Metal-clad polymer films and electronic devices

1. A metal-clad polymer film comprising a polymer film adhered to a first metal layer, wherein:

the polymer film comprises a first thermoplastic polyimide layer, wherein the first thermoplastic polyimide layer is derived from at least three monomers comprising:

a first dianhydride having ether functionality;

70 to 99.9 mol % of a first diamine selected from 1,3-bis(4-aminophenoxy)benzene and 1,3-bis(3-aminophenoxy)benzene; and

0.1 to 30 mol % of a second diamine having hydrogen bonding;

the root-mean-square roughness (S q ) of the interface between the polymer film and the first metal layer is less than 0.1 μm;

the peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods; and

the thickness of the first metal layer is 12 μm or less.

2. The metal-clad polymer film of claim 1 , wherein the first dianhydride is selected from the group consisting of 4,4′-oxydiphthalic anhydride (ODPA), 3,3′,4,4′-biphenyl tetracarboxylic dianhydride (BPDA), 2,3′,3,4′-biphenyl tetracarboxylic dianhydride (a-BPDA), 2,2′,3,3′-biphenyl tetracarboxylic dianhydride (i-BPDA), 4,4′-(3,4-dicarboxyphenoxy)diphenylsulfide dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride (HQDA), 1,3-bis(2,3-dicarboxyphenoxy)benzene dianhydride, 2,2′, 3,3′-oxydiphthalic anhydride, 4,4′-bis(3,4-dicarboxyl-phenoxy)benzidine dianhydride and 4,4′-bis(3,4-dicarboxyl-phenoxyphenyl)ether dianhydride.

3. The metal-clad polymer film of claim 1 , wherein the first thermoplastic polyimide layer comprises 50 to 99.9 mol % of the first dianhydride and further comprises 0.01 to 50 mol % of a second dianhydride having ketone functionality.

4. The metal-clad polymer film of claim 3 , wherein the second dianhydride is selected from the group consisting of 3,3′, 4,4′-benzophenone tetracarboxylic dianhydride (BTDA) and 2,3′, 3,4′-benzophenone tetracarboxylic dianhydride.

5. The metal-clad polymer film of claim 1 , wherein the second diamine is selected from the group consisting of 4,4′-diaminobenzanilide (DABA), 2-(4-aminophenyl)-5-aminobenzimidazole (DAPBI), 2-(3-aminophenyl)-5-aminobenzimidazole, and 2,6-bis(5-am inophenoxy)pyridine.

6. The metal-clad polymer film of claim 1 further comprising a second metal layer adhered to the polymer film on a side opposite the first metal layer.

7. The metal-clad polymer film of claim 1 , wherein the polymer film further comprises a first thermoset polyimide layer in contact with the first thermoplastic polyimide layer on a side opposite the first metal layer.

8. The metal-clad polymer film of claim 7 , wherein the polymer film further comprises a second thermoplastic polyimide layer in contact with the first thermoset polyimide layer on a side opposite the first thermoplastic polyimide layer.

9. The metal-clad polymer film of claim 8 further comprising a second metal layer in contact with the second thermoplastic polyimide layer of the polymer film.

10. The metal-clad polymer film of claim 8 , wherein the polymer film further comprises:

a second thermoset polyimide layer in contact with the second thermoplastic polyimide layer on a side opposite the first thermoset polyimide layer;

a third thermoplastic polyimide layer in contact with the second thermoset polyimide layer on a side opposite the second thermoplastic polyimide layer; and

a second metal layer in contact with the third thermoplastic polyimide layer on a side opposite the second thermoset polyimide layer.

11. The metal-clad polymer film of claim 10 , wherein:

the third thermoplastic polyimide layer is derived from at least three monomers comprising:

a second dianhydride having ether functionality;

70 to 99.9 mol % of a third diamine selected from 1,3-bis(4-aminophenoxy)benzene and 1,3-bis(3-aminophenoxy)benzene; and

0.1 to 30 mol % of a fourth diamine having hydrogen bonding;

the root-mean-square roughness (S q ) of the interface between the polymer film and the second metal layer is less than 1 μm;

the peel strength between the polymer film and the second metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness of in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm, in accordance with IPC-TM-650 test methods; and

the thickness of the second metal layer is less than 12 μm.

12. The metal-clad polymer film of claim 10 , wherein the polymer film further comprises a fourth thermoplastic polyimide layer in between the second thermoplastic polyimide layer and the second thermoset polyimide layer.

13. An electronic device comprising the metal-clad polymer film of claim 1 .

14. A metal-clad polymer film comprising a polymer film adhered to a first metal layer, wherein:

the polymer film comprises a first thermoplastic polyimide layer, wherein the first thermoplastic polyimide layer is derived from at least three monomers comprising:

a first dianhydride having ether functionality;

70 to 99.9 mol % of a first diamine selected from 1,3-bis(4-aminophenoxy)benzene and 1,3-bis(3-aminophenoxy)benzene; and

0.1 to 30 mol % of a second diamine having hydrogen bonding;

the root-mean-square roughness (S q ) of the interface between the polymer film and the first metal layer is less than 1 μm;

the peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods;

the thickness of the first metal layer is 12 μm or less; and

the surface of the polymer film adhered to the first metal layer is not surface treated.