Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

1. A thermally-conductive electromagnetic interference (EMI) absorber comprising a silicone elastomer matrix loaded with thermally-conductive particles, EMI absorbing particles, and silicon carbide, wherein the silicon carbide is present in a predetermined amount sufficient to synergistically enhance both thermal conductivity and EMI absorption, wherein the EMI absorbing particles comprise carbonyl iron powder, and the thermally-conductive particles comprise alumina;

wherein the thermally-conductive EMI absorber is a gap pad having a thickness of at least 1 millimeter or putty that is conformable even without having to melt or undergo a phase change or reflow; and

wherein the thermally-conductive EMI absorber is configured to adjust for gaps by deflecting at room temperature within a range from 20° C. to 25° C.; and

wherein:

the thermally-conductive EMI absorber includes 6 to 44 volume percent of the alumina, 8 to 38 volume percent of the carbonyl iron powder, and 21 to 27 volume percent of the silicon carbide; or

the silicone elastomer matrix includes magnetic flakes, the carbonyl iron powder, the alumina, manganese zinc ferrite, and the silicon carbide, such that the thermally conductive EMI absorber includes 2 to 4 volume percent of the magnetic flakes, 3 to 5 volume percent of carbonyl iron powder, 18 to 23 volume percent of the alumina, 27 to 40 volume percent of the manganese zinc ferrite, and 4 to 10 volume percent of the silicon carbide.

2. The thermally-conductive EMI absorber of claim 1 , wherein:

the thermally-conductive EMI absorber includes 43 volume percent of the alumina, 9 volume percent of the carbonyl iron powder, and 22 volume percent of the silicon carbide; and

the 22 volume percent of the silicon carbide is the predetermined amount sufficient to synergistically enhance both thermal conductivity and EMI absorption such that the thermally-conductive EMI absorber has better thermal conductivity and better absorption than a control absorber including 0 volume percent of silicon carbide, 22 volume percent of alumina, and 43 volume percent of carbonyl iron powder.

3. The thermally-conductive EMI absorber of claim 1 , wherein the silicone elastomer matrix is loaded with the alumina, the carbonyl iron powder, and the silicon carbide such that the thermally-conductive EMI absorber includes about 6 to 44 volume percent of the alumina, about 8 to 38 volume percent of the carbonyl iron powder, and about 21 to 27 volume percent of the silicon carbide.

4. The thermally-conductive EMI absorber of claim 3 , wherein: t

the thermally-conductive EMI absorber includes about 7 volume percent of the alumina, about 37 volume percent of the carbonyl iron powder, about 26 volume percent of the silicon carbide, and has a thermal conductivity of about 3 Watts per meter per Kelvin and an attenuation of at least about 9 decibels per centimeter at a frequency of at least 5 gigahertz and/or at least about 17 decibels per centimeter at a frequency of at least 15 gigahertz; or

the thermally-conductive EMI absorber includes about 43 volume percent of the alumina, about 9 volume percent of the carbonyl iron powder, about 22 volume percent of the silicon carbide, and has a thermal conductivity of about 4 Watts per meter per Kelvin and an attenuation of at least about 9 decibels per centimeter at a frequency of at least 5 gigahertz and/or at least about 17 decibels per centimeter at a frequency of at least 15 gigahertz; or

the thermally-conductive EMI absorber includes about 34 volume percent of the alumina, about 10 volume percent of the carbonyl iron powder, about 27 volume percent of the silicon carbide, and has a thermal conductivity of about 3.5 Watts per meter per Kelvin, and an attenuation of at least about 9 decibels per centimeter at a frequency of at least 5 gigahertz and/or at least about 17 decibels per centimeter at a frequency of at least 15 gigahertz.

5. The thermally-conductive EMI absorber of claim 1 , wherein:

the EMI absorbing particles comprise the magnetic flakes and the carbonyl iron powder;

the thermally-conductive particles comprise the alumina;

the silicone elastomer matrix is loaded with the magnetic flakes, the carbonyl iron powder, the alumina, the manganese zinc ferrite, and the silicon carbide such that the thermally conductive EMI absorber includes 2 to 4 volume percent of the magnetic flakes, 3 to 5 volume percent of the carbonyl iron powder, 18 to 23 volume percent of the alumina, 27 to 40 volume percent of the manganese zinc ferrite, and 4 to 10 volume percent of the silicon carbide; and

the thermally-conductive EMI absorber further comprises an adhesive layer for affixing the thermally-conductive EMI absorber to an inner surface of an EMI shield such that the thermally-conductive EMI absorber is compressible against a component on a printed circuit board when the EMI shield is installed to the printed circuit board over the component.

6. A thermally-conductive electromagnetic interference (EMI) absorber comprising a silicone elastomer matrix loaded with thermally-conductive particles, EMI absorbing particles, silicon carbide, and manganese zinc ferrite, wherein the silicon carbide is present in a predetermined amount sufficient to synergistically enhance both thermal conductivity and EMI absorption, wherein:

the EMI absorbing particles comprise magnetic flakes and carbonyl iron powder;

the thermally-conductive particles comprise alumina;

the silicone elastomer matrix is loaded with the magnetic flakes, the carbonyl iron powder, the alumina, the manganese zinc ferrite, and the silicon carbide, such that the thermally conductive EMI absorber includes about 2 to 4 volume percent of the magnetic flakes, about 3 to 5 volume percent of the carbonyl iron powder, about 18 to 23 volume percent of the alumina, about 27 to 40 volume percent of the manganese zinc ferrite, and about 4 to 10 volume percent of the silicon carbide;

wherein the thermally-conductive EMI absorber is a gap pad having a thickness of at least 1 millimeter that is conformable even without having to melt or undergo a phase change or reflow; and

the thermally-conductive EMI absorber is configured to adjust for gaps by deflecting at room temperature within a range from 20° C. to 25° C.

7. The thermally-conductive EMI absorber of claim 5 , wherein the thermally-conductive EMI absorber includes about 3 volume percent of the magnetic flakes, about 4 volume percent of the carbonyl iron powder, about 19.5 volume percent of the alumina, about 32.1 volume percent of the manganese zinc ferrite, and about 4.8 volume percent of the silicon carbide.

8. The thermally-conductive EMI absorber of claim 7 , wherein the thermally-conductive EMI absorber is configured to have a thermal conductivity of at least 2 Watts per meter per Kelvin, and an attenuation of at least about 9 decibels per centimeter for frequencies from 1 gigahertz to 6 gigahertz.

9. The thermally-conductive EMI absorber of claim 1 , wherein the silicone elastomer matrix is loaded with the magnetic flakes, the carbonyl iron powder, the alumina, the manganese zinc ferrite, and the silicon carbide.

10. The thermally conductive EMI absorber of claim 9 , wherein the thermally-conductive EMI absorber includes a cross-linker; and wherein the magnetic flakes comprise:

an alloy including iron, silicon, and aluminum; or

an alloy including iron and nickel.

11. The thermally-conductive EMI absorber of claim 1 , wherein:

the thermally-conductive particles further comprise one or more of zinc oxide, boron nitride, silicon nitride, aluminum, aluminum nitride, iron, metallic oxides, graphite, and a ceramic; and

the EMI absorbing particles further comprise ferrite.

12. A multi-piece EMI shield comprising a frame, a removable lid or cover attachable to and removable from the frame, and the thermally-conductive EMI absorber of claim 1 along an inner surface portion of the removable lid or cover of the multi-piece EMI shield, such that the thermally-conductive EMI absorber is compressible against a component on a printed circuit board when the multi-piece EMI shield is installed to the printed circuit board over the component, wherein the thermally-conductive EMI absorber further comprises an adhesive layer that affixes the thermally-conductive EMI absorber to the inner surface portion of the multi-piece EMI shield.

13. A multi-piece EMI shield comprising a frame, a removable lid or cover attachable to and removable from the frame, and the thermally-conductive EMI absorber of claim 1 along an inner surface portion of the removable lid or cover of the multi-piece EMI shield, such that the thermally-conductive EMI absorber is compressible against a component on a printed circuit board when the multi-piece EMI shield is installed to the printed circuit board over the component, wherein the thermally-conductive EMI absorber is self-adhered to the inner surface portion of the multi-piece EMI shield without an additional adhesive layer between the thermally-conductive EMI absorber and the inner surface portion of the multi-piece EMI shield.