Systems of applying materials to components

1. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the tool comprises a die integrally including:

the resilient material; and

a cutting portion configured for cutting the portion of the material for release and transfer from the supply;

whereby when the tool including its resilient material and cutting portion are downwardly moved collectively in a single action relative to the portion of the material:

the resilient material of the tool is operable for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply; and

the cutting portion of the tool is operable for cutting the portion of the material for release and transfer from the supply.

2. The system of claim 1 , further comprising the supply of material including a liner along a surface of the portion of the material, wherein the tool is operable for transferring the portion of the material from the liner to the component.

3. The system of claim 2 , wherein the tool is operable for pushing the liner downwardly through the portion of the material for downwardly severing the portion of the material from the supply without cutting the liner and thereby transferring the portion of the material onto the component without having to puncture the liner.

4. The system of claim 2 , wherein the tool is operable for forcing the liner down into the portion of the material such that a thickness of the portion of the material is reduced or pushed out of the way, thereby providing the portion of the material with tapered edges in a thickness dimension along all sides.

5. The system of claim 2 , wherein the system is configured such that the portion of the material remains on the component and such that the liner is automatically removed from the portion of the material by the tool when the tool is removed and moved relatively away from the portion of the material.

6. The system of claim 2 , wherein the system is configured such that the portion of the material remains on the component and such that at least a portion of the liner remains on the portion of the material when the tool is removed and moved relatively away from the portion of the material.

7. The system of claim 2 , wherein:

the portion of the material comprises a non-metal; and

the portion of the material is coupled to the component without any diffusion bonding or welded joints therebetween.

8. The system of claim 1 , wherein the supply of material comprises a supply of thermal interface material having a high thermal conductivity, and wherein the tool is operable for transferring a conformable thermal pad of the thermal interface material from the supply to the component.

9. The system of claim 1 , wherein the resilient material is shaped to mitigate air entrapment and remove air pockets from the portion of the material.

10. The system of claim 1 , wherein:

the component comprises an integrated circuit including one or more edges configured to imprint the portion of the material for release and transfer from the supply; and

the tool is operable for completing the release and transfer of the imprinted portion of the material from the supply to the integrated circuit.

11. The system of claim 1 , wherein:

the component comprises an integrated circuit; and

the tool is operable for tamping the portion of the material from the supply onto the integrated circuit such that one or more edges of the integrated circuit cut or tear the portion of the material for release and transfer from the supply.

12. The system of claim 1 , wherein the supply of material comprises a supply of thermal interface material having a high thermal conductivity, and wherein the tool is operable for transferring a pad of the thermal interface material from the supply to the component without trapped air within the pad.

13. The system of claim 1 , wherein the supply of material comprises a supply of thermal interface material having a high thermal conductivity, and wherein the tool comprises a knife die having a cavity or core filled with the resilient material usable for tamping a portion of the thermal interface material onto the component before the knife die severs the portion of the thermal interface material from the supply of thermal interface material.

14. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material including a liner along a surface of the portion of the material;

wherein the tool is operable for transferring the portion of the material from the liner to the component;

wherein the liner includes at least one portion having a different thickness that is preexisting along the liner before the portion of the material is transferred from the liner to the component and that is configured to texture the surface of the portion of the material when the tool is pressed against the liner to transfer the portion of the material from the liner to the component.

15. The system of claim 14 , wherein the tool comprises a die integrally including:

the resilient material; and

a cutting portion configured for cutting the portion of the material for release and transfer from the supply;

whereby when the tool including its resilient material and cutting portion are downwardly moved collectively in a single action relative to the portion of the material:

the resilient material of the tool is operable for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply; and

the cutting portion of the tool is operable for cutting the portion of the material for release and transfer from the supply.

16. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material including a liner along a surface of the portion of the material;

wherein the tool is operable for transferring the portion of the material from the liner to the component;

wherein the liner includes one or more protruding portions that are preexisting along the liner before the portion of the material is transferred from the liner to the component, and

wherein:

the one or more protruding portions of the liner comprise a thickness of an ink along the liner; and/or

the one or more protruding portions of the liner are configured to imprint into and texture the surface of the portion of the material.

17. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material including a liner along a surface of the portion of the material;

wherein the tool is operable for transferring the portion of the material from the liner to the component;

wherein:

the liner is configured to texture the surface of the material when the tool is pressed against the liner to transfer the portion of the material from the liner to the component; and/or

the liner includes electrically-conductive ink thereon transferrable from the liner to the portion of the material.

18. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material including a liner along a surface of the portion of the material;

wherein the tool is operable for transferring the portion of the material from the liner to the component;

wherein the system is configured such that the portion of the material remains on the component and such that at least a portion of the liner remains on the portion of the material when the tool is removed and moved relatively away from the portion of the material;

wherein the tool is configured to provide a cutting edge for cutting through the liner, and wherein the tool integrally includes the resilient material and the cutting edge such that when the tool including its integral resilient material and cutting edge are downwardly moved collectively in a single action relative to the portion of the material:

the resilient material of the tool is operable for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply; and

the cutting edge of the tool is operable cutting through the liner.

19. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material that includes a supply of conformable thermal interface material having a thermal conductivity of at least 1 Watt per meter per Kelvin, and wherein:

the tool integrally includes the resilient material and a severing portion that is configured for severing a portion of the conformable thermal interface material from the supply thereby transferring the portion of the conformable thermal interface material onto the component, such that when the tool including its integral resilient material and severing portion are downwardly moved collectively in a single action relative to the portion of the conformable thermal interface material:

the resilient material of the tool is operable for both tamping the portion of the conformable thermal interface material onto the component and imprinting the portion of the conformable thermal interface material for release and transfer from the supply; and

the severing portion of the tool is operable for severing the portion of the conformable thermal interface material thereby transferring the portion of the conformable thermal interface material onto the component.

20. A system for applying materials to components, the system comprising a tool operable for transferring a portion of a material from a supply of the material to a component, wherein the tool includes a resilient material integral with the tool and configured for both tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply when the tool including its integral resilient material are collectively downwardly moved relative to the portion of the material for downwardly severing the portion of the material from the supply thereby transferring the portion of the material onto the component;

wherein the system comprises the supply of material that includes a supply of thermal interface material along a liner and that is naturally tacky, self-adherable to the components without additional adhesive, and has a thermal conductivity of at least 1 Watt per meter per Kelvin, and wherein:

the tool integrally includes the resilient material and a severing portion that is configured for severing a portion of the thermal interface material from the supply thereby transferring the portion of the conformable thermal interface material onto the component, such that when the tool including its integral resilient material and severing portion are downwardly moved collectively in a single action relative to the portion of the thermal interface material:

the resilient material of the tool is operable for both tamping the portion of the thermal interface material onto the component and imprinting the portion of the thermal interface material for release and transfer from the supply; and

the severing portion of the tool is operable for severing the portion of the thermal interface material thereby transferring the portion of the thermal interface material onto the component.