EMI shielding/electrical grounding members
View Patent ↗Exemplary embodiments are provided of EMI shielding/electrical grounding members configured to be installed to a substrate for interposition between electrically-conductive surfaces, for establishing electrical grounding contact from the substrate to the electrically-conductive surfaces. In one exemplary embodiment, an EMI shielding/electrical grounding member generally includes first and second generally opposing sides hingedly connected and having respective first and second contact faces configured such that the first and second contact faces are each relatively independently operable and freely compressible upon contact with the respective first and second electrically-conductive surfaces, regardless of whether the other of said first and second contact faces is in contact with the corresponding first or second electrically-conductive surface.
1. An EMI shielding/electrical grounding member configured to be installed to a substrate for interposition generally between first and second spaced-apart electrically-conductive surfaces along opposite sides of and parallel to the substrate, for establishing electrical grounding contact from the substrate to the first and second electrically-conductive surfaces, the EMI shielding/electrical grounding member comprising:
first and second generally opposing sides hingedly connected and having respective first and second contact faces configured such that the first and second contact faces are each relatively independently operable and freely compressible upon contact with the respective first and second electrically-conductive surfaces, regardless of whether the other of said first and second contact faces is in contact with the corresponding first or second electrically-conductive surface; and
at least one channel configured to engagingly receive an edge portion of the substrate, such that electrical contact is established between the EMI shielding/electrical grounding member and the substrate.
2. The EMI shielding/electrical grounding member of claim 1 , wherein the EMI shielding/electrical grounding member is configured such that:
contact between the first contact face and the first electrically-conductive surface applies pressure for causing the first contact face to compressively move generally inwardly towards the substrate, against a force resiliently biasing the first contact face in a generally outward direction from the substrate towards the first electrically-conductive surface; and
contact between the second contact face and the second electrically-conductive surface applies pressure for causing the second contact face to compressively move generally inwardly towards the substrate, against a force resiliently biasing the second contact face in a generally outward direction from the substrate towards the second electrically-conductive surface.
3. The EMI shielding/electrical grounding member of claim 1 , further comprising:
a generally longitudinally extending region;
one or more slots extending generally transversely along the generally longitudinally extending region; and
one or more resiliently flexible finger elements including at least a portion defined by the slots along the first and second sides, the first and second contact faces being defined by the corresponding resiliently flexible finger elements along the respective first and second sides.
4. The EMI shielding/electrical grounding member of claim 3 , wherein the one or more resiliently flexible finger elements are configured to flex relatively independently from one another upon contact with the respective first and second electrically-conductive surfaces, regardless of whether the other resiliently flexible finger elements are in contact with the corresponding first or second electrically-conductive surface.
5. The EMI shielding/electrical grounding member of claim 3 , wherein the EMI shielding/electrical grounding member is configured such that:
contact between the one or more resiliently flexible finger elements along the first side and the first electrically-conductive surface applies pressure for causing the one or more resiliently flexible finger elements along the first side to compressively move generally inwardly towards the substrate, against a force resiliently biasing the one or more resiliently flexible finger elements along the first side in a generally outward direction from the substrate towards the first electrically-conductive surface; and
contact between the one or more resiliently flexible finger elements along the second side and the second electrically-conductive surface applies pressure for causing the one or more resiliently flexible finger elements along the second side to compressively move generally inwardly towards the substrate, against a force resiliently biasing the one or more resiliently flexible finger elements along the second side in a generally outward direction from the substrate towards the second electrically-conductive surface.
6. The EMI shielding/electrical grounding member of claim 3 , wherein the one or more resiliently flexible finger elements are configured to be compressed generally between the substrate and the corresponding first or second electrically-conductive surface to provide a contact pressure for establishing electrical conductivity between the substrate and the corresponding first or second electrically-conductive surface that is sufficient for EMI shielding applications.
7. The EMI shielding/electrical grounding member of claim 1 , wherein the first and second sides include overlapping end portions disposed within the interior space defined by the EMI shielding/electrical grounding member.
8. The EMI shielding/electrical grounding member of claim 1 , wherein the channel is configured to frictionally receive the edge portion of the substrate therein for helping mechanically retain the EMI shielding/electrical grounding member to the substrate and establish electrical contact with the substrate.
9. The EMI shielding/electrical grounding member of claim 1 , further comprising one or more D-shaped lance features within the channel configured for helping mechanically retain the EMI shielding/electrical grounding member to the substrate.
10. The EMI shielding/electrical grounding member of claim 9 , wherein at least one of the one or more D-shaped lance features is configured to be engagingly received within a corresponding opening defined by the substrate.
11. The EMI shielding/electrical grounding member of claim 1 , further comprising one or more openings defined generally between the first and second sides generally opposite the channel, and wherein the one or more openings are configured for engagingly receiving corresponding one or more projecting portions of the substrate, for helping mechanically retain the EMI shielding/electrical grounding member to the substrate.
12. The EMI shielding/electrical grounding member of claim 1 , wherein:
the channel includes first and second generally opposing sidewall portions connected by a third wall portion;
the first, second, and third wall portions inwardly spaced-apart from the first and second sides and within an interior space generally between the first and second sides; and
the first, second, and third wall portions cooperatively define a generally inverted U-shaped transverse profile for the channel.
13. The EMI shielding/electrical grounding member of claim 12 , wherein:
the first and second sidewall portions are configured to frictionally grip the portion of the substrate within the channel, for inhibiting inadvertent removal of the EMI shielding/electrical grounding member from the substrate and for creating sufficient contact pressure between the EMI shielding/electrical grounding member and the substrate to establish electrical conductivity therebetween.
14. The EMI shielding/electrical grounding member of claim 1 , wherein the first and second sides are formed from a resiliently flexible material and configured so to inhibit snagging with the corresponding first or second electrically-conductive surfaces while sliding relative to the EMI shielding/electrical grounding member.
15. The EMI shielding/electrical grounding member of claim 1 , wherein the first and second sides are configured so as to flex generally towards the substrate when a sufficient load is applied to the corresponding first and second contact faces as the corresponding first or second electrically-conductive surface is slidably moved relative to the substrate in contact with the corresponding first and second contact faces.
16. The EMI shielding/electrical grounding member of claim 1 , wherein the EMI shielding/electrical grounding member is installed on and in electrical contact with a substrate generally between first and second blade servers that respectively define the first and second electrically-conductive surfaces such that the first and second electrically-conductive surfaces are parallel to the substrate, and wherein the EMI shielding/electrical grounding member provides electrical conductivity between the substrate and first and second electrically-conductive surfaces of the respective first and second blade servers.
17. The EMI shielding/electrical grounding member of claim 3 , wherein the one or more resiliently flexible finger elements are resiliently flexible such that the one or more resiliently flexible finger elements flex generally inwardly towards the substrate when contacted by another surface bearing against the one or more resiliently flexible finger elements with a force having a component generally perpendicular to a longitudinal axis of the EMI shielding/electrical grounding member.
18. The EMI shielding/electrical grounding member of claim 1 , wherein the first and second sides include:
a first slanted portion;
a generally flat portion extending from the first slanted portion such that an obtuse angle is defined generally between the first slanted portion and the generally flat portion; and
a second slanted portion extending generally from the generally flat portion such that an obtuse angle is defined generally between the second slanted portion and the generally flat portion.
19. The EMI shielding/electrical grounding member of claim 18 , wherein the first slanted portions are operable as camming surfaces such that contact therewith by the corresponding first or second electrically-conductive surface causes the corresponding first or second side to compressively move generally inwardly towards the substrate.
20. The EMI shielding/electrical grounding member of claim 1 , wherein the EMI shielding/electrical grounding member comprises a resilient flexible electrically-conductive material.
21. The EMI shielding/electrical grounding member of claim 1 , wherein the EMI shielding/electrical grounding member is made entirely from a single blank of material.
22. An EMI shielding/electrical grounding member configured to be installed to a substrate for interposition generally between first and second electrically-conductive surfaces, for establishing electrical grounding contact from the substrate to the first and second electrically-conductive surfaces, the EMI shielding/electrical grounding member comprising:
a generally longitudinally extending region;
one or more slots extending generally transversely along the generally longitudinally extending region; and
first and second resiliently flexible finger elements each including at least a portion defined by the slots along respective first and second sides of the EMI shielding/electrical grounding member such that the first and second resiliently flexible finger elements are relatively independently operable and freely compressible upon contact with the respective first and second electrically-conductive surfaces, regardless of whether the other of said first and second resiliently flexible finger elements is in contact with the corresponding first or second electrically-conductive surface;
at least one channel within an interior space generally between the first and second resiliently flexible finger elements, the channel extending generally longitudinally along at least a portion of the generally longitudinally extending region, the channel configured to engagingly receive an edge portion of the substrate;
whereby contact between the first resiliently flexible finger element and the first electrically-conductive surface may apply sufficient pressure for causing the first resiliently flexible finger element to compressively flex generally inwardly towards the substrate, against a force resiliently biasing the first resiliently flexible finger element in a generally outward direction from the substrate towards the first electrically-conductive surface; and
whereby contact between the second resiliently flexible finger element and the second electrically-conductive surface may apply sufficient pressure for causing the second resiliently flexible finger element to compressively flex generally inwardly towards the substrate, against a force resiliently biasing the second resiliently flexible finger element in a generally outward direction from the substrate towards the second electrically-conductive surface.
23. The EMI shielding/electrical grounding member of claim 22 , wherein the one or more slots comprise a plurality of slots extending generally transversely along the generally longitudinally extending region such that the first resiliently flexible finger element comprises a plurality of resiliently flexible finger elements along the first side, and such that the second resiliently flexible finger element comprises a plurality of resiliently flexible finger elements along the second side.
24. The EMI shielding/electrical grounding member of claim 22 , wherein the first and second resiliently flexible finger elements include:
a first slanted portion;
a generally flat portion extending from the first slanted portion such that an obtuse angle is defined generally between the first slanted portion and the generally flat portion; and
a second slanted portion extending generally from the generally flat portion such that an obtuse angle is defined generally between the second slanted portion and the generally flat portion.
25. A method for establishing electrical grounding contact from a substrate to first and second electrically-conductive surfaces, the method comprising:
installing an EMI shielding/electrical grounding member to the substrate such that generally opposing first and second sides of the EMI shielding/electrical grounding member are positioned for making electrical grounding contact with the respective first and second electrically-conductive surfaces and such that an edge portion of the substrate is received within at least one channel of the EMI shielding/electrical grounding member whereby electrical contact is established between the EMI shielding/electrical grounding member and the substrate, the first and second sides of the EMI shielding/electrical grounding member being hingedly connected and having respective first and second contact faces configured such that the first and second contact faces are each relatively independently operable and freely compressible upon contact with the respective first and second electrically-conductive surfaces, regardless of whether the other of said first and second contact faces is in contact with the corresponding first or second electrically-conductive surface.
26. The method of claim 25 , wherein the EMI shielding/electrical grounding member is installed on and in electrical contact with the substrate generally between first and second blade servers that respectively define the first and second electrically-conductive surfaces such that the first and second electrically-conductive surfaces are parallel to the substrate, and wherein the EMI shielding/electrical grounding member provides electrical conductivity between the substrate and first and second electrically-conductive surfaces of the respective first and second blade servers.
27. The method of claim 26 , further comprising sliding the first blade server relative to the substrate such that the electrically-conductive surface of the first blade server electrically contacts the first side of the EMI shielding/electrical grounding member, thereby establishing electrical grounding contact from the substrate to the first blade server.
28. The method of claim 27 , wherein:
the first side is caused to compressively flex generally inwardly towards the substrate by pressure applied by sliding of the first blade server in a first direction; and
the first side is allowed to flex outwardly away from the substrate upon removal of the pressure applied by the first blade server when slidably moved relative to the substrate in a second direction opposite the first direction.