Bendable circuit board for LED mounting and interconnection

1. A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle, comprising:

A. providing a bendable laminate circuit structure, the bendable laminate circuit structure having at least the following laminated layers:

a. a continuous aluminum metal layer of about 0.2 mm to about 2 mm in thickness;

b. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and

c. a copper foil layer directly contacting a second surface of the polyimide composite layer; and

B. bending the laminated layers 90° or more, such that after bending the laminated layers of the bendable circuit structure for mounting LED mounting has an increase in electrical resistance of less than 10%.

2. The method of claim 1 wherein the providing step includes providing a laminate wherein the copper layer is about 35 um thick, the polyimide layer is about 12 um thick and the aluminum layer is about 200 um to 247 um thick.

3. The method of claim 1 wherein the providing step includes providing a continuous aluminum metal layer that is about 0.4 mm to about 2 mm in thickness.

4. The method of claim 1 , wherein the bendable laminate structure has a thickness to about 3 millimeters.

5. The method of claim 1 , where the copper foil layer is a circuitized layer.

6. The method of claim 1 , wherein the providing step includes providing the polyimide composite layer which is about 12 um thick.

7. The method of claim 1 , wherein the providing step includes providing a copper foil layer that consists essentially of copper foil layer, and an optional solder mask layer.

8. The method of claim 1 , wherein the providing step includes providing a continuous aluminum layer that is anodized.

9. The method of claim 1 , wherein the continuous aluminum layer is Alloy 5005.

10. A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle, comprising:

A. providing a bendable, laminated circuit structure, the bendable, laminated circuit structure having:

a. a continuous aluminum metal layer of about 0.2 mm to about 2 mm in thickness;

b. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and

c. a copper layer directly contacting a second surface of the polyimide composite layer, the copper layer consists essentially of a copper foil layer with a solder mask layer; and

bending the laminated circuit structure 90° or more, such that after bending the laminated circuit structure, the structure for LED mounting has an increase in electrical resistance of less than 10%.

11. The method of claim 10 , wherein the copper layer is a circuitized layer.

12. The method of claim 10 , wherein the providing step includes providing the polyimide composite layer that is about 12 um thick.

13. A method of manufacturing a laminated structure for mounting light emitting diodes (“LED”) to a 90° or greater configured angle, comprising:

A. providing a bendable laminated circuit structure, the bendable laminated circuit structure having at least the following laminated layers:

a. a continuous aluminum metal layer of about 0.2 mm to about 2 mm in thickness;

b. a polyimide composite layer having a first surface directly contacting the first surface of the aluminum metal layer; and

c. a copper layer directly contacting a second surface of the polyimide composite layer, the copper layer consists of a copper foil layer and a solder mask layer; and

B. bending the laminated circuit structure 90° or more, such that after bending the laminated layers the bendable circuit structure for mounting LED mounting has an increase electrical resistance of less than 10%.

14. The method of claim 10 , wherein the continuous aluminum metal layer is about 0.4 mm to about 2 mm in thickness.

15. The method of claim 13 , wherein the continuous aluminum metal layer is about 0.4 mm to about 2 mm in thickness.

16. The method of claim 10 , wherein the bendable laminate structure has a thickness to about 3 millimeters.

17. The method of claim 13 , wherein the bendable laminated structure has a thickness to about 3 millimeters.

18. The method of claim 10 wherein the providing step includes providing a polyimide composite layer that is about 12 um thick.