POLISHING PAD WITH THERMAL MANAGEMENT FEATURES
A polishing pad for chemical mechanical polishing comprises a polishing layer and an adjacent subpad layer. The polishing layer includes a polishing surface, a polishing layer interface surface opposite the polishing surface, a polishing layer thickness extending from the polishing surface to the polishing layer interface surface, and recesses extending from the polishing layer surface toward the polishing layer interface surface. A depth of the recesses is at least 80% the polishing layer thickness. The subpad layer has a subpad interface surface adjacent to the polishing layer interface surface and a bottom surface opposite the subpad interface surface. The subpad layer has a thermal conductivity of 1 to 35 Watts/m-K. The combination of the deep grooves in the top layer and the thermal conductivity of the subpad layer can facilitate thermal management at the polishing interface during polishing of a substrate.
1 . A polishing pad for chemical mechanical polishing comprising:
a polishing layer having a polishing surface, a polishing layer interface surface opposite the polishing surface, a polishing layer thickness extending from the polishing surface to the polishing layer interface surface, and recesses extending from the polishing layer surface toward the polishing layer interface surface, wherein a depth of the recesses is at least 80% the polishing layer thickness,
a subpad layer having a subpad interface surface adjacent to the polishing layer interface surface and a bottom surface opposite the subpad interface surface, the subpad layer comprising a subpad material,
wherein the subpad layer has a thermal conductivity of 1 to 35 Watts/m-K.
2 . The polishing pad of claim 1 wherein the recesses extend to the polishing layer interface surface.
3 . The polishing pad of claim 1 wherein the recesses expose the subpad interface surface.
4 . The polishing pad of claim 1 wherein the subpad layer has a consistent thermal conductivity throughout the subpad material.
5 . The polishing pad of claim 1 wherein the subpad material comprises boron nitride particles in a polymeric matrix material.
6 . The polishing pad of claim 5 wherein the boron nitride particles are present in an amount of 40 to 90 weight percent based on total weight of the boron nitride and the polymeric matrix material.
7 . The polishing pad of claim 5 wherein the polymeric matrix material comprises a silicone composition.
8 . The polishing pad of claim 7 wherein the silicone composition comprises 2 to 80 weight percent silicone adhesive and 20 to 98 weight percent silicone rubber based on total weight of the silicone composition.
9 . The polishing pad of claim 4 wherein the subpad material is provided on a woven or non-woven material scaffold.
10 . A method of polishing comprising
providing a substrate to be polished
providing the polishing pad as in claim 1 on a platen
providing a slurry on the polishing pad,
polishing by moving the substrate relative to the polishing pad, wherein the platen includes thermal control features.