IP Library › Granted Patent US 12,716,144
Granted Patent B2
US 12,716,144 · App. 18/592,717 · Granted Aug 25, 2026

Ultrathin copper foil, a method for manufacturing the same, and an article made therefrom

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Quick Facts
Patent No.
US 12,716,144
App. No.
18/592,717
Granted
Aug 25, 2026
Kind
B2
Assignments (3)
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 073515/0243 →
SECURITY INTEREST Recorded Nov 3, 2025
From: QNITY ELECTRONICS, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 073517/0298 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2024
From: LIN, SHIH-CHING; LIN, YA-MEI
To: DUPONT ELECTRONICS, INC.
Reel/Frame 067610/0525 →
Continuity (2)
Provisional Application 63487960 · Mar 2, 2023
Related Publication 20240417877A1 · Dec 19, 2024
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