Curable composition comprising a di-isoimide, method of curing, and the cured composition so formed
View Patent ↗The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.
1. A curable composition comprising a solvent having mixed therewithin an epoxy and a di-isoimide composition represented by Structure I
wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.
2. The curable composition of claim 1 wherein R 1 is NH 2 .
3. The curable composition of claim 1 wherein the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof.
4. The curable composition of claim 1 wherein the epoxy is an oligomer having 1 to 5 repeat units.
5. The curable composition of claim 1 wherein the epoxy is a bisphenol A diglycidyl ether.
6. The curable composition of claim 1 wherein R 1 is NH 2 ; the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy is a bisphenol A diglycidyl ether.
7. The curable composition of claim 1 further comprising an elastomer or thermoplastic polymer.
8. The curable composition of claim 6 further comprising an elastomer or thermoplastic polymer.
9. A curable composition consisting essentially of a solvent having mixed therewithin an epoxy and a di-isoimide composition represented by Structure I
wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.
10. The curable composition of claim 9 wherein R 1 is NH 2 ; the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy is a bisphenol A diglycidyl ether.
11. A curable composition consisting essentially of a solvent having mixed therewithin an epoxy, an elastomer or thermoplastic polymer, and a di-isoimide composition represented by Structure I
wherein R 1 is H, halogen, hydrocarbyl, hydrocarbyloxy, hydrocarbylthio, amido, sulfonamido, cyclic amino, acyl, morpholino, piperidino, or NR′R″ where R′ and R″ are independently H, alkyl or aromatic, substituted or unsubstituted.
12. The curable composition of claim 11 wherein R 1 is NH 2 ; the solvent is methyl ethyl ketone, cyclohexanone, propylene glycol methyl ether acetate, N,N-dimethylformamide, or a mixture thereof; and, the epoxy is a bisphenol A diglycidyl ether.
13. A process comprising heating the curable composition of claim 1 to a temperature in the range of 100 to 250° C. for a period of time in the range of 30 seconds to 5 hours, thereby forming the corresponding cured composition.