Thermal substrates
A thermal substrate includes a multilayer film, a first conductive layer adhered to the first outer layer of the multilayer film and a second conductive layer adhered to the second outer layer of the multilayer film. The multilayer film includes a first outer layer including a first thermoplastic polyimide, a core layer including a polyimide and a second outer layer including a second thermoplastic polyimide. The multilayer film has a total thickness in a range of from 5 to 150 μm, and the first outer layer, the core layer and the second outer layer each include a thermally conductive filler. The first conductive layer and the second conductive layer each have a thickness in a range of from 250 to 3000 μm.
1 . A thermal substrate comprising:
a multilayer film comprising:
a first outer layer comprising a first thermoplastic polyimide;
a core layer comprising a polyimide; and
a second outer layer comprising a second thermoplastic polyimide, wherein:
the thicknesses of the first and second outer layers are each in a range of from 3 to 6 μm; wherein a glass transition temperature (T g ) of the core layer is higher than both a T g of the first outer layer and a T g of the second outer layer;
the multilayer film has a total thickness in a range of from 15 to 100 μm; and
the first outer layer, the core layer and the second outer layer each comprise a thermally conductive filler; wherein the thermally conductive filler of each of the first outer layer, the core layer and the second outer layer are individually selected from the group consisting of BN, Al 2 O 3 , AlN, SiC, BeO, diamond, Si 3 N 4 and mixtures thereof;
a first conductive layer adhered to the first outer layer of the multilayer film; and
a second conductive layer adhered to the second outer layer of the multilayer film, wherein the first conductive layer and the second conductive layer each comprise a metal sheet and have a thickness in a range of from 250 to 3000 μm.
2 . The thermal substrate of claim 1 , wherein:
the thermally conductive filler of the first outer layer is present in an amount of from greater than 0 to 50 wt % based on the weight of the dry first outer layer;
the thermally conductive filler of the core layer is present in an amount of from greater than 0 to 60 wt % based on the weight of the dry core layer; and
the thermally conductive filler of the second outer layer is present in an amount of from greater than 0 to 50 wt % based on the weight of the dry second outer layer.
3 . The thermal substrate of claim 1 , wherein a weight percentage of thermally conductive filler in the core layer is higher than that of the first outer layer, the second outer layer, or both the first and second outer layers, based on the dry weight of each layer.
4 . The thermal substrate of claim 1 , wherein the first thermoplastic polyimide comprises:
an aromatic dianhydride selected from the group consisting of 4,4′-oxydiphthalic dianhydride, pyromellitic dianhydride, 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and mixtures thereof; and
an aromatic diamine selected from the group consisting of 1,3-bis(4-aminophenoxy) benzene, 2,2-bis-(4-[4-aminophenoxy]phenyl) propane and mixtures thereof.
5 . The thermal substrate of claim 1 , wherein the second thermoplastic polyimide comprises:
an aromatic dianhydride selected from the group consisting of 4,4′-oxydiphthalic dianhydride, pyromellitic dianhydride, 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride and mixtures thereof; and
an aromatic diamine selected from the group consisting of 1,3-bis(4-aminophenoxy) benzene, hexamethylene diamine and mixtures thereof.
6 . The thermal substrate of claim 1 , wherein the first thermoplastic polyimide and second thermoplastic polyimide are the same.
7 . The thermal substrate of claim 1 , wherein the polyimide of the core layer comprises:
an aromatic dianhydride selected from the group consisting of 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 4,4′-oxydiphthalic dianhydride, pyromellitic dianhydride, 3,3′,4,4′-benzophenone tetracarboxylic dianhydride, bisphenol A dianhydride, 1,2,5,6-naphthalene tetracarboxylic dianhydride, 1,4,5,8-naphthalene tetracarboxylic dianhydride, and 2,3,6,7-naphthalene tetracarboxylic dianhydride and mixtures thereof; and
an aromatic diamine selected from the group consisting of p-phenylenediamine, 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 2,2′-bis(trifluoromethyl) benzidine, m-phenylenediamine and 4,4′-diaminodiphenylmethane and mixtures thereof.
8 . The thermal substrate of claim 1 , wherein the first thermoplastic polyimide and the second thermoplastic polyimide each have a T g in the range of from 150 to 320° C.
9 . The thermal substrate of claim 1 , wherein the thermal substrate operates at temperatures of up to 200° C.
10 . The thermal substrate of claim 1 , wherein the polyimides of the outer layers and the core layer have a loss-tangent value of less than 0.010 at 10 GHz.