulus of elasticity to thermal conductivity falls within a range from about 0.46 to about 64.6 and/or a ratio of the interface material's thermal conductivity to secant modulus of elasticity falls within a range from about 0.015 to about 2.18;

the interface material is a bulk putty, a thermally-conductive gap filler pad, or a thermally-conductive gap filler sheet material;

the matrix or base resin is loaded with the filler such that the interface material includes at least 80 weight % of the filler; and

the matrix or base resin comprises:

a polydimethylsiloxane (PDMS); or

silicone polymer with platinum catalyst and crosslinker; or

a process oil.

2. The interface material of claim 1 , wherein the filler comprises one or more of alumina, aluminum, zinc oxide, boron nitride, silicon nitride, aluminum nitride, iron, metallic oxides, graphite, silver, copper, and ceramic.

3. The interface material of claim 1 , wherein the interface material has a thermal conductivity greater than 4 Watts per meter per Kelvin.

4. The interface material of claim 1 , wherein the interface material has a thermal conductivity of at least about 5.5 Watts per meter per Kelvin.

5. The interface material of claim 4 , wherein the filler comprises alumina.

6. The interface material of claim 1 , wherein the interface material has a thermal conductivity of at least about 5.7 Watts per meter per Kelvin.

7. The interface material of claim 1 , wherein the matrix or base resin is loaded with the filler such that the interface material includes at least 90 weight % of the filler.

8. The interface material of claim 1 , wherein the matrix or base resin comprises the silicone polymer with the platinum catalyst and the crosslinker including silicone polymer with SiH crosslinking oligomer.

9. An interface material comprising a matrix or base resin loaded with a filler, wherein:

the interface material has a secant modulus of elasticity of no more than 620 kilopascals (kPa) at 50% strain for 1.5 millimeter (mm) initial thickness material;

the matrix or base resin is loaded with the filler such that the interface material includes

at least 80 weight % of the filler;

the matrix or base resin comprises:

a polydimethylsiloxane (PDMS); or

silicone polymer with platinum catalyst and crosslinker;

a ratio of the interface material's secant modulus of elasticity to thermal conductivity falls within a range from about 0.46 to about 64.6 and/or a ratio of the interface material's thermal conductivity to secant modulus of elasticity falls within a range from about 0.015 to about 2.18; and

the interface material is a bulk putty, a thermally-conductive gap filler pad, or a thermally-conductive gap filler sheet material.

10. The interface material of claim 9 , wherein the filler comprises one or more of alumina, aluminum, zinc oxide, boron nitride, silicon nitride, aluminum nitride, iron, metallic oxides, graphite, silver, copper, and ceramic.

11. The interface material of claim 9 , wherein the interface material has a thermal conductivity greater than 4 Watts per meter per Kelvin.

12. The interface material of claim 9 , wherein the interface material has a thermal conductivity of at least about 5.5 Watts per meter per Kelvin.

13. The interface material of claim 12 , wherein the filler comprises alumina.

14. The interface material of claim 9 , wherein the interface material has a thermal conductivity of at least about 5.7 Watts per meter per Kelvin.

15. The interface material of claim 9 , wherein the matrix or base resin is loaded with the filler such that the interface material includes at least 90 weight % of the filler.

16. The interface material of claim 9 , wherein the matrix or base resin comprises the silicone polymer with the platinum catalyst and the crosslinker including silicone polymer with SiH crosslinking oligomer.

17. An interface material comprising a matrix or base resin loaded with a filler, wherein:

the interface material has a secant modulus of elasticity of no more than 620 kilopascals (kPa) at 50% strain for 1.5 millimeter (mm) initial thickness material;

the interface material has a thermal conductivity greater than 4 Watts per meter per Kelvin;

the matrix or base resin is loaded with the filler such that the interface material includes at least 80 weight % of the filler;

the matrix or base resin comprises silicone polymer with platinum catalyst and silicone polymer with SiH crosslinking oligomer; and

the interface material is a bulk putty, a thermally-conductive gap filler pad, or a thermally-conductive gap filler sheet material.

18. The interface material of claim 1 , wherein the interface material is the thermally-conductive gap filler pad.

19. The interface material of claim 9 , wherein the interface material is the thermally-conductive gap filler pad.

20. The interface material of claim 17 , wherein the interface material is the thermally-conductive gap filler pad.