IP Library Granted Patent US 11,718,728
Granted Patent B2
US 11,718,728 · App. 17/088,249 · Granted Aug 8, 2023

Single layer polymer films and electronic devices

Inventors: Laila Maclaughlin (Stoutsville, OH); Husnu Alp Alidedeoglu (New Albany, OH); Christopher Robert Becks (Grove City, OH); Thomas Edward Carney (Orient, OH); Scott John Herrmann (Gahanna, OH); Joseph Casey Johnson (Pickerington, OH)
Assignee: DUPONT ELECTRONICS, INC.
C08K3/04C08G73/1067C08K3/36C08K5/01C08K2201/005
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Quick Facts
Patent No.
US 11,718,728
App. No.
17/088,249
Granted
Aug 8, 2023
Kind
B2
Abstract

In one aspect, a single layer polymer film includes 25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less, 0.5 to 20 wt % of a matting agent and 1 to 30 wt % of a black colorant. On an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less. In another aspect, a single layer polymer film includes 80 to 99 wt % of a polyimide having a refractive index of 1.74 or less and 1 to 30 wt % of a black colorant. A surface of the single layer polymer film has been textured and has a maximum roughness (S pv ) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.

Claims (29)

1. A single layer polymer film comprising:

25 to 97.5 wt % of a polyimide having a refractive index of 1.74 or less;

0.5 to 20 wt % of a matting agent; and

1 to 30 wt % of a black colorant, wherein:

the wt % of each component is based on the total weight of the film; and

on an air side, the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less.

2. The single layer polymer film of claim 1 , further comprising 50 wt % or less of a submicron particle selected from the group consisting of submicron fumed metal oxides, submicron colloidal metal oxides and mixtures thereof.

3. The single layer polymer film of claim 1 , wherein the polyimide comprises a dianhydride selected from the group consisting of aromatic dianhydrides, aliphatic dianhydrides and mixtures thereof.

4. The single layer polymer film of claim 1 , wherein the polyimide comprises a fluorinated dianhydride.

5. The single layer polymer film of claim 1 , wherein the polyimide comprises a diamine selected from the group consisting of aromatic diamines, aliphatic diamines and mixtures thereof.

6. The single layer polymer film of claim 1 , wherein the polyimide comprises a fluorinated diamine.

7. The single layer polymer film of claim 1 , wherein the matting agent is selected from the group consisting of silica, alumina, zirconia, boron nitride, barium sulfate, polyimide particles, calcium phosphate, talc and mixtures thereof.

8. The single layer polymer film of claim 1 , wherein the single layer polymer film has a thickness in the range of from 4 to 125 μm.

9. The single layer polymer film of claim 1 , wherein the polyimide has a refractive index of 1.69 or less.

10. The single layer polymer film of claim 1 , wherein the single layer polymer film has an L* color of 33 or less and a 60° gloss of 10 or less on both sides.

11. A coverlay for a printed circuit board comprising the single layer polymer film of claim 1 .

12. A single layer polymer film comprising:

80 to 99 wt % of a polyimide having a refractive index of 1.74 or less; and

1 to 30 wt % of a black colorant, wherein:

the wt % of each component is based on the total weight of the film; and

a surface of the single layer polymer film has been textured and has a maximum roughness (S pv ) of 7 μm or more, an L* of 33 or less and a 60° gloss of 10 or less.

13. The single layer polymer film of claim 12 , wherein the texturing is provided by abrasive-blasting.

14. The single layer polymer film of claim 12 further comprising 20 wt % or less of a submicron particle selected from the group consisting of submicron fumed metal oxides, submicron colloidal metal oxides and mixtures thereof.

15. The single layer polymer film of claim 12 , wherein the polyimide comprises a dianhydride selected from the group consisting of aromatic dianhydrides, aliphatic dianhydrides and mixtures thereof.

16. The single layer polymer film of claim 12 , wherein the polyimide comprises a fluorinated dianhydride.

17. The single layer polymer film of claim 12 , wherein the polyimide comprises a diamine selected from the group consisting of aromatic diamines, aliphatic diamines and mixtures thereof.

18. The single layer polymer film of claim 12 , wherein the polyimide comprises a fluorinated diamine.

19. The single layer polymer film of claim 12 , wherein the single layer polymer film has a thickness in the range of from 4 to 125 μm.

20. A coverlay for a printed circuit board comprising the single layer polymer film of claim 12 .

Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 7, 2021
From: MACLAUGHLIN, LAILA; ALIDEDEOGLU, HUSNU ALP; BECKS, CHRISTOPHER ROBERT; CARNEY, THOMAS EDWARD; HERRMANN, SCOTT JOHN; JOHNSON, JOSEPH CASEY
To: DUPONT ELECTRONICS
Reel/Frame 057732/0031 →